Intel Foundry is seeking experienced Thin Films Metals Module Development Engineers to join the Technology Development organization. The role will be defined by developing and delivering metals modules for advanced semiconductor technologies, leveraging a combination of in-depth hardware knowledge and process expertise to deliver modules that fulfill program process needs within the hardware capabilities.
This is a hands-on technical role for results-oriented engineers who can formulate concise technical problem statements, establish a roadmap and timeline, lead with data and partner with stakeholders to deliver on-time results.
Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications:
- Bachelor's degree in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related STEM fields with 6+ years of experience
OR
- Master's degree in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related STEM fields with 4+ years of experience
OR
- Ph.D. in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related STEM fields with 2+ years of experience
Experience in semiconductor manufacturing or process development includes one or more of the following:
- Expertise in process optimization, defect reduction, and manufacturing process improvements for advanced technology nodes
- Proficiency in Design of Experiments (DOE), Statistical Process Control (SPC), and structured problem-solving methodologies
- Hands-on expertise in dry etch processes, material science, and equipment metrology
- Technical experience with semiconductor manufacturing equipment and collaboration with suppliers to optimize hardware and materials
Preferred Qualifications:
- Doctoral degree in a relevant engineering or science field
- Experience with sub-10nm technology nodes and advanced device architectures like FinFET or Gate-All-Around (GAA)
- Proven record of delivering process solutions in Technology Development (TD) and High Volume Manufacturing (HVM)
- Cross-functional leadership experience for yield improvement, defect reduction, or technology ramp initiatives
- Experience mentoring engineers and providing technical guidance
- Strong ownership mindset with the ability to lead initiatives from concept through implementation
For information on Intel’s immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information
Job Type:Experienced HireShift:Shift 1 (United States of America)Primary Location: US, Oregon, HillsboroAdditional Locations:Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $155,520.00-255,200.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.Skills Required
- Bachelor's degree in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or a related STEM field, plus 6 or more years of experience
- Master's degree in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or a related STEM field, plus 4 or more years of experience
- Ph.D. in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or a related STEM field, plus 2 or more years of experience
- Experience in semiconductor manufacturing or process development
- Expertise in process optimization, defect reduction, and manufacturing process improvements for advanced technology nodes
- Proficiency in Design of Experiments, Statistical Process Control, and structured problem-solving methodologies
- Hands-on expertise in dry etch processes, material science, and equipment metrology
- Technical experience with semiconductor manufacturing equipment and supplier collaboration
- Doctoral degree in a relevant engineering or science field
- Experience with sub-10nm technology nodes and FinFET or Gate-All-Around device architectures
- Record of delivering process solutions in Technology Development and High Volume Manufacturing
- Cross-functional leadership experience in yield improvement, defect reduction, or technology ramp initiatives
- Experience mentoring engineers and providing technical guidance
- Ability to lead initiatives from concept through implementation
Intel Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Intel and has not been reviewed or approved by Intel.
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Leave & Time Off Breadth — Sabbaticals and paid time off are highlighted as signature elements, with an established program offering four weeks after four years or eight weeks after seven years. This distinctive time off is positioned as a meaningful part of the overall package.
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Parental & Family Support — Paid bonding leave of 12 weeks and a New Parent Reintegration program, plus fertility benefits around $40,000 and up to $15,000 adoption reimbursement with no lifetime cap, are clearly stated. These programs are presented as standout components alongside broader family support resources.
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Healthcare Strength — Multiple medical plan options with 2026 updates, a shift to Spring Health for EAP, and in‑network virtual medical visits covered at 100% beginning in 2026 indicate a comprehensive offering. These features signal an emphasis on robust medical access and mental health support.
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