Jobs at Fab2

Build full-stack frontend and backend applications, tools, and infrastructure for a software-defined semiconductor fab. Develop systems for sequencing and controlling fabrication operations, analyze semiconductor process data, and create software from scratch. Interns work hands-on across databases, visualization, data pipelines, distributed systems, and fab equipment control.

Build, deploy, and manage on-premises backend infrastructure for a semiconductor fabrication facility. Responsibilities include infrastructure-as-code, server fleet management, monitoring, alerting, automation, secure secret management, performance optimization, and production debugging. The intern will collaborate with engineering teams to deliver reliable infrastructure and services.

Design, prototype, analyze, and build semiconductor fabrication equipment. Create mechanical drawings and documentation, perform electromechanical simulations, and transition prototypes into production with manufacturing and supply chain teams. The role requires rapid hands-on iteration, troubleshooting, and interdisciplinary collaboration across structures, optics, robotics, heat transfer, physics, and chemistry.

Develop real-time Linux and Rust applications for semiconductor fabrication equipment. Design robotic control algorithms and simulations to improve equipment and robot efficiency. Interns work autonomously on interdisciplinary projects involving motor controllers, path planning, trajectory control, and software testing. A portfolio demonstrating software engineering work is required.

Develop real-time Linux applications and Rust microcontroller firmware for semiconductor fabrication equipment. Build backend systems to capture and analyze semiconductor process data, contribute to end-to-end system bring-up, and test high-performance tools involving structures, optics, liquids, heat transfer, physics, and chemistry. Applicants must provide a portfolio demonstrating software engineering ability and hands-on projects.

Design and execute semiconductor and thin-film fabrication experiments; operate deposition, etch, lithography, and metrology tools; develop, transfer, and optimize process recipes; analyze process data; troubleshoot equipment and recipe issues; and document results. The role requires hands-on cleanroom experience, nanofabrication recipe development, and strong semiconductor processing knowledge. Interns collaborate with senior engineers in a high-autonomy startup environment.

Build full-stack chip design software in Rust, owning major features from design through shipping. Work across interactive editing tools, collaborative document models, synchronization engines, GPU rendering, simulation, WebAssembly, and integrations. The role requires strong systems fundamentals, performance optimization, concurrency knowledge, and a portfolio demonstrating substantial software built from scratch. Experience with game engines, graphics, distributed systems, algorithms, geometry, or electrical engineering is beneficial.

Electrical Engineering Interns will design, prototype, test, integrate, and document PCBAs and electrical systems for semiconductor manufacturing equipment. Responsibilities include schematic capture, layout, system bring-up, simulations, troubleshooting, requirements definition, and cross-functional collaboration with software, mechanical, and process teams. Interns will work on lithography, deposition, vacuum, motion-control, and plasma-etching systems while rapidly developing and productionizing hardware solutions.

Lead cross-functional hardware program development for a semiconductor fab, translating goals into technical programs, managing schedules, risks, and integration from requirements through production release, and building lightweight PM systems.

Seeking hands-on engineers across mechanical, electrical, software, and nanofabrication to design and build full-stack chip-making hardware and software, iterate quickly, and develop fabs, tools, and components in a San Francisco lab.

Develop and qualify assembly processes for electro-mechanical systems and fabs. Design fixtures, workstations, and assembly aids; write work instructions; build and debug first units; root-cause defects; select and qualify production equipment; support tool and fab installation; train technicians and ramp to repeatable production.

Lead end-to-end characterization and testing of positioning tools: build automated test programs, run electrical and software tests, diagnose complex cross-disciplinary failures, document results, and drive engineering improvements. Portfolio required.

Design, prototype, and build semiconductor fabrication tools and subsystems (deposition, etch, anneal, plasma). Own end-to-end mechanical and electromechanical systems, source components, partner with cross-functional teams, and validate vacuum and fluid-handling hardware for production.

Operate and program Haas 5-axis VMCs and mill-turn lathes, manage CAM programs, setup and inspect first articles, handle tooling and pallet-pool workflows, optimize cycle times and tooling to improve production throughput while holding tight tolerances on stainless and aluminum.

Perform preventative and corrective maintenance, troubleshooting, upgrades, and calibrations on semiconductor fabrication equipment. Document SOPs and failure modes, collaborate with engineers to improve tool reliability, monitor SPC and alarms, drive continuous improvement, manage spares inventory, and train maintenance personnel to maximize uptime and MTBF.

Design and build high-performance backend systems and APIs to connect web applications with fab hardware. Lead architecture, data modeling, reliability, observability, and real-time integration for mission-critical manufacturing systems.

Design, prototype, and build semiconductor fabrication equipment and subsystems. Lead system integration, testing, and cross-team coordination. Develop electrical designs and PCBs, execute mechanical CAD and fabrication, rapidly prototype and test, source components, and write light software/firmware. Portfolio required.

Lead end-to-end R&D for advanced patterning hardware: simulate optical/nanophotonic behavior, design and fabricate sub-micron patterning tools, and integrate with deposition, development, and etch processes to deliver working prototypes.

Design, prototype, and build robotic automation and electromechanical systems for semiconductor packaging. Create mechanical assemblies, integrate microcontrollers/PLCs, sensors, actuators, and firmware, validate control systems, source components, and collaborate cross-functionally. Applicants must provide a portfolio of hands-on projects.

Characterize CMOS devices, design and fabricate test chips and probe cards, develop test plans and automation, deploy parameter-extraction (e.g., BSIM) tools, analyze electrical data, and provide feedback to process engineers to improve materials and process flows.