Jobs at Nexperia

Manages wafer foundry partnerships, semiconductor supply continuity, manufacturing WIP, yield, KPIs, and new technology or product introduction projects. The role handles excursion containment and recovery, supports process transfer, tape-out, yield enhancement, and process development, and coordinates cross-functional business group and external supplier activities. It requires extensive semiconductor manufacturing, device engineering, NPI, and CMOS or discrete MOSFET process experience.

Supports integration, commissioning, setup, troubleshooting, and optimization of mechatronic modules and semiconductor die bonding equipment. Performs technical analysis, measurements, and investigations; resolves issues with internal stakeholders, customers, and field service engineers; and contributes to assembly-line improvements. Requires mechatronics expertise, control and automation experience, data analysis using MATLAB or Python, quality and problem-solving methodologies, strong communication, and willingness to travel internationally.

Leads semiconductor MOSFET test engineering for new product introductions, package transfers, and production ramp-ups. Develops and optimizes test methods, equipment strategies, and test programs; improves yield, capacity, and bottleneck resolution. Provides expertise in ATE, test handlers, UIS and LCR testing, statistical analysis, hardware development, and test qualification. Supports Malaysian assembly-site deployments, safe launches, customer inquiries, and timely test-job releases.

Leads global HR change management and internal communications, translating HR strategy into coordinated change plans, clear narratives, and consistent employee messaging. Guides leaders and teams through structural, process, and behavioral change while aligning HR functions and business groups. Measures adoption and communication effectiveness, scales innovative HR practices, and partners with Global Communications to support people-centered, outcome-driven HR transformation.

Leads global and regional marketing excellence for the MOS Discretes business group. Responsibilities include developing B2B marketing content and campaigns, shaping product positioning, coordinating communications, supporting strategy initiatives, representing the company at events, aligning product demonstrations with marketing goals, and driving customer expansion. The role also leads a small marketing team and collaborates with regional, product, and business group teams.

Lead manufacturing capital investment and equipment engineering projects from business case through commissioning, operational handover, and benefits realization. Manage scope, schedules, budgets, risks, suppliers, governance, documentation, safety, quality, and stakeholder communication across cross-functional teams. Projects include equipment installations, upgrades, conversions, relocations, and decommissioning within a manufacturing environment.

Own strategic relationships and growth plans for major semiconductor accounts across Southeast Asia. Identify design-in, revenue, and socket-win opportunities; negotiate commercial and supply agreements; forecast business performance; and drive cross-functional execution with Sales, FAE, Product Line, Marketing, and Operations teams. The role requires deep semiconductor ecosystem knowledge, executive customer engagement, technical-commercial expertise, and at least 10 years of relevant experience, including OEM account management.

Develop semiconductor technologies and Trench MOSFET processes across 200mm and 300mm platforms. Lead process integration and development projects, support product qualification, plan and execute Design of Experiments, resolve fab yield issues, establish technical procedures, present findings, and mentor engineers. The role requires expertise across semiconductor fabrication modules, independent project leadership, and collaboration with vendors and fabs. Travel is required up to 10%.

Designs and develops CMOS and BCD integrated circuits for logic and switch product families. Responsibilities include circuit and block-level design, simulations, statistical verification, top-level verification, floor-planning, layout, wiring, specification setting, and product qualification. The role works cross-functionally with design, product, test, and quality engineering teams to deliver cost-effective, high-volume, first-time-right products meeting customer, datasheet, industry, and quality requirements.

Lead development and release of high-volume logic and switch integrated-circuit products. Own full-chip design, product specifications, verification, top-level layout, package integration, ESD robustness, simulations, and qualification. Design in CMOS and BCD processes using Cadence or Synopsys tools, lead cross-functional teams, manage design risks, and develop reusable master designs and derivatives.

Leads development of logic and switch integrated-circuit families, from technology selection and circuit design through validation, qualification, and high-volume production. Owns chip design, family specifications, verification, package-fit layout, I/O and ESD cell development, and cross-functional technical leadership. Requires deep CMOS/BCD, semiconductor physics, analog design, EDA simulation, ESD, packaging, and laboratory characterization expertise.

Acts as the customer quality interface for China, managing complaints from assessment through closure. Coordinates 8D investigations, failure analysis, containment and corrective actions across manufacturing, engineering, quality, and customer teams. Communicates technical updates, supports PCN, PPAP, qualification activities, audits, and quality reviews, while tracking multiple cases and maintaining accurate quality records. Requires strong Chinese and English communication, structured problem-solving, technical understanding, and cross-functional collaboration.

Performs internal audits covering financial reliability, operational effectiveness, risk management, internal controls, and compliance. Reviews financial and operational data, documents processes, interviews stakeholders, identifies control gaps, recommends improvements, prepares audit reports, maintains working papers, and conducts follow-up audits. Supports audit planning, continuous improvement, professional development, and additional activities for the Chief Internal Auditor. International travel of approximately 40% is required.

Supports new semiconductor package and process development from concept through introduction. Responsibilities include process performance monitoring, DFM, risk assessment, DoE analysis, gap analysis, package integration, benchmarking, costing, process-flow creation, and corrective-action implementation. The role collaborates with project leaders, cross-functional teams, and external materials and equipment suppliers to deliver reliable, manufacturable package solutions within project timelines.

Design high-precision mechanical modules and systems for semiconductor manufacturing equipment. Translate requirements into robust concepts, detailed designs, and validated solutions; perform FEM, thermal, vibration, and dynamic analyses; collaborate with multidisciplinary engineering teams; and lead improvements in design quality, manufacturability, cost, performance, and compliance.

Lead development and industrialization of GaN packaging and assembly processes, define package architectures, qualify equipment and suppliers, drive transfer to high-volume manufacturing, troubleshoot production issues, and improve yield and quality using data-driven methods.

Develop and industrialize wafer fabrication processes for wide bandgap semiconductor devices, including SiC MOSFETs and GaN HEMTs. Optimize unit processes, investigate competitor technologies, and collaborate with production, quality, and global partners to establish scalable manufacturing processes in internal fabs and external foundries. The role requires hands-on wafer processing, semiconductor device expertise, project coordination, and travel to support development activities.

Leads warehouse and kitting operations, including inventory control, material flow, receiving, storage, picking, packing, shipping, workforce planning, and KPI management. Oversees supervisors and operational teams, drives Lean and Six Sigma improvements, ensures safety and regulatory compliance, supports audits, and collaborates across supply chain, production, procurement, finance, engineering, and external stakeholders. Uses data analytics, ERP, WMS, automation, and digital technologies to improve productivity, quality, service, and cost efficiency.

Manages multiple multi-site research, study, and NPI projects from initiation through delivery. Develops project plans, resource plans, budgets, forecasts, and business cases while controlling scope, quality, cost, timelines, risks, changes, and issues. Coordinates cross-functional teams, suppliers, foundries, and internal stakeholders; provides project updates to sponsors and leadership; drives mitigation plans and accountability. Also improves project governance, tools, procedures, and knowledge-sharing practices.

Manage production scheduling, order fulfillment, inventory and work-in-progress levels, supply-demand balancing, customer allocations, and delivery commitments. Collaborate with manufacturing, procurement, logistics, sales, and customer service teams to optimize capacity and materials, resolve shortages, improve planning processes, and maintain compliant, efficient operations.