The Role
Develop and qualify 3D integration technologies for superconducting quantum processors, including flip-chip bonding, TSVs, airbridges, multilayer wiring, and wafer-level assembly. Coordinate integration testing, establish scalable procedures, investigate technical anomalies, assess interconnect reliability, and collaborate with fabrication, packaging, foundry, and equipment partners. The role requires hands-on cleanroom experience and end-to-end process development, from test-vehicle design through experimental validation and go/no-go decisions.
Summary Generated by Built In
Alice & Bob is developing the first universal, fault-tolerant quantum computer to solve the world’s hardest problems.
The quantum computer we envision building is based on a new kind of superconducting qubit: the Schrödinger cat qubit 🐈⬛. In comparison to other superconducting platforms, cat qubits have the astonishing ability to implement quantum error correction autonomously!
We're a diverse team of 250+ brilliant minds from over 35 countries united by a single goal: to revolutionise computing with a practical fault-tolerant quantum machine. Are you ready to take on unprecedented challenges and contribute to revolutionising technology? Join us, and let's shape the future of quantum computing together!
Alice & Bob is developing the first universal, fault-tolerant quantum computer to solve the world’s hardest problems.
The quantum computer we envision building is based on a new kind of superconducting qubit: the Schrödinger cat qubit 🐈⬛. In comparison to other superconducting platforms, cat qubits have the astonishing ability to implement quantum error correction autonomously!
We're a diverse team of 250+ brilliant minds from over 35 countries united by a single goal: to revolutionise computing with a practical fault-tolerant quantum machine. Are you ready to take on unprecedented challenges and contribute to revolutionising technology? Join us, and let's shape the future of quantum computing together!
We are seeking a Senior 3D Integration Engineer H/F to join the Process Integration team within the Quantum Hardware & Infrastructure department.
This position sits at the intersection of nanofabrication, assembly and scalable QPU design, working closely with teams across the hardware organization — from roadmap to fabrication, packaging, and validation.
Responsabilities
- Identify and benchmark enabling 3D assembly technologies for QPUs in accordance with superconducting-circuit constraints: material/process compatibility, microwave performance, and cryogenic reliability
- Develop and qualify the 3D integration building blocks — airbridges, flip-chip bonding, TSV, multi-layer wiring (MLW), superconducting interconnects, and wafer-level assembly — in close collaboration with fabrication and packaging teams
- Develop and coordinate integration test plans in collaboration with cross-functional teams
- Establish scalable, well-documented integration procedures to support system growth
- Investigate and resolve integration issues and technical anomalies, ensuring alignment with specifications and overall performance targets
- Act as the technical point of contact for 3D integration with external foundries, packaging partners, and equipment vendors, in close collaboration with our foundry partnerships expert
Requirements
- PhD or MSc in physics, materials science, electrical engineering, or microelectronics, with strong hands-on cleanroom experience
- 3+ years of demonstrated 3D integration experience, in flip-chip / bump bonding and TSV processing.
- Proven track record of developing and qualifying an integration process brick end to end — from literature survey and test-vehicle design through experiments, data analysis, and go/no-go decision
- Solid grounding in failure analysis and reliability assessment of 3D interconnects: cross-sectioning, SEM, X-ray inspection / tomography, profilometry, electrical test structures
- Understanding of superconducting QPU fabrication and of what cryogenic operation demands from materials and interfaces is a plus
Recruitment process
- Screening Call with Alexandra Talent Acquisition Specialist (30 min)
- Hiring Manager Interview with the Hiring Manager (45 min)
- Technical Interview/Presentation with the Team (90 min)
- Leadership and Fit Interview (60 min)
Benefits:
- Our success is your success: own it with our BSPCE plan
- Direct IP Compensation: Earn substantial bonuses for driving the core patents that define our quantum architecture.
- Flexible remote policy, up to 40 % a month
- A Parental plan including additional benefits such as crèche support or additional days-off to take care of under 12 years old children
- Subsidized membership with Urban Sports Club
- Mental health support with moka.care
- 25-day vacation policy (as per French law) + RTT
- Half of transportation cost coverage (as per French law), or yearly allowance for the die-hard bicycle users
- Competitive health coverage, with Alan.
- Meal vouchers with Swile, as well as access to a fully equipped and regularly stocked kitchen
- French language courses covered by the company for those interested
Research shows that women might feel hesitant to apply for this job if they don't match 100% of the job requirements listed. This list is a guide, and we'd love to receive your application even if you think you're only a partial match. We are looking to build teams that innovate, not just tick boxes on a job spec.
You will join of one of the most innovative startups in France at an early stage, to be part of a passionate and friendly team on its mission to build the first universal quantum computer!
We love to share and learn from one another, so you will be certain to innovate, develop new ideas, and have the space to grow.
Skills Required
- PhD or MSc in physics, materials science, electrical engineering, or microelectronics
- Strong hands-on cleanroom experience
- At least 3 years of demonstrated 3D integration experience
- Experience with flip-chip or bump bonding and TSV processing
- Track record of developing and qualifying an integration process brick end to end
- Experience with literature surveys, test-vehicle design, experiments, data analysis, and go/no-go decisions
- Grounding in failure analysis and reliability assessment of 3D interconnects
- Experience with cross-sectioning, SEM, X-ray inspection or tomography, profilometry, and electrical test structures
- Understanding of superconducting QPU fabrication and cryogenic materials and interface requirements
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The Company
What We Do
Founded in 2020, Alice & Bob secured $30 M funding in Series A. Today, we're recognized as one of the leaders in Quantum Computing. Our cat qubits are error corrected by design, reducing hardware requirements by up to 200 times compared to other platforms enabling fault-tolerant quantum computing at scale. Our headquarters is located in Paris, with offices in Boston, MA. We are 80+ smart and dedicated innovators, coming from 17+ countries and growing by the day. We are committed to one mission: build a useful quantum computer. Check open positions: bit.ly/joinusatAB
