SubCon Integration Engineer

Company Description

Join a multibillion-dollar global company that brings together amazing technology, people, and operational scale to become a powerhouse in the memory industry. Headquartered in Rancho Cordova, California, Solidigm combines elements of an established, successful technology company with the spirit, agility, and entrepreneurial mindset of a start-up. In addition to the U.S. headquarters and other facilities in the U.S., the company has international presence in Asia, Europe, and the Americas. Solidigm will continue to lead the world in innovating new Memory technologies with aspirations to be the #1 NAND memory company in the world. At Solidigm, we view problems as opportunities to define innovative solutions that hold the power to change the world and unleash the potential technological needs that the future holds. At Solidigm, we are One Team that fosters a diverse, equitable, and inclusive culture that embraces individual uniqueness and empowers us to bring our best selves to deliver excellence in support of Solidigm's vision and mission to be the go-to partner for optimized data storage solutions. You can be part of the takeoff of an innovative business that develops cutting-edge products, delivers strong business value for customers, provides an engaging workplace for its employees, and serves a greater impact on the world. This is a golden opportunity for the right applicant to join us and help design, build, and lead Solidigm. We want a diverse team of dedicated professionals who will not just be Solidigm team members but contribute to how we shape the future of the organization. We are seeking applicants who will grow and thrive in our culture; be customer inspired, trusting, innovative, team-oriented, inclusive, results driven, collaborative, passionate, and flexible.

Job Description

Solidigm is seeking an innovative Package SubCon Integration Engineer to support pathfinding and development of package technologies for Solid State Drive (SSD) and NAND flash storage card applications. In this position, you will be responsible for innovation in packaging technologies to meet SSD product roadmap. In addition, you will be responsible for interfacing with internal/external standards forums. Other responsibilities include driving/tracking package design milestones, integrating product requirements into packaging solutions, identifying and resolving packaging design issues, and communication of design status.

• Help to support logistics at OSAT Assembly and TEST.
• Drive integration work with internal stakeholders and OSATs.
• Manage New Product Introduction (NPI) builds in alignment with OSATs and suppliers.
• Data analysis and drive recommendations to improve quality and reliability.
• Recommend Substrate stack-ups, Build Of Material (BOM) selection.
• Solder Joint Reliability (SJR) board builds.

Qualifications

• BS Mechanical, Electrical or other Engineering discipline
• 7-10 years of experience in semiconductor package development
• Experience in using AutoCAD and Cadence suite (APD, Editor, SIP)
• Schematic entry and simulation are an advantage
• Able to engage in root cause analysis, design of experiments, and data analysis
• Excellent communication skills to work effectively across different geographies

Preferred Qualifications

• Solid understanding of package substrate design practices from a signal integrity perspective.
• Working knowledge of HSPICE, Ansoft Q2D/Q3D and/or any other field solver tools.
• Working knowledge of high-speed design signal integrity and power delivery practices; experience with high-speed DDR package design is a highly desirable.
• Knowledge of electrical analysis and design of high-speed buses (differential and single ended) as well as familiarity with simulation, modeling, and analysis tools.
• Knowledge of Printed Circuit Board (PCB) assembly processes and package to board interconnects
• Knowledge of flip chip packaging
• Good understanding of transmission-line effects, crosstalk, frequency domain analysis, termination techniques, signal return paths, design of experiment and statistical analysis.
• Demonstrated skills in program management, communication, teamwork, planning, and prioritization.