Staff Engineer, Package Development

Posted 12 Hours Ago
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Parañaque City, Metro Manila, National Capital Region, PHL
In-Office
Senior level
Semiconductor
The Role
Lead and deliver complex semiconductor package design and assembly projects: define/update package design rules, drive BOM selection and qualification, oversee data and qualification reviews, implement AQP and quality tools (DFMEA/PFMEA/Ishikawa/DRBFM/8D), manage schedules and budgets, mitigate risks, collaborate cross-functionally and with vendors, and mentor junior engineers.
Summary Generated by Built In

The Allegro team is united by a clear purpose—advancing technologies that make the world safer, more efficient, and more sustainable. With over 30 years of experience in semiconductor innovation, we bring that purpose to life across every part of the business—from breakthrough product development and customer success to how we show up for each other and the communities we serve.

Job Summary:
The Principal Manufacturing Process Engineer is a subject matter expert who leverages advanced knowledge to lead the most complex and strategic manufacturing process initiatives. This role is critical in solving novel process problems, defining the technical roadmap for a process area, and driving step-function improvements in manufacturing capability. As a recognized expert, the Principal Engineer provides guidance across multiple factory modules and makes substantial contributions to the site's technology strategy.

The Opportunity

This role demands advanced expertise in package design, assembly process engineering, and strategic problem-solving. The Principal Project Engineer will drive project success across multiple concurrent initiatives, provide technical leadership and mentorship, and is responsible for managing and updating Allegro's package design rules, ensuring alignment with corporate objectives and the highest quality standards.

What You Will Need

  • Lead and independently manage complex and strategic packaging projects, ensuring their successful completion on time, within budget, and within scope.

  • Act as a principal expert in semiconductor packaging and assembly, providing advanced technical guidance and making critical decisions on package design and assembly process engineering, including leading complex problem identification, root cause analysis, and resolution.

  • Drive the creation and evolution of bonding diagrams and other critical package design elements, setting standards and best practices for Allegro's design rules.

  • Lead strategic bill of material selection and qualification strategies, optimizing for long-term performance, cost, and manufacturability across product lines.

  • Oversee and approve comprehensive assembly data review and qualification data review processes, ensuring robust data analysis and critical decision-making.

  • Strategically define project scope, objectives, and resource requirements, proactively identifying and mitigating potential roadblocks.

  • Develop and implement advanced project tracking and reporting mechanisms, providing high-level, strategic updates to the Technical Project Manager and senior leadership.

  • Proactively anticipate and mitigate critical risks and resource conflicts, developing comprehensive contingency plans.

  • Drive collaboration across highly complex, cross-functional teams, including external partners, to ensure seamless project execution and strategic alignment.

  • Establish and enforce best practices for Advanced Quality Planning (AQP) and internal documentation procedures, ensuring robust project records and compliance.

  • Lead and oversee sophisticated problem-solving initiatives, including advanced Ishikawa (Fishbone) or 8D analyses, for critical project issues or quality deviations.

  • Serve as a subject matter expert and mentor in the application of quality tools such as DFMEA, PFMEA, Ishikawa, DRBFM, Design for Manufacturability, Design for Quality, and Design for Cost, driving their effective implementation across projects.

  • Manage and update Allegro's package design rules, ensuring they reflect current best practices and future technological needs.

  • Maintain comprehensive and strategic project documentation, including detailed schedules, budget forecasting, and technical specifications.

  • Serve as a primary interface with Business Units, product lines, and potentially external customers/vendors for strategic project updates and alignment on critical project strategies and resource allocation.

  • Mentor and provide technical guidance to junior and mid-level project engineers, fostering technical growth within the team.

What You Will Bring

  • Master's degree (MS) in an engineering field such as Mechanical Engineering, Chemical Engineering, or Electrical Engineering.

  • Minimum of five (5) to ten (10) years of progressive experience in semiconductor packaging and assembly engineering, with a proven track record of leading complex technical projects and making significant design and process engineering decisions.

  • Demonstrated advanced expertise in semiconductor packaging and assembly processes, with the ability to drive innovation and strategic improvements.

  • Expert understanding and practical application of advanced project management principles and methodologies, with a strong emphasis on technical leadership and strategic planning.

  • Exceptional proficiency in utilizing and mentoring others on quality tools such as DFMEA, PFMEA, Ishikawa, DRBFM, Design for Manufacturability, Design for Quality, and Design for Cost.

  • Exceptional organizational skills, meticulous attention to detail, and superior problem-solving and analytical capabilities.

  • Excellent written and spoken English language fluency, with highly developed communication, negotiation, and interpersonal skills.

  • Advanced proficiency in Microsoft Excel and Microsoft PowerPoint.

  • Knowledge and/or experience of semiconductor packaging and assembly processes (more emphasized for lower levels, assumed for higher levels) is preferred.

Why Allegro?


Join Allegro and become part of a team where your contributions truly matter.

We foster a culture of Real Innovation, empowering you to push boundaries, develop cutting-edge solutions, and drive continuous improvement.
Your work will create a Real Impact by solving complex real-world challenges that fuel our success and shape the future of technology.
You’ll experience Real Connection, collaborating with talented colleagues around the globe in an environment built on trust, respect, and a shared purpose.
Join us—and help build what’s next.

Skills Required

  • Master's degree in Mechanical, Chemical, Electrical, or related engineering field
  • Minimum of 5 to 10 years progressive experience in semiconductor packaging and assembly engineering
  • Demonstrated advanced expertise in semiconductor packaging and assembly processes and process engineering
  • Proven experience leading complex technical projects, strategic planning, and project management
  • Proficiency in quality tools and methodologies: DFMEA, PFMEA, Ishikawa, DRBFM, 8D, Design for Manufacturability/Quality/Cost
  • Advanced proficiency in Microsoft Excel and Microsoft PowerPoint
  • Exceptional written and spoken English communication, negotiation, and interpersonal skills
  • Ability to mentor and provide technical guidance to junior and mid-level engineers
  • Knowledge and/or experience of semiconductor packaging and assembly processes (emphasized for lower levels)

Allegro MicroSystems Compensation & Benefits Highlights

The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Allegro MicroSystems and has not been reviewed or approved by Allegro MicroSystems.

  • Strong & Reliable Incentives Feedback suggests bonuses are generous and a meaningful part of total compensation. Variable pay is viewed as reliably contributing to take-home pay.
  • Healthcare Strength Comprehensive medical, dental, vision, mental health, and fertility support is seen as robust. Day-one eligibility and advocacy services further strengthen access to care.
  • Leave & Time Off Breadth Vacation, sick/personal time, parental and family leave, holidays, and volunteer time off provide ample ways to step away from work. Generous PTO and floating holidays contribute to work-life balance.

Allegro MicroSystems Insights

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The Company
HQ: Manchester, NH
1,959 Employees
Year Founded: 1990

What We Do

At Allegro MicroSystems, we’re passionate about developing intelligent solutions that move the world toward a safer and more sustainable future – while giving our customers a competitive edge. With more than 50 years of experience developing advanced semiconductor technology and application-specific algorithms, Allegro is a global leader in power and sensing solutions for motion control and energy-efficient systems. Through our innovations, we are helping our customers make breakthrough advancements in areas like advanced mobility, green energy, and factory automation. Each year, we ship over one billion units into these applications to support our 10,000+ customers around the globe, including over 50 automotive OEMs. Our diverse team of 3,500+ employees is spread across 13 countries, powering our global engineering, manufacturing, and support and enabling our innovations. That’s why we work hard to create a collaborative, energetic environment that rewards ingenuity and helps our employees make a difference every day.

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