Director of Technical Leader for Advanced PBCA and System Integration-Vietnam
• Lead the Development of Advanced PCBA / SI Mfg capabilities in the Vietnam sites
• Collaborate and interact with customer technical team and Foxconn R&D to co-develop Test
Vehicle, Technical Spec/Checklist, Reliability Testing, DFM and Process for new assembly, rework
technology, component packaging and / or process material. Fostering strong and collaborative
relationships with clients and internal cross functional teams.
• Lead the Mfg technical team and work the labs at Vietnam and global labs to perform all the process
and reliability evaluation regularly. .
• Support Foxconn central and other sites and BUs to share and develop new Advanced Mfg
Capabilities .
• Develop and mentor leaders to have good people skill and as well-rounded, high-potential technical
professionals.
Requirements:
1. Bachelor’s or Master’s degree in Engineering, Material Science, Statistics, or related fields.
2. Minimum of 10 years of Mfg Engineering and Process / Technology Development experience for
PCBA and SI and minimum 5 years in management position.
3. At least 5 years of experience in electronic manufacturing within a Contract Manufacturer (CM)
environment with a proven record.
4. Knowledge and experience of PCBA with large size BGA (> 80 mm x 80 mm), Co-Packaged
Optics, Thermal Compression Bonding, High speed connector / flying cable, and Liquid Cooling are
preferable,
5. Strong English communication skills (listening, speaking, reading, and writing) and excellent
interpersonal skill
6. Ability to lead projects from beginning to end and drive initiatives with a global team.
7. Ability to work under pressure.
8. Work location is in Vietnam
Skills Required
- Bachelor's or Master's degree in Engineering, Material Science, Statistics, or related fields
- Minimum of 10 years of Mfg Engineering and Process/Technology Development experience
- Minimum 5 years in a management position
- At least 5 years of experience in electronic manufacturing within a Contract Manufacturer (CM)
- Knowledge and experience of PCBA with large size BGA, Co-Packaged Optics, Thermal Compression Bonding, High speed connector, and Liquid Cooling
- Strong English communication skills and excellent interpersonal skills
- Ability to lead projects from beginning to end and drive initiatives with a global team
- Ability to work under pressure
Foxconn Industrial Internet USA Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Foxconn Industrial Internet USA and has not been reviewed or approved by Foxconn Industrial Internet USA.
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Healthcare Strength — Health coverage includes medical, dental, vision, mental-health support, and access to onsite care at the Wisconsin campus. Coverage is often characterized as comprehensive, with some roles noting strong affordability.
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Leave & Time Off Breadth — PTO, paid holidays, sick time, and bereavement leave are standard parts of the package. Time off is frequently described as a strong aspect of the offering.
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Affordable Benefits — Employee-only medical premiums can be very low or even $0 on select plans. This affordability helps total rewards feel more competitive despite modest base pay in some roles.
Foxconn Industrial Internet USA Insights
What We Do
Foxconn Industrial Internet USA (Fii USA) is a global leading professional design and manufacturing service provider of communication network equipment, cloud service equipment, precision tools, and industrial robots. Our goal is to provide our customers with intelligent manufacturing services for new forms of electronic equipment products centered on the industrial internet platform. Our Vision: Fii USA is creating technology solutions in 5G, IoT, and Industrial AI to aid businesses in transforming to the Industry 4.0 environment. Our Philosophy: Fii USA will leverage its’ 30 years’ experience in contract manufacturing to develop technology solutions that will guide businesses on their Industry 4.0 journey. We are building industrial IoT ecosystems grounded solutions that utilize 5G communication technology, 8K imaging data, Industrial AI, and high-performance computing. Our solutions are easily implemented, modified, and scaled to enable participation in the modern connected landscape.
