Lead the development and optimization of 3D NAND semiconductor manufacturing processes, collaborating with teams and vendors to improve efficiency and innovation.

Join Solidigm as an engineering intern to work on firmware development, debugging, and validation of Solid State Drives in a collaborative environment.

Develop and maintain firmware for SSDs, analyzing specifications, testing, and collaborating in Agile. Requires strong experience in embedded systems and C/C++.

The Hardware Engineer will design and develop SSD products, including PCB circuit design, simulations, and validation for high volume manufacturing, collaborating with cross-functional teams.

The internship involves working with engineering teams on SSD validation, performing quality checks, and developing software in C++/Python for reliability testing.

The Systems Integration Lead develops SSD product requirements, conducts gap analysis, and ensures high-quality deliverables through collaboration and technical leadership.

The role involves debugging SSD product issues across firmware and hardware, collaborating with various teams to resolve defects, and utilizing debugging tools for performance analysis.

The role involves debugging SSD products across firmware, hardware, and system levels, collaborating with teams to resolve issues, and mentoring others on debugging practices.

The internship involves designing and testing firmware for SSDs, collaborating with teams, and developing validation test plans, aimed at students in engineering.

The internship involves contributing to firmware development, hardware validation, and AI-driven projects, providing hands-on experience across various engineering domains.

The internship involves validating SSDs by collaborating with engineering teams, executing qualification plans, and developing software in C++ and Python for reliability testing.

As a TD Design Collateral Staff Engineer, you will develop and maintain design rules, collaborate with design teams, and ensure manufacturability and yield for 3D NAND technology.

The Director of Strategic Planning defines and executes NAND strategies and products, manages product life cycles, conducts market and competitive analysis, and drives cross-company initiatives.

The Package Developer will innovate packaging technologies for SSDs, handle design integrations, solve issues, and communicate project statuses.

The Firmware Development Engineer will develop new firmware for SSDs, utilizing C/C++, and work on real-time embedded systems while collaborating in an Agile environment.

Design and develop electronic components, focusing on DFT circuits for 3DNAND flash memory, running simulations, and collaborating with teams for test validation. Requires strong logic design experience and proficiency in RTL and scripting languages.

The Process TD Engineer will develop SSD manufacturing processes, collaborate with teams, and implement new rework techniques for SSD modules.

The intern will provide operational support by collecting and analyzing marketing data, managing reporting processes, and assisting with office operations and team activities.

The Senior Software Engineer develops simulators and software for SSDs, working with firmware and hardware interfaces, and participates in Agile methodologies.

Design and develop high-speed IO and data interface circuits, validate signal integrity, and collaborate on performance optimization with cross-functional teams.