- Assure quality throughout the product lifecycle, including product development, manufacturing, failure analysis, production release, and servicing.
- Plan and execute quality strategies during the design and development phases by defining standard operating procedures for electrical quality control and assurance, ensuring that risks are mitigated and issues are promptly corrected during ramp-up.
- Lead automotive quality improvement initiatives by implementing proactive measures to reduce test-related quality incidents, driving cross-department Lessons Learned activities for manufacturing and test items, improving outgoing electrical quality control processes, and managing Safe Launch and High Voltage Stress Testing for automotive products.
- Ensure product quality and reliability through statistical yield analysis techniques such as and Statistical Yield and Bin Limit (SYL, SBL) evaluations.
- Perform failure analysis utilizing pFA and eFA tools — including cross-sectioning, emission microscopy, X-ray analysis, SEM (Scanning Electron Microscope), optical microscopy, oscilloscope probing, and OBIRCH — to identify failure modes, localize physical hot spots, and determine root causes.
- Conduct FMEA (Failure Mode and Effect Analysis) and statistical data analysis — such as box plots, histograms, distributions, scatter charts, normalization, and linearity — using MATLAB, Visual C, Excel, and internal OVT tools for reliability and yield assessments.
- Handle customer complaint (CCN) cases and customer return analyses, providing detailed failure reports and coordinating with cross-functional teams to identify root causes and implement corrective actions.
- Communicate directly with end customers and supply chain partners, including package houses and foundries (e.g., TSMC), to resolve quality and process issues identified during IC manufacturing. Apply IC fabrication knowledge to evaluate wafer- or process-related deviations.
- Provide remote support for customers with multi-region manufacturing sites producing camera modules and related automotive imaging products.
- Drive Corrective and Preventive Actions (CAPA) across functional engineering teams to ensure continuous improvement, enhance product robustness, and maintain stable production quality.
- Digital IC design
- IC fabrication
- C programming
- RTL design
- VHDL programming
- Verilog programming
- Semiconductor physics
- Reliability prediction
Skills Required
- Master's degree or foreign equivalent in Electrical Engineering, Computer Engineering, or a related field
- Graduate-level knowledge of digital IC design
- Graduate-level knowledge of IC fabrication
- Graduate-level knowledge of C programming
- Graduate-level knowledge of RTL design
- Graduate-level knowledge of VHDL programming
- Graduate-level knowledge of Verilog programming
- Graduate-level knowledge of semiconductor physics
- Graduate-level knowledge of reliability prediction
What We Do
Founded in 1995, OMNIVISION has been at the leading-edge of technology, developing and delivering advanced digital imaging, analog, and touch & display solutions for multiple applications across several industries. With more than 3,000 employees worldwide and over 13 billion products shipped, OMNIVISION is a well-known global fabless semiconductor company. Our products can be found everywhere in people’s lives including mobile phones, security & surveillance, automotive, computing, medical, and emerging applications. Across these segments, OMNIVISION’S award-winning technology enables a smoother human/machine interface in many of today’s commercial devices. In this way, OMNIVISION delivers solutions that put its customers at the leading edge of technology. Whether it be developing the first mobile handset camera accessory in 2002, introducing the world’s smallest NTS camera in 2006 or launching PureCel CMOS image sensors in 2013, our dedication to providing reliable, innovative imaging and sensing solutions continue to be the primary aim. The company has recorded numerous industry firsts in its relentless quest for technology breakthroughs that deliver #InfiniteIngenuity: • Guinness World Record for the World's Smallest Commercially Available Image Sensor (OV6948) in 2019. In 2021, it beat its own record with the new OH0TA OVMed® • First to commercialize backside illumination technology in 2007 (OmniBSI™) • Industry's 1st to deploy the most mature LED Flicker Mitigation (LFM) solution in mass production for multiple automotive applications • Automotive industry leader with HALE, our HDR & LFM Engine combination algorithm • Developer of Nyxel® near-infrared technology with by far the best quantum efficiency in CMOS near-infrared imagine • Creator of CameraCubeChip™, the industry’s 1st wafer-level camera modules • First and only global shutter image sensors with cybersecurity, for ADAS and autonomous vehicles • First to introduce RBG-Ir technology to medical
