Electro Mechanical Engineer Stf

Posted 5 Days Ago
Be an Early Applicant
2 Locations
Hybrid
105K-195K Annually
Senior level
Aerospace • Security • Cybersecurity • Industrial
The Role
Designs, prototypes, tests, and validates advanced 2D/3D heterogeneous electronic packaging for aerospace and defense systems. Responsibilities include mechanical and electrical design, thermal management, high-speed interconnects, failure analysis, requirements management, documentation, trade studies, and technology readiness reviews. Collaborates with cross-functional engineering teams, mentors junior engineers, evaluates semiconductor packaging technologies, and supports flight-qualified hardware development.
Summary Generated by Built In
Standard Job Description

You will be the Electro Mechanical Engineer for the Advanced Electronics Packaging team at Lockheed Martin Missiles & Fire Control. Our team pioneers 2 D/3 D heterogeneous packaging concepts, integrating thin film, semiconductor and high performance thermal management technologies to create next generation electronic systems for aerospace and defense missions.


What You Will Be Doing
As the Electro Mechanical Engineer you will design, prototype and test cutting edge packaging solutions while collaborating with electrical, systems, test and product design engineers. You will work side by side with Lockheed Martin’s senior Advanced Packaging SME, gaining hands on experience with emerging semiconductor manufacturing processes and translating them into flight qualified hardware. Your responsibilities will include:


• Conceiving and modeling 2 D/3 D heterogeneous package architectures that meet size, weight, power and reliability targets.
• Developing detailed mechanical and electrical designs for thin film interconnects, semiconductor dies, and advanced thermal management features.
• Creating and executing test plans to validate electrical performance, thermal behavior and mechanical integrity of packaging prototypes.
• Performing failure analysis and iterating designs based on test data, simulation results and manufacturing feedback.
• Preparing comprehensive design documentation, including drawings, BOMs, specifications and verification reports.
• Collaborating with cross functional teams (electrical, systems, test, product design) to ensure seamless integration of packaging solutions into larger systems.
• Mentoring junior engineers and supporting the Advanced Packaging SME in knowledge transfer and technical guidance.
• Staying current with emerging semiconductor and packaging technologies and recommending new approaches for program adoption.
• Supporting technology readiness reviews and contributing to risk assessment activities for new packaging concepts.


Why Join Us

Do you want to be part of a company culture that empowers employees to think big, lead with a growth mindset, and make the impossible a reality? We provide the resources and give you the flexibility to enable inspiration and focus. If you have the passion and courage to dream big, work hard, and have fun doing what you love then we want to build a better tomorrow with you.


We offer flexible work schedules to comprehensive benefits investing in your future and security. Learn more about Lockheed Martin’s comprehensive benefits package here.

 

Further Information About This Opportunity:

This position is in Orlando, FL or Grand Prairie,TX.  Discover more about our Orlando, Florida location. Discover more about our Dallas, Texas location.


MUST BE A U.S. CITIZEN - This position is located at a facility that requires special access. The selected candidate must be able to obtain a secret clearance. 

Basic Qualifications

-Minimum 8 years of professional experience in Electromechanical Engineering or related discipline with a Bachelor of Science degree in Electrical Engineering, Mechanical Engineering, or a closely related STEM field from an accredited university
or Minimum 12 years of professional experience in Electromechanical Engineering or related discipline without a degree
-Microelectronics & Layout Design: Proven experience in microelectronics design, including Circuit Card Assembly (CCA) / Printed Wiring Board (PWB/PCB) design, and flex circuit design.
-Interconnect Engineering: Experience with cable harness concepts for subsystem interfaces and generating detailed functional wiring diagrams.
-High-Speed Systems: Familiarity with high-speed applications and associated PWB layout constraints.
-Requirements Management: Experience capturing, flowing down, and deriving technical requirements for complex electromechanical designs.
-Component Selection: Experience managing parts, materials, and process selections for electronic hardware

Desired Skills

-Advanced Packaging Architecture: Experience with System-on-Chip (SOC) / Multi-Chip Package (MCP) solutions and 2D/3D heterogeneous integration concepts.
-Validation & Test Integration: Familiarity with Application-Specific Integrated Circuit (ASIC) verification and validation testing requirements at the circuit card level.
-Trade Studies & Optimization: Demonstrated ability to perform comprehensive design trade studies evaluating cost, weight, thermal packaging, and power benefits.
-Systems Engineering Tools: Familiarity with Model-Based Systems Engineering (MBSE) methodologies and CAMEO software

Pay Information

Full-Time Salary Range: $104900.00 - $194700.00

At Lockheed Martin, we know mission success starts with taking care of our people. Our Total Rewards program is designed to attract top talent, support your well-being, and help you grow—both professionally and personally.

The salary range for this position is as listed on the requisition. Please note that the salary information listed is a general guideline only. Lockheed Martin considers factors such as (but not limited to) scope and responsibilities of the position, candidate's work experience, education/ training, key skills as well as market(work location) and business considerations when extending an offer.  

Benefits offered: Medical, Dental, Vision, Flexible work arrangements and schedules (e.g., 4x10), 401(k) match, Paid time off, Holidays, Parental Leave, EAP, Flexible Spending Accounts, Education Assistance, Life Insurance, Short-Term Disability, and Long-Term Disability.

  • Annual short-term and/or long-term incentive compensation programs may be offered depending on the position. Payments under these annual programs are not guaranteed and can vary from year to year and are tied to a range of performance metrics.
  • For (Washington state applicants only) Non-represented full-time employees: accrue at least 10 hours per month of Paid Time Off (PTO) to be used for incidental absences and other reasons; receive at least 90 hours for holidays. Represented full time employees accrue 6.67 hours of Vacation per month; accrue up to 52 hours of sick leave annually; receive at least 96 hours for holidays. PTO, Vacation, sick leave, and holiday hours are prorated based on start date during the calendar year.

Skills Required

  • Bachelor of Science degree in Electrical Engineering, Mechanical Engineering, or a closely related STEM field from an accredited university, plus at least 8 years of professional experience in electromechanical engineering or a related discipline
  • At least 12 years of professional experience in electromechanical engineering or a related discipline without a degree
  • Experience in microelectronics design, including Circuit Card Assembly, Printed Wiring Board or Printed Circuit Board design, and flex circuit design
  • Experience with cable harness concepts for subsystem interfaces and generating detailed functional wiring diagrams
  • Familiarity with high-speed applications and associated Printed Wiring Board layout constraints
  • Experience capturing, flowing down, and deriving technical requirements for complex electromechanical designs
  • Experience managing parts, materials, and process selections for electronic hardware
  • Experience with System-on-Chip or Multi-Chip Package solutions and 2D/3D heterogeneous integration concepts
  • Familiarity with ASIC verification and validation testing requirements at the circuit card level
  • Ability to perform design trade studies evaluating cost, weight, thermal packaging, and power benefits
  • Familiarity with Model-Based Systems Engineering methodologies and CAMEO software
  • U.S. citizenship
  • Ability to obtain a Secret security clearance

Lockheed Martin Compensation & Benefits Highlights

The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Lockheed Martin and has not been reviewed or approved by Lockheed Martin.

  • Retirement Support — Retirement benefits are described as a standout element, with a strong 401(k) program and options like an employee stock purchase plan. Feedback suggests these features meaningfully enhance total compensation and long‑term financial security.
  • Healthcare Strength — Healthcare coverage is portrayed as comprehensive from day one, with multiple plan options, mental health resources, and virtual care. Wellness supports such as on‑site services and preventive programs are also highlighted.
  • Flexible Benefits — Work arrangements often include compressed schedules and telework, contributing to a favorable work‑life balance. Feedback suggests this flexibility is a key reason many view the overall package positively.

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The Company
HQ: Bethesda, MD
108,588 Employees
Year Founded: 1912

What We Do

Customer Focus, Innovation and Purpose are Built Into Everything We Do. Lockheed Martin. Your Mission is Ours ™. Headquartered in Bethesda, Maryland, Lockheed Martin is a global security and aerospace company principally engaged in the research, design, development, manufacture, integration and sustainment of advanced technology systems, products and services.

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