The Role and Impact
As a Module Development Engineer, you will play a pivotal role in driving advancements in Intel's semiconductor manufacturing technologies. Your contributions will focus on developing and enabling cutting-edge processes for high-volume manufacturing while laying the groundwork for future technological innovations. By leveraging your expertise in process development, equipment optimization, and material science, you will be instrumental in creating robust, scalable solutions that align with Intel's commitment to leadership in semiconductor technology. Working cross-functionally with internal teams and external partners, you will ensure seamless integration of advanced manufacturing processes to meet product performance, yield, and reliability standards.
Key Responsibilities
- Lead the design and development of advanced manufacturing processes, including material selection, parameter optimization, equipment metrology, and system design.
- Drive technology development and enablement for both high-volume manufacturing and future technologies.
- Perform feasibility studies using simulations and engineering methodologies to meet desired device specifications.
- Conduct pathfinding activities to develop innovative process solutions for next-generation device architectures.
- Develop and implement technology roadmaps to guide future manufacturing needs.
- Collaborate with equipment and material suppliers to design and implement enabling process technologies.
- Optimize production efficiency, manufacturing techniques, and output for existing and new products.
- Utilize statistical process control and data analytics to enhance process stability and drive continuous improvements.
- Recommend and execute modifications to operational equipment to boost efficiency and manufacturing scalability.
- Partner with cross-functional teams to ensure alignment on process integration and project deliverables.
The candidate should demonstrate the following behavioral traits.
- Strong problem-solving skills and ability to address complex technical challenges.
- Proven track record of collaboration with cross-functional teams, including yield, operations, and supplier management.
Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.
Minimum Qualifications
- PhD degree in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related STEM discipline with 1+ years of relevant experience.
- OR Master's degree in the same fields with 4+ years of experience.
Experience listed above should be a combination in the following:
- Manufacturing process development experience, statistical process control, process improvement, and data analytics.
-Hands on experience in wafer-level assembly, semiconductor processing, or advanced packaging technology development.
Preferred Qualifications
- Experience in wafer-level assembly, epoxy, mold materials, annealing or related fields in advanced packaging.
- Demonstrated expertise in leading programs from strategy formation to high-volume production.
- Familiarity with advanced packaging technologies such as hybrid bonded interconnects, RDL-based packaging, or ultra-fine pitch solder connections.
- Experience in design rule development for Manufacturability/ REL
Join Intel's team and help shape the future of semiconductor technology through innovation and excellence.
Job Type:Experienced HireShift:Shift 1 (United States of America)Primary Location: US, Oregon, HillsboroAdditional Locations:Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $133,800.00-255,200.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.Skills Required
- PhD in Materials Science, Mechanical, Chemical, Electrical Engineering, Chemistry, Physics, or related STEM with 1+ years OR Master's with 4+ years of relevant experience
- Manufacturing process development experience including statistical process control, process improvement, and data analytics
- Hands-on experience in wafer-level assembly, semiconductor processing, or advanced packaging technology development
- Experience with wafer-level assembly materials and processes (epoxy, mold materials, annealing)
- Demonstrated ability to lead programs from strategy through high-volume production
- Familiarity with advanced packaging technologies (hybrid bonded interconnects, RDL-based packaging, ultra-fine pitch solder)
- Experience in design rule development for manufacturability and reliability (REL)
Intel Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Intel and has not been reviewed or approved by Intel.
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Parental & Family Support — Family-building and caregiving supports are extensive, including fertility coverage, adoption assistance, paid parental leave, childcare and elder care resources, and a structured reintegration for new parents. These benefits are positioned as best-in-class elements of the package.
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Leave & Time Off Breadth — Time off includes generous PTO, a paid sabbatical after extended tenure, and multiple leave types such as family, medical, bereavement, and military. This breadth enables employees to disconnect, recharge, and manage life events.
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Retirement Support — Long-term savings are bolstered by a competitive 401(k) match and access to deferred compensation for eligible levels, alongside stock purchase opportunities. These programs are highlighted as strong tools for financial security.
Intel Insights
What We Do
Our mission is to shape the future of technology to help create a better future for the entire world, that’s the power of Intel Inside. With more ingenuity and creativity inside, our work is at the heart of countless innovations. From major breakthroughs to things that make everyday life better— they’re all powered by Intel technology. With a career at Intel, you can help make the future more wonderful for everyone.
