Jobs at Headway Technologies, Inc.

Support and sustain wafer manufacturing processes: integrate new programs, analyze defect/imaging data, run experiments (DOE), use SPC/JMP/Excel for yield improvement, recommend corrective actions, and collaborate across teams while following cleanroom and safety procedures.

Performs FIB/SEM-based physical characterization, device cross-section imaging, metrology, materials and failure analysis, 3D tomography, and TEM lamella preparation. Analyzes complex data, develops sample-preparation recipes and characterization techniques, investigates process and materials issues, prepares reports, and presents findings supporting magnetic recording heads, MRAM, and other device technologies.

Evaluates head and media component reliability and performance under environmental and operational conditions. Develops test algorithms, conducts HDI testing, performs metrology and failure analysis, designs test fixtures, troubleshoots equipment, prepares samples through soldering, and reports findings. The role requires laboratory work, collaboration across departments, safety compliance, and occasional work in an ESD-sensitive wafer fabrication facility.

Supports and sustains wafer manufacturing processes by monitoring process controls, correcting errors, integrating new programs, evaluating transferred products, and conducting experiments for yield improvement. Analyzes defect data from FIB, SEM, EDX, and TEM tools, uses SPC and complex software to identify trends, performs root-cause analysis, recommends corrective actions, and prepares reports. The role operates in office and cleanroom manufacturing environments with exposure to chemicals, gases, noise, and occasional lifting.

Develop, sustain, and improve electrical and magnetic on-wafer testing processes for TFH wafers and devices. Create and maintain process documentation, ensure data integrity, diagnose and correct test system issues, design experiments to improve measurement accuracy and yield, develop production test routines, and coordinate equipment purchases and test strategies with product and process teams.

Perform budgeting, forecasting, long-term financial planning, variance and ad-hoc analysis, monthly/quarterly reporting, treasury functions, support month-end close and audits, ensure SOX and IFRS/GAAP compliance, and prepare presentations for management.

Administer and maintain MES (Siemens Opcenter/MESA) infrastructure and servers, ensure high availability, perform daily monitoring and troubleshooting, prepare SOPs and validation documentation, support change management and on-call response, and lead infrastructure projects in a semiconductor cleanroom environment.

Responsible for selection, installation, modification, upgrade, and maintenance of semiconductor vacuum tools. Uses AutoCAD/SolidWorks for schematics, analyzes tool data, manages projects and maintenance schedules, improves reliability and yield, maintains spare parts, develops emergency recovery plans, and ensures ISO 9001:2015 and safety compliance in a cleanroom environment.

Lead and manage a team of equipment engineers in a thin-film wafer fab. Oversee equipment selection, installation, troubleshooting, performance optimization, preventative maintenance, tool data analysis, project management, and QMS compliance to improve yield, reliability, and lower operational costs.

Ensure quality of production and prototype magnetic recording heads via SPC data analysis, failure analysis, and root-cause investigations. Create reports, recommend corrective actions, collaborate with design and manufacturing on process characterization and wafer process changes, and present findings to stakeholders. Onsite role in Milpitas, CA.

Support and sustain day-to-day thin film manufacturing using ion beam techniques. Improve deposition and dry etch efficiency, design and run experiments to verify process robustness, perform SPC and DOE, conduct root cause analysis, implement corrective actions, collaborate on process integration, and optimize manufacturability to increase yields and lower cost.

Evaluate, select, install, modify, upgrade, and maintain vacuum and thin-film tools in a semiconductor cleanroom. Use AutoCAD/SolidWorks for schematics, analyze tool data, manage projects, optimize tool performance and yield, coordinate maintenance and spare parts, implement recovery plans, and comply with ISO 9001:2015 and safety procedures.

Develop and optimize FIB metrology recipes and methodologies for prototype wafers, perform wafer-level process characterization and failure analysis (using FIB/SEM), improve yield, integrate processes for new technology programs, analyze data with JMP or Visual Basic, and present findings to engineering teams.

Develop and implement photolithography processes for next-generation magnetic recording heads, design and run experiments, analyze data to improve yield, qualify new tools, implement process control, and collaborate with cross-functional teams while overseeing process technicians and ensuring manufacturing readiness and safety compliance.

Evaluate, select, install, modify, upgrade, and maintain plating-area semiconductor tools. Use CAD to create schematics, analyze tool data, manage projects and spare parts, improve yield and reliability, and ensure compliance with ISO 9001:2015 and safety procedures in a cleanroom environment.

Designs, implements, and supports network and server infrastructure. Manages network devices, patches, firmware, capacity planning, virtualization (VMWare), Windows and Linux servers, security updates, and vendor/system access. Monitors network health, documents changes, partners with teams on IT projects, and maintains compliance and operational reliability.

Lead process integration and wafer-level characterization for next-generation thin film recording head technologies. Perform FIB failure analysis, design experiments, analyze backend performance using JMP/Visual Basic, recommend corrective actions, and present findings to teams while adhering to cleanroom and safety procedures.

Evaluate, select, install, maintain, and optimize plating-area semiconductor equipment; create schematics with CAD; analyze tool data; manage projects; coordinate maintenance to maximize uptime; implement recovery and preventive measures; ensure ISO 9001 compliance and safety; collaborate cross-functionally to improve yield, reliability, and lower costs.

Design, simulate, and validate advanced optical delivery systems for HAMR heads. Lead optical concept development, perform simulations (Lumerical, Tidy3D, COMSOL), run optical characterization and failure analysis, collaborate with process/test teams, and translate innovations into manufacturable product solutions while documenting results and supporting technical reports and invention disclosures.

Responsible for evaluation, selection, installation, maintenance, and optimization of CMP semiconductor tools. Uses CAD software to produce schematics, analyzes tool data, manages equipment projects and spare parts, implements reliability improvements, and ensures uptime and ISO 9001:2015 compliance in a cleanroom manufacturing environment.