Process Integration Development Engineer

Posted 17 Days Ago
Be an Early Applicant
Hillsboro, OR, USA
In-Office
134K-189K Annually
Junior
Artificial Intelligence • Cloud • Information Technology • Software
Creating world-changing technology that enriches the lives of every person on earth.
The Role
Performs semiconductor process integration and technology development using advanced TEM and FIB tools. Prepares, images, and analyzes samples in a high-throughput environment; supports fabrication, failure analysis, process development, and metrology optimization. Collaborates with engineering teams to troubleshoot process flows, improve manufacturing processes, and expand analytical capabilities. Requires a technical PhD, TEM operation experience, and programming skills.
Summary Generated by Built In
Job Details:

Job Description: At Intel, we are at the forefront of innovation, creating world-changing technology that enriches the lives of every person on planet. The Foundry labs directly support advancement of Intel's technology development. The transmission electron microscopy group supports engineering activities in fabrication, failure analysis, technology development, process development, process integration, and pathfinding. Our job is to understand where our manufacturing process and metrologies need to be improved. We are looking for engineers who love solving technical problems, are driven to achieve results, and are flexible in adapting to new methods, tools, and fields of study depending on what is needed to solve the problem at hand. The position will involve characterizing semiconductor nano-devices using advanced transmission electron microscopy (TEM) to expand analytical capabilities. The Time-To-Information-Return (TTIR) of this imaging analysis is critical to TD as we advance process nodes and require revolutionary changes in our support structure and methodologies. We are embarking on those changes. The position is responsible for TEM sample preparation, TEM sample imaging and analysis in high throughput environment. The Engineer will be responsible for but not limited to: o Technical functions in support of engineering activities such as fabrication, failure analysis, technology development, process development, and process integration. o Collaborates with engineering teams to optimize metrology strategies and troubleshoot process flow issues. o Conducts engineering tasks and detailed technical procedures to perform sample preparation or imaging using advanced focused-ion-beam and/or transmission electron microscope tools in support of the research and development activities of Intel. o Contributes to continuous improvement efforts in high volume manufacturing environments. o Performs other related duties as required or as directed. o Continuous upgrading of skill set; requires an open attitude and skills to learn from.

Qualifications:

You must possess the minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.
Minimum Qualifications:
o PhD degree in a Technical Area (Materials Science, Chemistry, Physics or comparable field).
o At least 2 years of experience with Transmission Electron Microscopy (TEM) operation.
o At least 1 year of experience with Python scripting or MATLAB or other programming languages.
Preferred qualifications:
o Hands-on Experience with TEM sample preparation and/or TEM sample imaging with automation.
o Hands-on Experience with Advanced Transmission Electron Microscopy, such as EELS, EDX and/or 4D STEM.
o Knowledge of electron optics.
o Knowledge of semiconductor process integration.

          

Job Type:Experienced Hire

Shift:Shift 1 (United States of America)

Primary Location: US, Oregon, Hillsboro

Additional Locations:

Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.



Annual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

*

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

Skills Required

  • PhD degree in a technical area such as Materials Science, Chemistry, Physics, or a comparable field
  • At least 2 years of experience operating Transmission Electron Microscopy (TEM)
  • At least 1 year of experience with Python scripting, MATLAB, or another programming language
  • Hands-on experience with TEM sample preparation and/or automated TEM sample imaging
  • Hands-on experience with advanced TEM techniques such as EELS, EDX, and/or 4D STEM
  • Knowledge of electron optics
  • Knowledge of semiconductor process integration

Intel Compensation & Benefits Highlights

The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Intel and has not been reviewed or approved by Intel.

  • Leave & Time Off Breadth — Sabbaticals and paid time off are highlighted as signature elements, with an established program offering four weeks after four years or eight weeks after seven years. This distinctive time off is positioned as a meaningful part of the overall package.
  • Parental & Family Support — Paid bonding leave of 12 weeks and a New Parent Reintegration program, plus fertility benefits around $40,000 and up to $15,000 adoption reimbursement with no lifetime cap, are clearly stated. These programs are presented as standout components alongside broader family support resources.
  • Healthcare Strength — Multiple medical plan options with 2026 updates, a shift to Spring Health for EAP, and in‑network virtual medical visits covered at 100% beginning in 2026 indicate a comprehensive offering. These features signal an emphasis on robust medical access and mental health support.

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The Company
HQ: Santa Clara, CA
75,000 Employees
Year Founded: 1968

What We Do

Our mission is to shape the future of technology to help create a better future for the entire world, that’s the power of Intel Inside. With more ingenuity and creativity inside, our work is at the heart of countless innovations. From major breakthroughs to things that make everyday life better— they’re all powered by Intel technology. With a career at Intel, you can help make the future more wonderful for everyone.

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