Sr. /Staff/Principal Analog Mixed-Signal Design Engineer

Posted 4 Days Ago
Be an Early Applicant
Santa Clara, CA, USA
In-Office
150K-250K Annually
Senior level
Semiconductor • Manufacturing
The Role
Designs, simulates, verifies, and refines multi-gigabit PAM4 SerDes IP and analog/mixed-signal receiver blocks, including TI-SAR ADCs, CTLE, DFE, and AFE components. Responsibilities include CDR development, high-speed testing with oscilloscopes and BERT, analog-digital interface verification, layout optimization, clock and synchronization design, and IP documentation. The engineer collaborates with system and test teams on high-speed interfaces, packages, boards, and system clocks for image sensor and bridge chip products.
Summary Generated by Built In
Overview :
Responsible for design, development, and refinement of Multi-Gbps PAM4 SerDes IP. Design and debug experience on RTL level signal synchronization, clock tree and cross domain clock designs is a significant plus.
Need to work closely with system and test engineers to develop high speed interface, package/board, and system clocks in image sensor and bridge chip products.
 
Responsibilities :
•    Analog/Mixed-Signal design, simulation and verifications esp PAM4 receiver designs such as TI-SAR ADC, CTLE/DFE and other blocks in AFE. 
•    CDR design experience is significant plus.
•    High speed test with scope and BERT.
•    Layout design and support. Need to get involved into layout optimizations for high speed or high precision performance directly.
•    Interface verifications between analog and digital.
•    IP and design spec documentations.
 
Requirements  :
•    Familiar with Cadence analog design/layout flow and spice/spectreMDL simulations.
•    Masters of Electrical Engineering or PhD with 3+ yrs of expertise.
 
Annual base salary for this role in California, US is expected to be between $150,000 - $250,000. Actual pay will be determined on a number of factors such as relevant skills, education, experience, and the pay of employees in the similar role. 

Skills Required

  • Master’s degree in Electrical Engineering or PhD
  • 3+ years of relevant expertise
  • Familiarity with Cadence analog design and layout flow
  • Experience with SPICE and SpectreMDL simulations
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The Company
HQ: Santa Clara, California
1,448 Employees
Year Founded: 1985

What We Do

Founded in 1995, OMNIVISION has been at the leading-edge of technology, developing and delivering advanced digital imaging, analog, and touch & display solutions for multiple applications across several industries. With more than 3,000 employees worldwide and over 13 billion products shipped, OMNIVISION is a well-known global fabless semiconductor company. Our products can be found everywhere in people’s lives including mobile phones, security & surveillance, automotive, computing, medical, and emerging applications. Across these segments, OMNIVISION’S award-winning technology enables a smoother human/machine interface in many of today’s commercial devices. In this way, OMNIVISION delivers solutions that put its customers at the leading edge of technology. Whether it be developing the first mobile handset camera accessory in 2002, introducing the world’s smallest NTS camera in 2006 or launching PureCel CMOS image sensors in 2013, our dedication to providing reliable, innovative imaging and sensing solutions continue to be the primary aim. The company has recorded numerous industry firsts in its relentless quest for technology breakthroughs that deliver #InfiniteIngenuity: • Guinness World Record for the World's Smallest Commercially Available Image Sensor (OV6948) in 2019. In 2021, it beat its own record with the new OH0TA OVMed® • First to commercialize backside illumination technology in 2007 (OmniBSI™) • Industry's 1st to deploy the most mature LED Flicker Mitigation (LFM) solution in mass production for multiple automotive applications • Automotive industry leader with HALE, our HDR & LFM Engine combination algorithm • Developer of Nyxel® near-infrared technology with by far the best quantum efficiency in CMOS near-infrared imagine • Creator of CameraCubeChip™, the industry’s 1st wafer-level camera modules • First and only global shutter image sensors with cybersecurity, for ADAS and autonomous vehicles • First to introduce RBG-Ir technology to medical

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