- Conduct design and development of image sensor technologies in advanced sub-micron node, including finfet, work on transistor level design of analog and mixed-signal circuits for CMOS Image Sensor such as asic_pixel array, column-bias generation, rampbuffer, column-amplifier, comparator, ramp generator, ASRAM and XDEC by using Cadence Virtuoso.
- Work on analog and mixed signal circuits layout design by Cadence Layout tool, such as column_array.
- Collaborate with layout engineer on whole chip layout integration, verification, and improvement.
- Perform sub-blocks and whole image sensor readout circuit simulation (DCG function, noise, PSRR, H-banding, etc.) by simulators such as Cadence Spectre, Analog FastSPICE (AFS), Empyrean ALPS and NanoSpice.
- Perform design verification such as DRC, LVS, antenna rule, and PERC check by using Siemens Caliber tools.
- Extract post-layout parasitic parameters by Calibre PEX.
- Process simulation data and develop script for test bench.
- Collaborate with Digital Engineer to define and design the analog to digital interface and timing generation.
- Collaborate with verification, process, test, and application engineers to debug, characterize and optimize performance of fabricated image sensors.
- Propose innovative and creative solutions along with new circuit R&D and be ahead of current technology.
- Tape-out experiences of CMOS analog and mixed-signal integrated circuits (ICs).
- Industry-standard CAD tools for analog design, such as Cadence Virtuoso for schematic design, Cadence Spectre, LTspic for simulation, and DRC, LVS Calibre for layout.
- Digital hardware design using HDLs and RTL design, with hands-on experience in FPGA development using Xilinx Vivado.
- Arduino and Bluetooth Low Energy (BLE) microcontroller programming.
- Printed circuit boards (PCB) design and layout, using tools such as Autodesk Eagle.
- Scripting and numerical computing with Python and MATLAB for simulation, automation, and data analysis.
- Chip test, verification, debug and measurements using lab equipment such as oscilloscopes, function generators, and data acquisition (DAQ) systems.
Skills Required
- Master's degree or foreign equivalent in Electrical Engineering, Computer Engineering, or a related field
- At least 2 years of experience in analog circuits, digital circuits, and semiconductor device physics
- Tape-out experience with CMOS analog and mixed-signal integrated circuits
- Experience with Cadence Virtuoso for analog schematic design
- Experience with Cadence Spectre and LTspice simulation
- Experience with DRC, LVS, and Calibre layout tools
- Digital hardware design using HDLs and RTL design
- Hands-on FPGA development using Xilinx Vivado
- Arduino and Bluetooth Low Energy microcontroller programming experience
- PCB design and layout experience using tools such as Autodesk Eagle
- Python and MATLAB scripting and numerical computing for simulation, automation, and data analysis
- Chip testing, verification, debugging, and measurements using oscilloscopes, function generators, and DAQ systems
What We Do
Founded in 1995, OMNIVISION has been at the leading-edge of technology, developing and delivering advanced digital imaging, analog, and touch & display solutions for multiple applications across several industries. With more than 3,000 employees worldwide and over 13 billion products shipped, OMNIVISION is a well-known global fabless semiconductor company. Our products can be found everywhere in people’s lives including mobile phones, security & surveillance, automotive, computing, medical, and emerging applications. Across these segments, OMNIVISION’S award-winning technology enables a smoother human/machine interface in many of today’s commercial devices. In this way, OMNIVISION delivers solutions that put its customers at the leading edge of technology. Whether it be developing the first mobile handset camera accessory in 2002, introducing the world’s smallest NTS camera in 2006 or launching PureCel CMOS image sensors in 2013, our dedication to providing reliable, innovative imaging and sensing solutions continue to be the primary aim. The company has recorded numerous industry firsts in its relentless quest for technology breakthroughs that deliver #InfiniteIngenuity: • Guinness World Record for the World's Smallest Commercially Available Image Sensor (OV6948) in 2019. In 2021, it beat its own record with the new OH0TA OVMed® • First to commercialize backside illumination technology in 2007 (OmniBSI™) • Industry's 1st to deploy the most mature LED Flicker Mitigation (LFM) solution in mass production for multiple automotive applications • Automotive industry leader with HALE, our HDR & LFM Engine combination algorithm • Developer of Nyxel® near-infrared technology with by far the best quantum efficiency in CMOS near-infrared imagine • Creator of CameraCubeChip™, the industry’s 1st wafer-level camera modules • First and only global shutter image sensors with cybersecurity, for ADAS and autonomous vehicles • First to introduce RBG-Ir technology to medical
