Jobs at 3d Glass Solutions

Own semiconductor die yield by analyzing wafer sort, electrical test, defect, metrology, and tool-history data. Lead root-cause investigations, corrective actions, split lots, and DOEs to improve yield. Develop yield models, Pareto charts, reports, and dashboards using SQL, Python, JMP, or yield-management software. Collaborate with process, integration, equipment, and test engineering teams, presenting yield performance and improvement plans to leadership. The role requires cleanroom work and strict safety procedures.

Participate in a 24-month semiconductor process engineering rotational program across wafer-fab modules including photolithography, etch, thin films, electroplating, and yield integration. Monitor SPC, optimize recipes through DOE, investigate yield excursions, qualify tools and materials, analyze manufacturing data, maintain process documentation, and support production improvements. The role requires cleanroom work, technical communication, and occasional off-shift or weekend support.

The Accounting Manager oversees general ledger, month-end and year-end close, financial statement preparation, accounts payable and receivable, payroll, cash flow reporting, audits, tax coordination, internal controls, and compliance. The role supports budgeting, forecasting, variance analysis, process improvements, and financial projects while partnering with the CFO and potentially supervising accounting staff.

Oversee daily accounting operations, general ledger activity, month-end and year-end close, accounts payable and receivable, payroll, financial statement preparation, internal controls, cash flow reporting, audits, tax coordination, and accounting process improvements. The role also supports budgeting, forecasting, variance analysis, financial analysis, and supervises or mentors accounting staff while partnering closely with the CFO.

Leads the company’s accounting function, financial reporting, close process, internal controls, technical accounting, audit relationship, tax strategy, ERP scaling, and investor or board reporting. The Controller manages the accounting team, supports fundraising and strategic transactions, develops accounting policies, and partners with the CFO on capital strategy and growth initiatives.

Leads the company’s accounting function, financial reporting, close process, internal controls, technical accounting, audits, tax strategy, and ERP systems. Manages and scales the accounting team, supports fundraising and investor reporting, advises on strategic transactions, and presents financial information to the CFO, board, and investors. The Controller also oversees GAAP policy, SOX readiness, semiconductor cost accounting, and external advisors.

Leads SMT process and equipment ownership for advanced semiconductor assembly, covering solder paste printing, inspection, component placement, reflow, cleaning, and AOI. Owns qualification, process windows, yield improvement, troubleshooting, documentation, and manufacturing ramp support. Builds and develops engineering and technician teams through training and certification. Collaborates cross-functionally on tooling, design, materials, quality, MES, preventive maintenance, and equipment health while driving robust, scalable SMT manufacturing performance.

Leads development, qualification, optimization, and manufacturing support for semiconductor end-of-line assembly processes. Owns process and equipment performance across ball attach, lid attach, singulation, inspection, marking, and packing. Drives yield improvement, defect reduction, quality-gate controls, equipment qualification, troubleshooting, preventive maintenance, and production ramp readiness. Builds and develops engineering and technician teams through training, certification, mentoring, and progression planning while coordinating with quality, reliability, design, materials, logistics, and manufacturing teams.

Develop, optimize, and support copper electroplating and lamination (ABF/DFR) processes for advanced packaging. Run experiments, troubleshoot adhesion/defect issues, qualify equipment, analyze process data using DOE and root cause analysis, and support scale-up from R&D to pilot/early manufacturing while working with integration, laser, plating, and reliability teams.

Lead a team to develop, qualify, and support copper electroplating and electroless processes for wafer and panel manufacturing. Drive experimental design, tool setup, troubleshooting, DOE/SPC/FMEA-based problem solving, technology transfer to high-volume production, and mentor junior engineers while collaborating with equipment, suppliers, and cross-functional teams.

Lead development, optimization, qualification, and control of dry film resist (DFR) develop and strip processes for glass panel semiconductor manufacturing. Drive DOE, root-cause analysis, process qualifications, equipment acceptance, SOPs, and continuous improvement to reduce defects, improve pattern fidelity and yield, and support pilot-to-volume manufacturing ramps while ensuring EHS compliance.

Lead a team of engineers to sustain and improve semiconductor etch and thin-film manufacturing processes. Drive process qualification, DOE/statistical problem solving, yield and quality improvements, tool maintenance, incident investigations, and documentation to support safe, efficient production.

Develop and oversee RF test platforms for IPD and SiP modules, support NPI and production wafer acceptance, automate measurements and data analysis, characterize devices with RF instrumentation, design test fixtures and PCBs, manage technicians, and support reliability and yield improvement.

Lead development, optimization, qualification, and control of electroless copper deposition for glass substrates and panel-level packaging. Define process parameters, drive DOE and root-cause analysis, improve deposition uniformity and adhesion, support pilot-to-volume ramp, maintain process documentation and EHS compliance, and collaborate with equipment, chemistry, and maintenance teams to enhance yield and equipment reliability.

Lead development, optimization, qualification, and manufacturing support of wet etching processes for TGV and copper in glass panel semiconductor manufacturing. Mentor engineers, define critical process parameters, drive DOE/SPC-based characterization, troubleshoot defects, support pilot-to-volume ramp, and own equipment qualification (SAT, IQ/OQ/PQ) to improve yield and process robustness.

Lead yield improvement, reliability qualification, failure analysis, and process qualification for advanced substrate fabrication. Drive root-cause analysis, SPC and yield modeling, reliability test planning/execution (environmental, mechanical, electrical), and support ramp to production. Coordinate across process, equipment, test, quality, and customer teams to reduce scrap and meet qualification requirements.

Lead electroplating and backend thick-Cu integration efforts, drive R&D to high-volume manufacturing, optimize dicing/etch/solder ball attach processes, implement DOE/statistical root-cause analysis, collaborate with external partners, support manufacturing continuous improvement to raise yields, quality, and efficiency while reducing costs.