Jobs at Solidigm

Designs and executes NAND memory cell and array characterization experiments, develops production trims, analyzes performance and reliability data, builds predictive models, and improves test yields. The role applies NAND device physics and statistical analysis while collaborating with device, design, reliability, product, test, and wafer fabrication teams. Responsibilities include driving wafer-level reliability experiments, tracking degradation, communicating parameter trade-offs, and releasing optimized trims for high-volume manufacturing.

Supports the Innovation PMO by developing processes to evaluate engineering work for publications, white papers, patents, and other intellectual property. Responsibilities include researching emerging technologies, defining classification criteria, documenting procedures, analyzing internal research, supporting innovation intake and review processes, and collaborating with engineering, research, operations, and business stakeholders.

Supports account managers and field applications engineers by coordinating customer needs, account priorities, follow-ups, forecasts, opportunity tracking, and internal execution. Maintains CRM records, account plans, customer action logs, and revenue reporting while collaborating cross-functionally to resolve issues and support strategic technology accounts. This commissioned, entry-level role develops commercial and technical knowledge in semiconductors, SSDs, cloud infrastructure, and enterprise storage.

Deliver global NAND test tooling hardware solutions for wafer and package testing. Collaborate with customers and distributed product development teams to identify hardware requirements, meet development schedules, and support sustainability and evolving NAND roadmap needs. The role requires developing and delivering semiconductor tooling hardware using mechanical or electrical engineering expertise and CAD/PCB design applications.

Lead 3D NAND process integration and technology qualification for next-generation semiconductor products. Define process flows and specifications, resolve process issues using model-based analysis, apply statistical tools to improve performance, reliability, and yield, and transfer technologies into high-volume manufacturing. Collaborate with device, product engineering, design, manufacturing, reliability, and quality teams while leading multidisciplinary development efforts.

Supports account managers and field applications engineers by managing customer priorities, account plans, opportunity tracking, CRM records, forecasts, business reviews, and follow-ups. Coordinates with sales, engineering, operations, and planning teams to resolve customer issues and deliver commitments. Develops commercial and technical knowledge of semiconductor, SSD, cloud infrastructure, and enterprise storage markets while contributing to pipeline growth and customer relationships.

Lead architecture and development of embedded firmware for next-generation SSDs. Responsibilities include defining product architectures, translating customer requirements, developing and reviewing C/C++ firmware, testing and debugging, and collaborating with ASIC, hardware, validation, manufacturing, and product engineering teams. The role requires technical leadership across SSD architecture, NAND flash management, storage interfaces, firmware roadmaps, development processes, and customer-driven solutions.

Lead architecture and development of embedded SSD firmware for next-generation storage products. Responsibilities include defining system architectures, translating customer requirements into features, coding in C/C++, testing and debugging, coordinating ASIC, hardware, validation, manufacturing, and firmware teams, and guiding technology roadmaps. The role requires expertise in NAND flash management, SSD firmware technologies, enterprise storage interfaces, firmware security, lifecycle processes, and technical leadership across multiple engineering teams.

Defines, integrates, qualifies, and transfers advanced 3D NAND process technologies from early development through high-volume manufacturing. The role develops process flows, equipment configurations, materials, experiments, controls, and optimization strategies, focusing on staircase formation, multilayer stacks, and high-aspect-ratio etch/fill processes. Responsibilities include improving yield, reliability, cost, productivity, and manufacturability; resolving complex integration issues; training engineers; and supporting factory startup and production-line qualification.

Design and verify logic and circuit blocks for 3D NAND flash memory. Responsibilities include RTL implementation in SystemVerilog, synthesis, timing analysis, ECOs, verification, microcode algorithm development, architecture optimization, DFT, power and performance modeling, and pre- and post-silicon debug across digital, analog, and mixed-signal systems.

Qualifies Solid State Drives and components, develops qualification infrastructure, establishes quality metrics, and applies data-driven methods to predict and prevent defects. The role develops reliability models, executes experimental designs, and creates production monitoring and screening schemes to ensure stable processes and performance throughout product life cycles. It also requires programming, statistical analysis, semiconductor knowledge, and onsite collaboration with interdisciplinary teams.

Conduct NAND memory cell and array reliability characterization, data analysis, predictive modeling, and reliability risk assessments for next-generation 3D NAND products. Develop accelerated test methods, analytical tools, and reliability roadmaps; establish component-level requirements; support SSD algorithms and policies; and ensure successful technology and product qualification in collaboration with cross-functional teams.

Software development engineering interns will design, develop, test, and maintain software tools, applications, backend systems, scripts, and automation supporting engineering workflows and data center SSD product development. Responsibilities include debugging, root-cause analysis, data and AI/ML analysis, Linux-based development, documentation, and collaboration with software, firmware, data science, and product engineering teams.

The Senior Manager, Technical Accounting will oversee complex accounting research, technical memorandums, and compliance with U.S. GAAP and IFRS. Responsibilities include evaluating transactions, supporting financial reporting and audits, monitoring accounting standards, developing policies and controls, partnering with global cross-functional teams, and mentoring junior staff. The role requires expertise in consolidation, equity compensation, investments, financing, leases, impairments, business combinations, and semiconductor manufacturing accounting.

Leads NAND Flash product and test development for next-generation memory products. Responsibilities include burn-in and reliability screening, high-speed I/O testing, electrical validation, yield improvement, failure analysis, NPI, qualification, manufacturing ramp, and test roadmap development. The role provides technical leadership across Design, Process, Reliability, Manufacturing, OSAT, and SSD teams while mentoring junior engineers and improving product quality, reliability, and test costs.

Graduate intern supporting Talent Acquisition analytics through data engineering, dimensional modeling, SQL transformation, Snowflake pipelines, and Power BI dashboard development. Responsibilities include automating data refreshes, implementing data quality monitoring, creating governed DAX measures, optimizing reporting models, documenting architecture and metrics, and presenting insights to TA and HR leadership. The role focuses on building scalable recruiting analytics infrastructure rather than operational recruiting.

Design and implement analog, semi-custom, and mixed-signal circuits for 3D NAND flash memory cores. Analyze transistor-level power, performance, area, and reliability, while developing memory cell arrays, sense amplifiers, decoders, and word-line and bit-line drivers. Collaborate with engineers and scientists across teams to architect and physically implement innovative memory solutions.

Develops and validates mechanical simulations for advanced storage and memory products. Performs structural and thermal-mechanical analysis, including finite element modeling, solder joint reliability, temperature cycling fatigue, product disassembly, and PCB strain evaluation. Improves simulation methodologies, develops experimental test models, identifies design risks, and collaborates with design, manufacturing, quality, and engineering teams to optimize product performance, reliability, and manufacturability.

Undergraduate interns support hardware design, evaluation, debugging, board bring-up, hardware and firmware analysis, product development, test-data analysis, scripting, documentation, and cross-functional engineering work for data center SSD products.

Undergraduate interns will develop and test software tools, backend systems, firmware features, automation, and engineering workflows for data center SSD products. Responsibilities include coding in Python or C/C++, Linux-based development, debugging software and firmware, analyzing engineering data, collaborating with cross-functional teams, and documenting technical work. Assignments may involve embedded software, device drivers, storage technologies, APIs, AI-assisted programming, or applied data analysis.