Teams at 3d Glass Solutions

Develop, optimize, and support copper electroplating and lamination (ABF/DFR) processes for advanced packaging. Run experiments, troubleshoot adhesion/defect issues, qualify equipment, analyze process data using DOE and root cause analysis, and support scale-up from R&D to pilot/early manufacturing while working with integration, laser, plating, and reliability teams.

Lead a team to develop, qualify, and support copper electroplating and electroless processes for wafer and panel manufacturing. Drive experimental design, tool setup, troubleshooting, DOE/SPC/FMEA-based problem solving, technology transfer to high-volume production, and mentor junior engineers while collaborating with equipment, suppliers, and cross-functional teams.

Lead development, optimization, qualification, and control of dry film resist (DFR) develop and strip processes for glass panel semiconductor manufacturing. Drive DOE, root-cause analysis, process qualifications, equipment acceptance, SOPs, and continuous improvement to reduce defects, improve pattern fidelity and yield, and support pilot-to-volume manufacturing ramps while ensuring EHS compliance.