Teams at Headway Technologies, Inc.

Support and sustain wafer manufacturing processes: integrate new programs, analyze defect/imaging data, run experiments (DOE), use SPC/JMP/Excel for yield improvement, recommend corrective actions, and collaborate across teams while following cleanroom and safety procedures.

Performs FIB/SEM-based physical characterization, device cross-section imaging, metrology, materials and failure analysis, 3D tomography, and TEM lamella preparation. Analyzes complex data, develops sample-preparation recipes and characterization techniques, investigates process and materials issues, prepares reports, and presents findings supporting magnetic recording heads, MRAM, and other device technologies.

Evaluates head and media component reliability and performance under environmental and operational conditions. Develops test algorithms, conducts HDI testing, performs metrology and failure analysis, designs test fixtures, troubleshoots equipment, prepares samples through soldering, and reports findings. The role requires laboratory work, collaboration across departments, safety compliance, and occasional work in an ESD-sensitive wafer fabrication facility.