Jobs at Renesas Electronics

Develop advanced GaN power semiconductor devices across the technology and product development lifecycle. Responsibilities include device architecture, PCM test structure design, electrical characterization, semiconductor testing, data analysis, root-cause investigation, troubleshooting, and technology qualification. The engineer will collaborate with design, process integration, reliability, test, and product engineering teams to improve technology readiness and support high-volume manufacturing.

Manages supplier quality for AI high-density power modules, including supplier liaison activities, quality excursions, root-cause analysis, corrective actions, audits, process changes, and continuous improvement. Supports semiconductor module assembly, PCB surface-mount technology, component suppliers, quality documentation, statistical process control, and compliance with ISO, IATF, and VDA standards.

Leads semiconductor package technology development and new product introduction for power products, including SiP/modules, wafer-level, flip-chip, SiC, and GaN packaging. Manages global OSAT and contract manufacturing partnerships, qualification, process optimization, technology transfer, production ramp, yield improvement, risk mitigation, and corrective actions. Coordinates cross-functional engineering, quality, operations, reliability, supply chain, and customer programs while maintaining package design rules and technology roadmaps.

Designs and delivers physical layouts for complex analog and mixed-signal automotive ICs at block, IP, and chip-top levels. Leads floorplanning, power and signal distribution, physical verification, parasitic extraction, manufacturability, reliability, and yield optimization. Collaborates with design, verification, CAD, technology, and quality teams; resolves silicon issues; leads layout activities; and contributes to methodologies, training, documentation, and continuous improvement.

Plans and executes validation and characterization of digitally enabled multiphase power-management products. Develops automated laboratory tests, analyzes data, creates technical documentation, and supports silicon bring-up and customer configuration. Collaborates with engineering, firmware, R&D, marketing, and customers on requirements, product features, loop compensation, sequencing, telemetry, and roadmap feedback.

Leads verification and evidence development for digital control-loop features in advanced power-management products. Translates requirements into test plans, metrics, and pass/fail criteria; validates behavior across models, RTL, mixed-signal simulation, emulation, bench testing, and silicon. Develops automation for parameter sweeps, corner testing, waveform analysis, regression, and evidence generation. Investigates discrepancies, evaluates digital-analog interactions, documents risks, and mentors engineers across multidisciplinary teams.

Leads the global treasury function, overseeing liquidity, cash forecasting, funding, capital structure, FX and interest-rate risk, banking relationships, treasury governance, insurance programs, and transformation initiatives. Advises the CFO and executive leadership, negotiates with financial institutions, supports M&A financing, manages treasury systems and controls, and leads a multinational treasury team across multiple regions and currencies.

Leads the design, administration, analysis, and governance of executive compensation programs, including salary, incentives, equity awards, benchmarking, and retention plans. Prepares Compensation Committee and Board materials, manages executive equity processes, develops financial models and market analyses, and advises senior leaders. Partners with Finance, Legal, Tax, Payroll, and external providers on compliance, disclosures, and administration. Mentors junior analysts and manages highly confidential information.

Develop, debug, test, and optimize embedded firmware applications for Renesas MCUs using C/C++ and bare-metal or RTOS environments. Provide technical support, develop proof-of-concept solutions, resolve customer escalations, and support MCU design-ins. Collaborate with FAEs, marketing, and engineering teams while serving as a technical expert for customers and internal stakeholders. Responsibilities also include understanding customer requirements, recommending MCU solutions, training teams, and contributing insights to product roadmaps.

Provides expert customer and internal support for MCU and digital power solutions. Responsibilities include board bring-up, peripheral configuration, embedded C/C++ firmware development, digital power control-loop design, system debugging, and troubleshooting efficiency, EMI, thermal, stability, and transient-response issues. The engineer develops proof-of-concept systems, reference materials, trainings, workshops, and customer presentations while collaborating with FAEs, marketing, and engineering teams on design-ins and escalations.

Owns the semiconductor product engineering lifecycle from concept through mass production. Responsibilities include ATE characterization and test planning, risk assessment, test limit definition, statistical analysis, yield and throughput optimization, quality and excursion containment, customer technical support, cross-functional milestone delivery, and mentoring junior engineers.

Leads Total Rewards initiatives supporting mergers, acquisitions, organizational transformation, compensation harmonization, benefits integration, job architecture, leveling, and rewards program implementation. Coordinates cross-functional stakeholders across HR, Finance, Legal, Payroll, IT, and business leadership. Develops integration plans, conducts due diligence, assesses risks and costs, manages project governance, and supports compensation modeling, change management, and global rewards frameworks.

Leads Total Rewards initiatives supporting mergers, acquisitions, divestitures, organizational transformation, and compensation harmonization. Manages rewards due diligence, job architecture, leveling, role mapping, compensation analysis, transition planning, governance, stakeholder coordination, risk assessment, and implementation across global HR, Finance, Legal, Payroll, IT, and business teams.

Manage semiconductor supply chain planning from wafer release through OSAT and customer shipment. Responsibilities include backlog management, wafer bank release, die kitting, inventory and days-of-inventory control, shipment forecasting, revenue plan support, customer on-time delivery, expedites, upsides, and collaboration with global sales, marketing, and customer service teams.

Manage semiconductor supply chain planning from wafer release and assembly die kitting through OSAT processing and customer shipment. Responsibilities include backlog management, inventory and days-of-inventory control, shipment forecasting, customer on-time delivery, revenue-plan support, hot expedites, and coordination with global Sales, Marketing, and customer service teams.

Lead next-generation semiconductor test technology, including AI-enabled test development, simulation and virtual test environments, DFT strategy, test coverage, and automation. Develop reusable software tools and methodologies using Python to improve validation, debug, engineering productivity, and product quality. Partner with design, product engineering, test engineering, and operations teams to influence architectures and testability. Provide technical leadership and mentorship across global engineering teams.

Leads Renesas’s mass-market expansion for its High-Performance AI and Compute product line. Owns product strategy, roadmap, operational transformation, distribution channels, go-to-market programs, digital self-service, e-commerce enablement, and customer adoption. Builds and manages product management and marketing teams while aligning product development, manufacturing, applications engineering, and support operations for scalable, cost-competitive delivery. Establishes performance metrics, manages channel partners, and reports progress to executive leadership.

Leads systems and applications engineers developing DC-DC power products for industrial and enterprise server markets. Partners with customers, sales, marketing, design, and validation teams to define product architectures, roadmaps, specifications, and reference designs. Performs system-level power integrity, thermal, and fault-response analysis; supports silicon bring-up, testing, debugging, and customer adoption. Develops technical collateral, mentors engineers, and drives innovative power solutions.

Lead regional solutions marketing for Renesas industrial automation offerings, including PLCs, edge sensing, motor control, and HMI interfaces. Engage strategic customers, identify design-win opportunities, coordinate Sales, FAEs, product groups, and channel teams, and translate market requirements into product roadmap recommendations. Develop customer presentations, collateral, competitive analyses, and field training materials while building relationships with technical and procurement stakeholders to drive solution adoption and revenue growth.

Architects and develops Verilog RTL for digital sections of memory interface chips supporting DDR5, DDR6, and future standards. Oversees synthesis, static timing analysis, DFT, logic equivalence, verification, ECO implementation, constraints, and backend handoff. Participates in architecture and design reviews, documents designs, defines new features, and mentors junior engineers.