Heterogenous Integration Process Engineer

Let’s search for your next career at TEL. Use the form below to search our current opportunities and then apply. Please consider joining our Talent Community so that we may continue to engage with you.

Job Description

Heterogenous Integration Process Engineer

The brightest of the bright. Our scientists at TEL Technology Center, America, LLC, work to integrate new and innovative technology into the products and tools we currently have as well as develop new tools to streamline our current processes. We are a representation of TEL's world class technology enabling us to move to the forefront of today's marketplace. Utilizing original development strategies and processes has fully equipped us with the capability to provide unparalleled service systems that have been utilized on a global scale.
Group/Role Overview 

The 3DI Technology Group at TTCA focuses on Heterogenous Integration and key module developments in the area including but not limit to Fusion and Hybrid Bonding in both wafer to wafer (W2W) level and chip to wafer (C2W) level, Wafer Thinning and TSV formation for use in semiconductor manufacturing. We optimize processes and hardware used to stack integrated circuits for advanced 3D applications including CMOS image sensors, memory devices, and logics. As a 3DI R&D Engineer you will be an integral part our team working on advanced wafer and die stacking technologies. You will work with fundamental R&D, process development and technical marketing teams to define the next generation of heterogeneous processes and equipment design concepts in a cross-functional global working environment.

Responsibilities:

• Technical lead for a team of researchers to deliver on goals in C2W or D2W.
• Aligns organizational goals with technical vision, formulates technical strategies.
• Self-motivated and works closely with cross-functional and global team and with joint development partners.
• Performs fundamental research, process development and implement new hardware concept to enable innovative tool solution in 3DI. 
• Performs process technology feasibility studies through theoretical simulations and/or practical engineering experiments.
• Develops and mentors other technical leaders in the company and be a role model of TEL values.
• Demonstrates deep technical knowledge and provide support to various internal and external customer projects in execution.
• Engage with our business unit to provide technical support as needed.

Qualifications:

• Ph. D Degree in Nanotechnology, Material Science, Mechanical, Chemical, or Electrical Engineering, Chemistry, Physics.
• +6 years of semiconductor industry experience in research and development.
• In-depth knowledge and extensive experience on advanced packaging.
• Excellent problem-solving and analytical skills
• Strong organizational skills: demonstrated ability to manage multiple tasks simultaneously and able to react to shifting priorities to meet business needs.
• Awareness of packaging roadmaps and business models across the hardware stack and services
• Excellent communication skills with the ability to convey complex technical concepts to both technical and non-technical stakeholders.
• Strong publication record, patents, or contributions to industry standards are highly desirable.
• Demonstrated leadership experience in guiding cross-functional teams and driving technical excellence.
• Must be fluent in English with excellent verbal and written communication skills.

• Must possess the ability and desire to work as a part of a multicultural team.

Travel: up to 20%

Benefits:

• Medical, Vision, and Dental Insurance
• Paid Personal Leave
• Holiday Time
• 401k Retirement Plans and Employer Matching
• Tuition Reimbursement
• Incentives for Healthy Lifestyles
• Employee Assistance Programs

The physical demands described herein are representative of those that must be met by an employee to successfully perform the essential functions of this job. This job operates in an office setting. This role routinely uses standard office equipment such as computers, phones, photocopiers, and filing cabinets. This is a largely sedentary role; however, some filing is required, which would require the ability to lift files, open filing cabinets and bend or stand as necessary. This position requires the ability to occasionally lift office products and supplies, up to 35 pounds. This position also requires 4 to 6 hours per day at a computer screen/keyboard.

Equal Opportunity Employer/Minorities/Females/Disabled/Veterans

Salary Ranges$111,724.93 - $138,774.94

Individual pay is determined based on multiple factors, including but not limited to location, experience, skills, job-related knowledge, relevant education, certifications, and/or training. In addition to base salary, we offer (full time regular employees ) a comprehensive benefits package and for certain roles eligibility in our bonus plan and long-term incentives as applicable. The talent advisor can share more details about total compensation for the role in your location during the hiring process.

Diversity creates an innovative culture. TEL US is an Equal Employment Opportunity / Affirmative Action employer and all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, age, national origin, protected veteran status, disability status, sexual orientation, gender identity or expression, marital status, genetic information, or any other characteristic protected by law.

SubsidiaryTEL TECHNOLOGY CENTER, AMERICA, LLC.