At Intel, we create world-changing technology that improves the life of every person on the planet. By joining the Advanced Packaging Technology and Manufacturing (APTM) Yield Group, you will be part of a team tasked with the critical objective of driving yield and defect improvement across our entire advanced packaging portfolio. We solve highly complex physical and electrical problems to ensure our latest packaging technologies successfully transition from development into high-volume manufacturing.
We are seeking a APTM Yield Analysis/Device Engineer to drive technology development, transfers, and manufacturing ramps in Rio Rancho, New Mexico. In this role, you will analyze massive, multi-dimensional datasets to identify where manufacturing processes, test content, and inline metrologies must be optimized. Acting as a strategic technical advisor, you will set clear engineering priorities, lead cross-functional problem-solving initiatives, and directly influence our technology yield roadmap.
Key Responsibilities:
- Data Synthesis & Insight Extraction: Extract insights from structured and unstructured factory datasets using statistical methods, machine learning, and tools like JMP or Python.
- Failure Correlation: Correlate electrical and physical failure mechanisms by utilizing deep knowledge of Failure Analysis (FIFA), Design for Test (DFT), Sort/Test, and Integration/Process flows.
- Defect System Optimization: Manage inline defect metrologies, evaluate detection capabilities, and drive inline defect reduction programs across the factory.
- Technical Program Leadership: Lead a small group of engineers (direct or indirect) to execute experiments, resolve nonstandard yield events, and ensure smooth technology transfers to High-Volume Manufacturing (HVM).
- Stakeholder Reporting & Collaboration: Deliver detailed technical reports summarizing yield and device health to upstream and downstream partners, establishing clear action plans to achieve best-in-class yield levels.
As a Successful Candidate, You Will Bring:
- Leadership & Cross-Functional Influence: Instills a high-performing team culture with a willingness to lead, guide, and collaborate across diverse organizational boundaries.
- Tolerance for Ambiguity & Flexibility: Adapts rapidly to changing priorities, new technical fields of study, and fluctuating business demands.
- Strategic Prioritization & Autonomy: Works with minimal direct oversight to prioritize critical path items and resolve complex, unstructured technical issues.
- Executive Communication: Delivers concise, high-impact technical presentations to influence decision-making among diverse groups at all levels.
Apply today to join Intel New Mexico's APTM Yield Group and lead the technical breakthroughs that power global computing. Let's build the future together.
Qualifications:You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience would be obtained through a combination of prior education level classes, and current level school classes, projects, research and relevant previous job and/or internship experience.
Minimum Qualifications:
- Bachelor's degree in Materials Science, Mechanical Engineering, Computer Science, Information Systems, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related technical discipline with 5+ years of semiconductor industry experience.
- OR Master's degree in a matching discipline with 3+ years of semiconductor industry experience.
- OR PhD in a matching discipline with 1+ years of semiconductor industry experience.
Preferred Qualifications:
- 2+ years of experience in:
- JMP, Python, or alternative data engineering software for statistical data analysis.
- Applying statistical analysis to high-volume manufacturing data.
- Utilizing structured technical problem-solving methodologies (e.g., Model-Based Problem Solving).
- Linking product design, circuit architecture, or DFT to yield analysis.
- Working directly with inline defect metrology equipment or defect classification systems.
Job Type:Experienced HireShift:Shift 1 (United States of America)Primary Location: US, New Mexico, AlbuquerqueAdditional Locations:Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $122,440.00-232,190.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.Skills Required
- Bachelor's degree in Materials Science, Mechanical Engineering, Computer Science, Information Systems, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related technical discipline, plus 5 or more years of semiconductor industry experience
- Master's degree in a matching technical discipline, plus 3 or more years of semiconductor industry experience
- PhD in a matching technical discipline, plus 1 or more years of semiconductor industry experience
- Experience with JMP, Python, or alternative data engineering software for statistical data analysis
- Experience applying statistical analysis to high-volume manufacturing data
- Experience using structured technical problem-solving methodologies, such as Model-Based Problem Solving
- Experience linking product design, circuit architecture, or Design for Test to yield analysis
- Experience working directly with inline defect metrology equipment or defect classification systems
Intel Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Intel and has not been reviewed or approved by Intel.
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Leave & Time Off Breadth — Sabbaticals and paid time off are highlighted as signature elements, with an established program offering four weeks after four years or eight weeks after seven years. This distinctive time off is positioned as a meaningful part of the overall package.
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Parental & Family Support — Paid bonding leave of 12 weeks and a New Parent Reintegration program, plus fertility benefits around $40,000 and up to $15,000 adoption reimbursement with no lifetime cap, are clearly stated. These programs are presented as standout components alongside broader family support resources.
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Healthcare Strength — Multiple medical plan options with 2026 updates, a shift to Spring Health for EAP, and in‑network virtual medical visits covered at 100% beginning in 2026 indicate a comprehensive offering. These features signal an emphasis on robust medical access and mental health support.
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