Jobs at Nexperia

Lead and optimize semiconductor mold processes to improve cost, quality, yield, and productivity. Use statistical tools (SPC, DOE, FMEA) to stabilize processes, resolve customer issues, document controls, train engineers, and drive continuous improvement across sites to meet KPIs.

Lead end-to-end R&D and NPI projects for Voltage Translator and Digital Isolator products, managing cross-functional teams to deliver designs, testing, validation, qualification, and market release on time, within budget, and to quality standards. Oversee product pipeline, mitigate risks, coach project leaders, and implement project management best practices to ensure strategic alignment.

Lead development of power MOSFET technology from concept through prototype, validation and industrialisation. Use TCAD/Cadence/Klayout for device and platform design, analyse wafer test/assembly/qualification data, communicate technical findings, and coordinate with R&D, manufacturing, supply chain, vendors and customers.

Lead facility construction and engineering projects to meet time, cost, safety, and production requirements. Standardize specialty gas installation systems, update guidelines, manage contractor welding/test protocols, and coordinate with FM, production, and quality/safety teams to ensure semiconductor-compliant, 24/7-ready installations.

Manage treasury, month-end GL activities, fixed asset and cost accounting, statutory tax and e-invoicing compliance, transfer pricing documentation, audits, corporate governance, and finance process improvements while ensuring accurate reporting and internal controls.

Design and simulate transistor-level analog and mixed-signal IC blocks, create behavioral models, supervise physical layout, verify chip performance, support tape-out and silicon debug, collaborate with test/validation/packaging teams, and contribute to product definition and IP protection.

Lead regional marketing, pricing, and business development for GaN and SiC products. Develop go-to-market and channel strategies, manage RFQs and negotiations, generate and convert leads, analyze market and pricing intelligence, and collaborate with sales and partners to drive revenue, ASP, and market share.

The Sr Product Engineer oversees product performance from assembly to test, guiding engineers to improve quality and yields through data analysis and process optimization while leading product initiatives and training team members.

Lead multi-site GaN R&D programs as a technical authority to advance GaN device and product performance, drive roadmaps, deliver innovative solutions, mentor engineers, improve processes, and align device-level design with system-level applications and stakeholder needs.

Drive system-level engagement for wide-bandgap power semiconductors by delivering application-focused engineering solutions, reference designs, demos, and technical collateral; provide subsystem design, debug, on-site customer support, and translate customer requirements into product and roadmap inputs while collaborating with R&D, FAE, sales, and marketing.

Lead a project team to ensure successful execution of semiconductor manufacturing projects, managing timelines, risks, and team performance while ensuring quality compliance and improvements.

Design transistor-level analog and mixed-signal IC layouts, manage project layout queues and timelines, mentor and supervise contract layout resources, document designs, collaborate with design/process/packaging/IP teams, contribute to product definitions, and develop novel layouts for IP protection.

Design and integrate mechanical structures for power modules and packages (housings, substrates, interconnects, cooling). Create 3D CAD models and drawings, ensure assembly-process compatibility (sintering, soldering, wire/clip bonding, potting), collaborate with process engineers and suppliers, support prototyping/testing, and drive DFM/DFR and documentation. Role focuses on SiC/GaN solutions for traction and industrial applications; travel ~25%.

Lead and manage analog/mixed-signal power IC design for Power Path products from concept to Release-for-Supply. Oversee architecture, transistor-level design, verification, layout, tape-out, silicon bring-up, and cross-site collaboration; recruit and mentor engineers; drive first-pass silicon success, IP reuse, design-for-quality, and customer engagements.

Serve as the technical interface between product teams and Tier-1 customers for signal-chain ICs. Define system-level validation, develop evaluation boards and reference designs, support silicon validation and design-in, provide technical training and documentation, and assist sales/FAEs with complex customer issues and benchmarks.

Lead system architecture and product definition for signal-chain interfaces and voltage translators. Drive market research, roadmap, cross-functional design trade-offs, silicon validation, test and documentation. Provide customer-facing technical support, lead technical reviews, and partner with foundries and NPI for high-volume semiconductor solutions.

Lead selection and implementation of ESD protection for ICs, design and layout robust I/O circuits, develop and prototype ESD components in CMOS/BCD, perform SPICE simulations and TLP measurements, drive failure analysis and cross-functional validation to ensure silicon meets ESD specs.

Lead failure analysis of semiconductor devices at wafer, package, and die levels using electrical verification, fault isolation, and physical root-cause techniques. Produce detailed FA reports, collaborate with cross-functional teams to resolve reliability and yield issues, operate and maintain FA/EFA equipment, and drive improvements in FA methodologies and turnaround time.

Own and optimize Die Attach and Wire Bond processes and equipment in high-volume R2R semiconductor assembly. Provide daily line support, run DOE/FMEA/root-cause analyses, improve yield and OEE, lead NPI, implement process controls, analyze data with Spotfire/Power BI/Excel, document SOPs, and mentor technicians.

Own and sustain Die Attach and Wire Bond processes and equipment on R2R assembly lines. Provide hands-on setup, calibration, troubleshooting, DOE/FMEA root-cause analysis, NPI support, process optimization (Cpk/OEE), data analysis with Spotfire/Power BI/Excel, implement digital controls, drive continuous improvement, and train technicians to improve yield, uptime, and quality.