Hon Hai Technology Group (Foxconn)
Jobs
Director of Technical Leader for Advanced PBCA and System Integration-Vietnam
Director of Technical Leader for Advanced PBCA and System Integration-Vietnam
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The Role
The role involves leading advanced PCBA and system integration manufacturing capabilities, mentoring teams, and collaborating with clients and R&D to develop technologies and processes.
Summary Generated by Built In
Responsibilities:
• Lead the Development of Advanced PCBA / SI Mfg capabilities in the Vietnam sites
• Collaborate and interact with customer technical team and Foxconn R&D to co-develop Test
Vehicle, Technical Spec/Checklist, Reliability Testing, DFM and Process for new assembly, rework
technology, component packaging and / or process material. Fostering strong and collaborative
relationships with clients and internal cross functional teams.
• Lead the Mfg technical team and work the labs at Vietnam and global labs to perform all the process
and reliability evaluation regularly. .
• Support Foxconn central and other sites and BUs to share and develop new Advanced Mfg
Capabilities .
• Develop and mentor leaders to have good people skill and as well-rounded, high-potential technical
professionals.
Requirements:
1. Bachelor’s or Master’s degree in Engineering, Material Science, Statistics, or related fields.
2. Minimum of 10 years of Mfg Engineering and Process / Technology Development experience for
PCBA and SI and minimum 5 years in management position.
3. At least 5 years of experience in electronic manufacturing within a Contract Manufacturer (CM)
environment with a proven record.
4. Knowledge and experience of PCBA with large size BGA (> 80 mm x 80 mm), Co-Packaged
Optics, Thermal Compression Bonding, High speed connector / flying cable, and Liquid Cooling are
preferable,
5. Strong English communication skills (listening, speaking, reading, and writing) and excellent
interpersonal skill
6. Ability to lead projects from beginning to end and drive initiatives with a global team.
7. Ability to work under pressure.
8. Work location is in Vietnam
• Lead the Development of Advanced PCBA / SI Mfg capabilities in the Vietnam sites
• Collaborate and interact with customer technical team and Foxconn R&D to co-develop Test
Vehicle, Technical Spec/Checklist, Reliability Testing, DFM and Process for new assembly, rework
technology, component packaging and / or process material. Fostering strong and collaborative
relationships with clients and internal cross functional teams.
• Lead the Mfg technical team and work the labs at Vietnam and global labs to perform all the process
and reliability evaluation regularly. .
• Support Foxconn central and other sites and BUs to share and develop new Advanced Mfg
Capabilities .
• Develop and mentor leaders to have good people skill and as well-rounded, high-potential technical
professionals.
Requirements:
1. Bachelor’s or Master’s degree in Engineering, Material Science, Statistics, or related fields.
2. Minimum of 10 years of Mfg Engineering and Process / Technology Development experience for
PCBA and SI and minimum 5 years in management position.
3. At least 5 years of experience in electronic manufacturing within a Contract Manufacturer (CM)
environment with a proven record.
4. Knowledge and experience of PCBA with large size BGA (> 80 mm x 80 mm), Co-Packaged
Optics, Thermal Compression Bonding, High speed connector / flying cable, and Liquid Cooling are
preferable,
5. Strong English communication skills (listening, speaking, reading, and writing) and excellent
interpersonal skill
6. Ability to lead projects from beginning to end and drive initiatives with a global team.
7. Ability to work under pressure.
8. Work location is in Vietnam
Skills Required
- Bachelor's or Master's degree in Engineering, Material Science, Statistics, or related fields.
- Minimum of 10 years of manufacturing engineering and process/technology development experience for PCBA and SI.
- Minimum 5 years in a management position.
- At least 5 years of experience in electronic manufacturing within a Contract Manufacturer (CM) environment.
- Knowledge and experience of PCBA with large size BGA, Co-Packaged Optics, Thermal Compression Bonding, etc.
- Strong English communication skills and excellent interpersonal skills.
- Ability to lead projects from beginning to end and drive initiatives with a global team.
- Ability to work under pressure.
Hon Hai Technology Group (Foxconn) Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Hon Hai Technology Group (Foxconn) and has not been reviewed or approved by Hon Hai Technology Group (Foxconn).
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Healthcare Strength — Health coverage in the U.S. includes medical, dental, and vision, supported by EAP services and on‑campus or site health resources in some regions. These offerings align with large‑employer standards and are publicly emphasized across multiple locations.
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Retirement Support — Retirement provisions include a U.S. 401(k) plan and a formal pension framework in Taiwan that follows local law. This provides structured long‑term savings mechanisms across major geographies.
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Parental & Family Support — Family‑oriented benefits include childbirth allowances and transportation subsidies during pregnancy, with additional welfare programs and childcare supports referenced in corporate materials. These supports broaden the non‑salary value proposition in several regions.
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The Company
What We Do
Hon Hai Technology Group (Foxconn) is the world's largest electronics manufacturer and a leading technological solution provider, established in Taiwan in 1974. It leverages expertise in software and hardware to integrate manufacturing systems with emerging technologies, expanding into electric vehicles, digital health, and robotics, with a focus on AI, semiconductors, and next-generation communications.
