Module Development Engineer

Posted 22 Days Ago
Be an Early Applicant
Hillsboro, OR, USA
In-Office
99K-163K Annually
Mid level
Artificial Intelligence • Cloud • Information Technology • Software
Creating world-changing technology that enriches the lives of every person on earth.
The Role
Designs and develops thermal, mechanical, and electrical packaging media for semiconductor modules. Defines package specs, runs testing and qualification, specifies materials, supports vendors and QA, solves packaging/process problems, and manages projects from concept through sustaining.
Summary Generated by Built In
Job Details:

Job Description: 

Module Packaging Media Engineers provide project management, media design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units.

The responsibilities include but are not limited to the following:

  • Responsible for the thermal/mechanical/electrical design, analysis, and development of media.
  • Defines overall package performance and specification and realizes technology certification through qualification plans and data collection.
  • Conducts tests and research on basic materials and properties.
  • Establishes material specifications for contract assemblers and raw material vendors and interfaces with Quality Assurance and Purchasing regarding material quality and vendor performance.
  • Provides consultation concerning packaging problems and improvements in the packaging process.
  • Responds to customer/client requests or events as they occur.
  • Develops solutions to problems utilizing formal education and engineering judgment.

Qualifications:

 

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

Candidate must possess a bachelor’s degree in mechanical engineering or related STEM field and 4+ years of experience OR a Master’s degree in the same fields with 2+ year of experience.

Experience listed above should be a combination of the following:

Mechanical Design, CAD/Solidworks/Driveworks/RSS analysis/Geometric Dimensioning/Finite Eliminate Analysis experience. Full cycle project management experience.

Preferred Qualifications:

3+ years of experience with one or more of the following:

Material handling systems including high speed/accuracy pick-n-place, motion control and vision systems.
Fundamental science and engineering concepts in development to create a novel design solutions for high volume manufacturing process.
Stakeholder management (ex.supplier/ project management/internal partner management)
Semiconductor devices and packaging processes and technology.
Technical and analytical skills, with the knowledge of statistical design of experiments and problem-solving techniques.

Media design experience

Equipment collateral experience

          

Job Type:Experienced Hire

Shift:Shift 1 (United States of America)

Primary Location: US, Oregon, Hillsboro

Additional Locations:

Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.



Annual Salary Range for jobs which could be performed in the US: $99,030.00-162,500.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

*

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

Skills Required

  • Bachelor's degree in mechanical engineering or related STEM field and 4+ years of experience OR Master's degree with 2+ years of experience.
  • Mechanical design experience.
  • CAD experience (Solidworks, Driveworks).
  • RSS analysis, Geometric Dimensioning, Finite Element Analysis experience.
  • Full cycle project management experience.

Intel Compensation & Benefits Highlights

The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Intel and has not been reviewed or approved by Intel.

  • Leave & Time Off Breadth Sabbaticals and paid time off are highlighted as signature elements, with an established program offering four weeks after four years or eight weeks after seven years. This distinctive time off is positioned as a meaningful part of the overall package.
  • Parental & Family Support Paid bonding leave of 12 weeks and a New Parent Reintegration program, plus fertility benefits around $40,000 and up to $15,000 adoption reimbursement with no lifetime cap, are clearly stated. These programs are presented as standout components alongside broader family support resources.
  • Healthcare Strength Multiple medical plan options with 2026 updates, a shift to Spring Health for EAP, and in‑network virtual medical visits covered at 100% beginning in 2026 indicate a comprehensive offering. These features signal an emphasis on robust medical access and mental health support.

Intel Insights

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The Company
HQ: Santa Clara, CA
75,000 Employees
Year Founded: 1968

What We Do

Our mission is to shape the future of technology to help create a better future for the entire world, that’s the power of Intel Inside. With more ingenuity and creativity inside, our work is at the heart of countless innovations. From major breakthroughs to things that make everyday life better— they’re all powered by Intel technology. With a career at Intel, you can help make the future more wonderful for everyone.

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