Top Engineering Jobs

Lead hiring, training, and startup of Dry Etch process and equipment engineering teams for a new DRAM high-volume fab. Drive process qualification, capacity planning, cross-functional alignment, technical support, and succession planning while setting performance goals and partnering with global manufacturing and suppliers.

Lead end-to-end PCB layout for complex, high-speed boards: pre-layout planning, stackup and rule development, component placement, signal and power integrity, manufacturability, cross-functional coordination, release and fabrication support, and continuous improvement of PCB design practices.

Lead development, layout, and optimization of high-speed datapath IO circuits for next‑gen NAND flash, driving AI-first workflows. Own architecture decisions, verify major IO blocks, redesign engineering workflows to embed AI, mentor teams, and collaborate across functions to meet aggressive data-rate and power targets.

Lead electrical failure analysis and data analysis for 3D NAND devices, define and manage NAND qualification plans, perform test data analysis and risk assessments, coordinate cross-functionally to identify failure modes and corrective actions, and leverage AI tools to automate reporting and root-cause classification.

Manage and optimize multi-cloud infrastructure (Azure, AWS, GCP), support AI/ML workloads, implement IaC and CI/CD, automate operations, ensure cloud security and compliance, and collaborate across teams while providing on-call and documentation support.

Perform electrical and physical failure analysis of semiconductor devices using advanced FA tools (FIB, SEM, EDX, X-ray, micro-prober). Analyze test data with Bash/Python in Unix, identify failure mechanisms, drive corrective actions with product and process teams, develop FA techniques and automation, maintain lab safety and +6S standards, prepare FA reports, mentor technicians, and use AI-enabled tools to accelerate investigations and improve workflows.

Manage end-to-end reliability stress tests and package qualification (thermal cycling, HAST, CSAM, HTOL, etc.). Maintain process of record, lead equipment qualification, define control plans, analyze performance data, drive continuous improvements, and integrate AI-enabled reporting and automation with lab systems.

Support NAND and SSD product bring-up and high-volume manufacturing, perform electrical and physical failure analysis, use AI and data analysis to improve yield and resolve customer returns, develop test and validation plans, and drive cross-functional qualification and issue resolution.

Design, implement and integrate complex analog circuits and custom digital blocks for advanced DRAM (HBM) products. Perform parasitic modeling, verification with industry simulators, manage layout/floorplanning, collaborate with cross-functional teams for manufacturability, mentor junior designers, and use agentic AI tools (e.g., Claude) to optimize PPA and accelerate delivery.

Lead end-to-end layout execution and full-chip technical decisions for HBM products. Drive layout of analog/mixed-signal and custom digital blocks, ensure PPA, perform LVS/DRC/antenna closure, manage tape-outs, mentor layout team, adopt AI/automation to boost productivity, and coordinate cross-functional global teams to meet schedule and quality targets.