Renesas Electronics
Jobs at Renesas Electronics
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3D Printing
Develop and deploy semiconductor physical implementation methodologies and RTL-to-GDSII EDA flows. Perform floorplanning, placement, clock tree synthesis, routing, timing closure, optimization, and signoff preparation. Build automated scripts, checks, reports, and regression infrastructure; evaluate new EDA technologies and AI-assisted workflows; and support customer adoption. Diagnose complex tool, constraint, and design issues, provide technical training and presentations, and collaborate with design, product, R&D, and EDA vendor teams globally.
3D Printing
Manage end-to-end supply chain planning, including backlog, wafer bank release, die kitting, inventory control, shipment estimates, and customer on-time delivery. Coordinate with planning, Sales, Marketing, and internal departments to fulfill demand, optimize work-in-process positioning and inventory days, resolve scheduling issues, and achieve production and revenue targets.
3D Printing
Develops and transfers semiconductor products from concept to mass production. Responsibilities include process setup, risk assessment, DOE evaluations, process optimization, SPC implementation, sample-build data analysis, technical reporting, and cross-functional coordination with QA, operations, R&D, designers, and customers.
3D Printing
The Senior Accountant supports inventory and cost accounting operations, month-end close, account reconciliations, financial reporting, journal entries, intercompany reconciliations, and inventory reserve coordination. The role also requires collaboration with controllers and auditors, along with strong Excel, ERP, analytical, organizational, and communication skills.
3D Printing
Drives semiconductor product yield improvement, test-cost reduction, quality, and manufacturability across the product lifecycle. Reviews low-yield lots, leads root-cause analysis and corrective actions, sustains production metrics, qualifies and validates new products, supports tester-platform migrations, and coordinates with test engineering, assembly, quality, factories, and OSAT partners. Applies statistical analysis, failure analysis, reliability testing, and system integration to improve production flow and gross margin.
3D Printing
Develops and transfers new semiconductor products from concept through mass production. Responsibilities include process setup, optimization, risk assessment, DOE evaluations, SPC implementation, sample-build data analysis, technical reporting, and cross-functional coordination with quality, operations, and R&D teams. The role requires an engineering degree, semiconductor or manufacturing process knowledge, analytical problem-solving skills, and familiarity with dicing, die attach, wire bonding, molding, or related processes.
3D Printing
Develops and transfers semiconductor products from concept to mass production. Responsibilities include process setup, optimization, risk assessment, DOE evaluations, SPC implementation, sample-build data analysis, technical reporting, and cross-functional coordination with design, quality, operations, and R&D teams.
3D Printing
Develops high-performance switching power MOSFETs for 12V–80V applications across the full product lifecycle. Responsibilities include device architecture, TCAD simulation, process integration, design-rule development, mask layout, split experiments, characterization, yield optimization, reliability analysis, and engineering support for existing semiconductor products. The role collaborates with process, CAD, applications, and test engineering teams to deliver manufacturable, commercially successful power semiconductor devices.
3D Printing
Drives semiconductor product yield improvement, test-cost reduction, quality, and manufacturability across the product lifecycle. Responsibilities include production lot disposition, root-cause analysis, corrective actions, sustaining activities, product qualification and validation, tester-platform migration, system integration, and collaboration with test engineering, assembly, quality, factories, and outsourced semiconductor assembly and test partners.
3D Printing
Develops semiconductor products from concept through mass production by optimizing processes, assessing risks, planning evaluations, establishing process conditions, applying SPC, analyzing sample-build data, and preparing technical reports. Coordinates with QA, operations, R&D, designers, customers, and other cross-functional teams to support successful new product introduction and production transfer.
3D Printing
Develops and transfers semiconductor products from concept to mass production. Responsibilities include process setup, optimization, risk assessments, DOE evaluations, SPC implementation, sample-build data analysis, technical reporting, and cross-functional coordination with QA, operations, R&D, designers, and customers. The role supports DACA, DAF die attach, vacuum reflow, and related semiconductor assembly processes while ensuring stable, documented production conditions.
3D Printing
Provides technical leadership for complex CMOS analog and power-management IC designs from concept through production. Leads circuit design, simulation, verification, layout supervision, design reviews, silicon characterization, testing, and production ramp. Mentors engineers, resolves complex technical issues, improves design methodologies, and collaborates with cross-functional teams and customers.
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Leads regional go-to-market strategy, demand creation, design-win growth, customer engagement, pricing, partner development, sales enablement, competitive intelligence, and product roadmap feedback for semiconductor MCU, MPU, and connectivity portfolios. Translates technical capabilities into customer value propositions, manages regional opportunities and distribution relationships, identifies market whitespace, and aligns global product strategy with local customer and market requirements.
3D Printing
Leads next-generation low-voltage GaN motor-control IC definition, architecture, and roadmap strategy. Translates system requirements into silicon specifications, collaborates with design and R&D teams, develops and validates high-power prototypes and evaluation boards, performs circuit simulations and system tradeoff analyses, and supports strategic customer engagements. Requires expertise in power electronics, motor-drive systems, semiconductor architecture, PCB layout, protection mechanisms, lab characterization, and GaN power-device technology.
3D Printing
Own strategic automotive accounts and drive revenue growth through opportunity discovery, design-ins, design wins, RFQ and quotation management, pricing negotiations, forecasting, and account strategy. Build relationships with executive and engineering stakeholders, collaborate with global cross-functional teams and ODMs, and support customer product development from qualification through production launch. Some travel is required.
3D Printing
Develop, test, document, and maintain embedded software for deeply embedded platforms. Collaborate with software architects, follow SDK roadmaps, ensure software quality, verify deliverables, plan tasks, report progress, and mentor junior engineers. The role requires C programming, ARM-based processor experience, software testing, source control, Agile methodologies, and use of electronic test equipment. Experience with Zephyr RTOS, Bluetooth Low Energy, open source, multithreaded RTOS, and cryptography is advantageous.
3D Printing
Lead pre- and post-silicon RF and analog analysis, characterization, chip bring-up, laboratory testing, debugging, and performance optimization. Define evaluation methods, test correlations, automation tools, and data-collection processes for circuit blocks and systems. Analyze statistical results, document findings, establish datasheet parameters, and support design teams in resolving complex silicon issues.
3D Printing
Owns pre- and post-silicon RF and analog circuit analysis, characterization, testing, bring-up, debugging, and performance optimization. Defines evaluation methods, test correlations, automation, data collection, and datasheet parameters. Supports circuit design teams in resolving complex silicon issues and documents block- and system-level results. Requires RF/analog chip design experience, Cadence Virtuoso proficiency, laboratory testing expertise, and strong technical communication.
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Design, implement, operate, and troubleshoot secure, scalable AWS network infrastructure across multi-account and multi-region environments. Responsibilities include configuring VPCs, Transit Gateway, Direct Connect, VPNs, load balancing, firewalls, WAF, and hybrid connectivity; automating provisioning with Terraform or CloudFormation; monitoring performance and security; resolving complex network issues; and maintaining documentation and operational standards.
3D Printing
Partners with global HRBPs and Operations leaders to execute talent, performance, organizational design, workforce planning, leadership development, and change initiatives. Uses people analytics to guide data-driven decisions, supports organizational transitions, and collaborates across regions and HR functions in a global matrixed environment.

