Jobs at 3d Glass Solutions

Develop, optimize, and support copper electroplating and lamination (ABF/DFR) processes for advanced packaging. Run experiments, troubleshoot adhesion/defect issues, qualify equipment, analyze process data using DOE and root cause analysis, and support scale-up from R&D to pilot/early manufacturing while working with integration, laser, plating, and reliability teams.

Lead a team to develop, qualify, and support copper electroplating and electroless processes for wafer and panel manufacturing. Drive experimental design, tool setup, troubleshooting, DOE/SPC/FMEA-based problem solving, technology transfer to high-volume production, and mentor junior engineers while collaborating with equipment, suppliers, and cross-functional teams.

Lead development, optimization, qualification, and control of dry film resist (DFR) develop and strip processes for glass panel semiconductor manufacturing. Drive DOE, root-cause analysis, process qualifications, equipment acceptance, SOPs, and continuous improvement to reduce defects, improve pattern fidelity and yield, and support pilot-to-volume manufacturing ramps while ensuring EHS compliance.

Create and manage complex 2D lithography mask layouts and 3D CAD models to support manufacturing, testing, and fabrication. Develop standards, test structures, and DOE for risk mitigation. Partner with engineers, project managers, and customers through design iteration, pre- and post-fabrication support, reporting, and training. Perform coding/testing of software and produce drawings and documentation to support fab integration.

Lead a team of engineers to sustain and improve semiconductor etch and thin-film manufacturing processes. Drive process qualification, DOE/statistical problem solving, yield and quality improvements, tool maintenance, incident investigations, and documentation to support safe, efficient production.

Support R&D and early manufacturing by improving semiconductor manufacturing processes, troubleshooting tools, qualifying stations and personnel, performing DOE and statistical analysis, documenting results, and driving yield, quality, and efficiency improvements.

Develop and oversee RF test platforms for IPD and SiP modules, support NPI and production wafer acceptance, automate measurements and data analysis, characterize devices with RF instrumentation, design test fixtures and PCBs, manage technicians, and support reliability and yield improvement.

Lead development, optimization, qualification, and control of electroless copper deposition for glass substrates and panel-level packaging. Define process parameters, drive DOE and root-cause analysis, improve deposition uniformity and adhesion, support pilot-to-volume ramp, maintain process documentation and EHS compliance, and collaborate with equipment, chemistry, and maintenance teams to enhance yield and equipment reliability.

Lead development, optimization, qualification, and manufacturing support of wet etching processes for TGV and copper in glass panel semiconductor manufacturing. Mentor engineers, define critical process parameters, drive DOE/SPC-based characterization, troubleshoot defects, support pilot-to-volume ramp, and own equipment qualification (SAT, IQ/OQ/PQ) to improve yield and process robustness.

Design end-to-end RF/microwave components, modules, front-ends and SiPs using glass technology. Perform circuit and EM simulations, create test procedures and white papers, interface with customers and manufacturing, mentor junior engineers, and lead internal development toward production and reliable yields.

Lead yield improvement, reliability qualification, failure analysis, and process qualification for advanced substrate fabrication. Drive root-cause analysis, SPC and yield modeling, reliability test planning/execution (environmental, mechanical, electrical), and support ramp to production. Coordinate across process, equipment, test, quality, and customer teams to reduce scrap and meet qualification requirements.

Lead electroplating and backend thick-Cu integration efforts, drive R&D to high-volume manufacturing, optimize dicing/etch/solder ball attach processes, implement DOE/statistical root-cause analysis, collaborate with external partners, support manufacturing continuous improvement to raise yields, quality, and efficiency while reducing costs.