OMNIVISION

SoC Design Engineer

Posted 3 Days Ago

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Santa Clara, CA, USA

In-Office

157K-160K Annually

Entry level

Semiconductor • Manufacturing

The Role

Designs, integrates, validates, and debugs digital ASIC cores and data pipelines for image sensor SoCs. Responsibilities include RTL and microarchitecture design, timing analysis, synthesis, DFT, formal verification, mixed-signal integration, chip bring-up, silicon validation, and hardware/software co-simulation. Collaborates with physical design, analog, digital, algorithm, and application engineering teams on full-chip integration, tapeout, and performance improvements.

Summary Generated by Built In

Job Title: SoC Design Engineer

Job Duties:

Be responsible for digital design of ASIC cores within image sensor SoC products, including IP design, analysis, integration, and validation. Collaborate with physical design teams on floor-planning, timing closure, and DFT implementation. Conduct timing control logic design and static timing analysis (STA) for sensor interfaces and mixed-signal integration. Perform chip bring-up, validation and debugging. Design, integrate and validate data pipeline according to PRD/design specification and system architecture of SoC products, following ASIC design flow: coding, simulation, synthesis, static timing analysis, formality verification, DFT, using Simvision, EDA tools such as Prime Time, cadence Virtuoso, Design Compiler, Integrator, and Verilog and System Verilog programming languages etc. Conduct design verification and modeling using SVA, Python, Perl, C++/C, and HLS. Work with digital and analog engineers for system design, integration and validation. Work with algorithm engineers for module level design, including hardware C model implementation, micro architecture design, RTL design and hardware/software co-simulation. Work with algorithm and application engineers for project-based microarchitecture improvements. Conduct silicon validation, debugging and tuning.

Requirements:

Master’s degree or foreign equivalent degree in Electrical Engineering, Computer Engineering, or a related field.

Required skills and/or academic training in the following:

Arithmetic circuit design related to general datapath circuits, ML and AI circuits.
Arithmetic circuit design, timing analysis; synchronous and asynchronous FSMs; power, test, and debug.
Design and design debug with System Verilog; Logic design and analysis.
Processing Subsystem, including superscalar out-of-order cores, multicore and heterogeneous processors, and purpose-specific accelerators.
Design tools, such as microarchitecture simulators, RTL synthesis tools, and modeling for area, power, and thermal.
FPGA platforms to compute acceleration.
FPGAs technology, architecture and applications.
Register-Transfer Level (RTL) hardware design.
Planning and specification, writing Verilog models, and designing custom circuits and synthesized standard cell blocks.
Using industrial CAD tools and flows for digital, analog/RF, or mixed-signal chip design.
Full-chip integration and verification for tapeout.

Annual base salary for this role in California, US is expected to be between $156,853 - $160,000. Actual pay will be determined on a number of factors such as relevant skills and experience, and the pay of employees in the similar role.

Skills Required

Master's degree or foreign equivalent degree in Electrical Engineering, Computer Engineering, or a related field
Arithmetic circuit design for general datapath, ML, and AI circuits
Arithmetic circuit design and timing analysis
Synchronous and asynchronous finite-state machines
Power, test, and debug design
SystemVerilog design and debugging
Logic design and analysis
Processing subsystems, including superscalar out-of-order cores, multicore and heterogeneous processors, and purpose-specific accelerators
Microarchitecture simulators, RTL synthesis tools, and area, power, and thermal modeling
FPGA platforms for compute acceleration
FPGA technology, architecture, and applications
Register-transfer level hardware design
Planning and specification, Verilog modeling, custom circuit design, and synthesized standard-cell blocks
Industrial CAD tools and flows for digital, analog/RF, or mixed-signal chip design
Full-chip integration and verification for tapeout

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The Company

HQ: Santa Clara, California

1,448 Employees

Year Founded: 1985

What We Do

Founded in 1995, OMNIVISION has been at the leading-edge of technology, developing and delivering advanced digital imaging, analog, and touch & display solutions for multiple applications across several industries. With more than 3,000 employees worldwide and over 13 billion products shipped, OMNIVISION is a well-known global fabless semiconductor company. Our products can be found everywhere in people’s lives including mobile phones, security & surveillance, automotive, computing, medical, and emerging applications. Across these segments, OMNIVISION’S award-winning technology enables a smoother human/machine interface in many of today’s commercial devices. In this way, OMNIVISION delivers solutions that put its customers at the leading edge of technology. Whether it be developing the first mobile handset camera accessory in 2002, introducing the world’s smallest NTS camera in 2006 or launching PureCel CMOS image sensors in 2013, our dedication to providing reliable, innovative imaging and sensing solutions continue to be the primary aim. The company has recorded numerous industry firsts in its relentless quest for technology breakthroughs that deliver #InfiniteIngenuity: • Guinness World Record for the World's Smallest Commercially Available Image Sensor (OV6948) in 2019. In 2021, it beat its own record with the new OH0TA OVMed® • First to commercialize backside illumination technology in 2007 (OmniBSI™) • Industry's 1st to deploy the most mature LED Flicker Mitigation (LFM) solution in mass production for multiple automotive applications • Automotive industry leader with HALE, our HDR & LFM Engine combination algorithm • Developer of Nyxel® near-infrared technology with by far the best quantum efficiency in CMOS near-infrared imagine • Creator of CameraCubeChip™, the industry’s 1st wafer-level camera modules • First and only global shutter image sensors with cybersecurity, for ADAS and autonomous vehicles • First to introduce RBG-Ir technology to medical