Renesas IC Design Power Division in Zurich develops advanced analog and mixed-signal integrated circuits for power-management and wireless-power applications, delivering complex semiconductor products from architecture and design through silicon validation and volume production.
The successful candidate will combine SoC digital design with dedicated technical ownership of internal AI-assisted engineering tools supporting requirements management and specification development. The role includes ongoing software development and maintenance, close collaboration with engineering users, and integration of AI/LLM capabilities into the design flow. Prior experience integrating AI into IC design workflows is an essential requirement for this position.
Job DescriptionKey Responsibilities
Take technical ownership of internal engineering tools and their existing codebases. Develop enhancements, resolve defects, maintain documentation, manage releases, and provide ongoing support to the engineering team.
Develop and validate AI-assisted workflows that translate product requirements into specifications for each engineering discipline. Work with domain experts to preserve traceability to source requirements and manage dependencies and requirement changes.
Build automated tests and review workflows to assess the completeness, consistency, and correctness of generated specifications. Ensure outputs can be checked and approved by the responsible engineers.
Translate user feedback into tool improvements, maintain integrations with engineering workflows, and evaluate additional AI/LLM applications for requirements analysis, documentation, RTL development, and verification.
Translate system and product requirements into digital specifications and micro-architectures. Develop RTL in Verilog/SystemVerilog and integrate embedded processors, memories, peripherals, register maps, and on-chip buses into mixed-signal SoCs.
Own digital design activities including lint, CDC/RDC analysis, synthesis, static timing analysis, and low-power design. Support physical implementation and timing closure.
Collaborate with system, analog, verification, firmware, and physical design teams on SoC integration, clock and reset architectures, mixed-signal interfaces, design reviews, and verification planning.
Support silicon bring-up, laboratory debugging, and product validation through the transition to volume production
Proven hands-on experience developing and integrating AI-based tools into IC design workflows is required. Candidates must be able to demonstrate implemented solutions in areas such as requirements engineering, specification generation, RTL design, verification, or design-flow automation.
MSc or PhD in Electrical Engineering, Microelectronics, Computer Engineering, or a related field.
Typically 5+ years of relevant experience in digital IC/SoC design, with experience taking designs from specification through successful silicon.
Strong practical experience with Verilog/SystemVerilog, RTL design, and digital subsystem integration.
Solid understanding of SoC architectures, including embedded processors, memories, peripherals, register architectures, and on-chip buses such as AMBA AHB/APB.
Experience with lint, CDC/RDC, synthesis, static timing analysis, and timing closure, together with an understanding of clock/reset architectures and low-power design techniques.
Practical software-development experience and the ability to understand, maintain, and extend an existing application codebase, including version control, testing, debugging, documentation, and release management.
Proficiency in Python or comparable programming languages for engineering automation and tool integration; familiarity with Tcl is an advantage.
Ability to take ongoing ownership of an internal tool, prioritize improvements with its users, and investigate and resolve software issues.
Experience collaborating across analog/mixed-signal, verification, firmware, and physical design teams, including silicon bring-up and debug.
Strong analytical and problem-solving skills, clear communication, and the ability to work effectively in an international engineering team.
Fluent English.
Preferred Experience
Mixed-signal SoCs for power-management or wireless-power applications, embedded MCU architectures, and modern EDA design flows.
Development of LLM applications using model APIs, retrieval-augmented generation, or tool integration, with evaluation of output quality and reliability.
Requirements-management systems, decomposition of product requirements across engineering disciplines, traceability, and change management.
AI-assisted software development, including independent review, debugging, and testing of generated code.
Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.
At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.
We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.
Are you ready to join our team and shape the future with us?
Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.
Skills Required
- Hands-on experience developing and integrating AI-based tools into IC design workflows
- MSc or PhD in Electrical Engineering, Microelectronics, Computer Engineering, or a related field
- Typically 5+ years of relevant digital IC or SoC design experience
- Experience taking designs from specification through successful silicon
- Strong practical experience with Verilog/SystemVerilog and RTL design
- Experience integrating digital SoC subsystems, embedded processors, memories, peripherals, registers, and on-chip buses
- Experience with lint, CDC/RDC, synthesis, static timing analysis, timing closure, clock/reset architectures, and low-power design
- Practical software-development experience maintaining and extending existing codebases
- Experience with version control, testing, debugging, documentation, and release management
- Proficiency in Python or comparable programming languages for engineering automation and tool integration
- Ability to own an internal tool and prioritize improvements with users
- Experience collaborating across analog/mixed-signal, verification, firmware, and physical design teams
- Experience with silicon bring-up and debugging
- Strong analytical, problem-solving, communication, and international teamwork skills
- Fluent English
- Experience with mixed-signal SoCs for power-management or wireless-power applications
- Experience with embedded MCU architectures and modern EDA design flows
- Development of LLM applications using model APIs, retrieval-augmented generation, or tool integration
- Experience evaluating LLM output quality and reliability
- Experience with requirements-management systems, traceability, decomposition, and change management
- Experience with AI-assisted software development and independent review of generated code
- Familiarity with Tcl
Renesas Electronics Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Renesas Electronics and has not been reviewed or approved by Renesas Electronics.
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Fair & Transparent Compensation — Feedback suggests pay is generally fair-to-good across many roles, with base pay aligned to prevailing market levels in multiple U.S. locations. Engineering and leadership tracks can be competitive on total compensation, reinforcing a sense that pay can meet market expectations in key job families.
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Healthcare Strength — Feedback suggests core medical, dental, and vision coverage is solid and well-regarded by employees. Day-one eligibility in U.S. roles is described, supporting confidence in access and continuity of care.
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Leave & Time Off Breadth — Feedback suggests PTO, paid holidays, sick time, and parental leave provide a comprehensive time-off framework. Company initiatives like Renesas Day and meeting-light Focus Fridays further support time away and balance.
Renesas Electronics Insights
What We Do
We're the world's leading semiconductor manufacturer. Our mission is to make our lives easier and a world that's safer, healthier, greener, and smarter.




