Sr. Photolithography Process Development Engineer (49939)

TITLE:                        SR. PHOTOLITHOGRAPHY PROCESS DEVELOPMENT ENGINEER

FLSA STATUS:          EXEMPT

REPORTS TO:          DIRECTOR, PHOTOLITHOGRAPY DEVELOPMENT ENGINEERING

SUMMARY:

Under the direction of the Director of Photolithography Development Engineering, the Photolithography Development Engineer is responsible for the developing and implementing new photolithography processes for next generation magnetic recording heads, including implementing new photolithography processes which ensure product manufacturability; designs and conducts experiments, analyzes data, and presents findings; researches, selects, and qualifies new tools which improve efficiency and yield. This position is located in Milpitas, California.

ESSENTIAL FUNCTIONS:

• Develops and implements new photolithography processes for next generation magnetic recording heads
• Implements new process control schemes or methodologies which ensure product manufacturability
• Designs and conducts experiments, analyzes data, and develops recommendations for improving performance and yield while reducing scrap
• Adheres to appropriate timeline for introducing new processes into the manufacturing line
• Partners with other groups and departments, including process and product engineering to develop and deliver products and programs
• Oversees the work of the Process Technicians to ensure accurate process execution and efficient wafer disposition
• Adheres to all safety policies and procedures as required
• Performs other duties of a similar nature or level*

MINIMUM QUALIFICATIONS:

• Master’s degree in Chemistry, Chemical or Electrical Engineering, Materials Science, or Physics and/or equivalent relevant experience; PhD preferred
• Three years of hands-on experience working in either the magnetic thin film fabrication or semiconductor industries in a manufacturing or process engineering role
• Strong analytical and critical thinking skills
• Hands on experience in SPC and Design of Experiments (DOE)
• Proficient in the use of Microsoft Office Applications

Knowledge, Skills, and Abilities:

• Strong knowledge of photolithography principles, practices, and techniques  
• Strong knowledge using steppers/scanners in a thin film manufacturing environment
• Knowledge of magnetic recording head or HDD manufacturing
• ArF Scanner and ArF Track tool and process experience
• Knowledge and experience using JMP or Excel and the ability to create macro formulas
• Knowledge and ability to use Microsoft Office applications to create spreadsheets, Word documents, and presentations
• Able to design advanced experiments, analyze results, and recommend corrective action
• Able to communicate effectively, both verbally and in writing, with all levels of contractors, consultants, employees, and management
• Able to work productively and collaboratively with all levels of employees and management
• Able to comply with all safety policies and procedures
• Able to use critical thinking to resolve issues, examine trends, conduct root cause analysis, and make recommendations for process improvements
• Demonstrated analytical skills
• Demonstrated organizational and time management skills
• Demonstrated problem-solving and trouble shooting skills
• Flexible and able to prioritize

The annual rate for this full-time position is between $130,000.00-$180,000.00 + bonus target + benefits. Within the range the individual pay may differ depending on additional factors including job responsibilities, job related knowledge, skills, abilities, education, and experience. The annual pay range shown is subject to change and may be modified periodically.

WORKING CONDITIONS:

The Sr. Photolithography Development Engineer works primarily in an office environment from Monday thru Friday. The schedule may be altered from time-to-time to meet business or operational needs; may travel from site-to-site as needed.  May also work in a class 100 ESD sensitive wafer fab manufacturing facility; adheres to required safety and dress standards. May be exposed to hazardous chemicals, fumes, or vapors and excessive noise from time-to-time while in the wafer manufacturing facility; stands and walks; performs various fine grasping movements, bends, and twists; operates a computer and enters information using a keyboard, operates a telephone, and other office equipment. May occasionally be required to push, pull, or lift up to 10 pounds.

*Other duties of a similar nature or level are duties that may be required but may not be specifically listed in the job description or posting.

TDK/Headway Technologies, Inc. provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to race, color, religion, gender, national origin, age, disability, or genetics. Applicants requiring accommodation in order to complete the application process should contact the Headway Human Resources Department.