Top Engineering Jobs

Lead startup, development, and optimization of PVD/CVD processes for DRAM manufacturing. Improve yield, reduce cost, resolve production issues, drive SPC improvements, and collaborate with equipment and integration teams to meet project milestones.

Responsible for fab cost analysis and optimization: auditing and validating cost data, improving data accuracy for complex product mixes, performing bottom-up plan-to-actual statistical analysis, collaborating with manufacturing and engineering to close cost gaps, recommending improvements, participating in continuous improvement projects, and integrating AI-assisted tools to increase efficiency.

Support fab cleanroom and ESD controls by monitoring contamination (AMC, particles, trace metals), qualifying FOAK equipment/materials, leading OOC/OOS investigations with RCA and CAPA, developing monitoring protocols, collaborating across manufacturing and engineering teams, ensuring compliance with quality and ESD standards, and applying AI/RPA analytics to automate data collection and detection.

The Staff Engineer develops and optimizes thin film processes, addresses process issues, supports scaling, and mentors junior engineers while ensuring compatibility with integration and device teams.

Engineers process conditions for semiconductor manufacturing: set process parameters, evaluate and plan new equipment/materials, analyze abnormalities, improve capability and reduce costs, and integrate AI-assisted tools to boost efficiency and continuous improvement.

Design, layout, simulate, and optimize DRAM memory circuits focusing on performance, power, area, and manufacturability. Develop schematics for arrays, control logic, decoders, datapaths, and test circuitry, validate designs via SPICE/Verilog simulations, integrate parasitics, and support test chip development and silicon validation with AI-enabled improvements.

Lead package/product engineering for High Bandwidth Memory (HBM): drive yield and DPM reduction via test coverage, electrical and physical failure analysis, root-cause resolution, cross-functional projects, and technical/people leadership including mentoring and decision-making on risk and priorities.

The Staff Engineer Design will engage in block and sub-system design, timing optimization, mentor junior designers, and collaborate on full-chip floorplanning while using various simulation tools.

Lead product quality and reliability efforts for semiconductor memory (DRAM/NAND/NOR). Manage MRB, RMA, ASSM events, PARAM/WLR programs, outgoing quality, and new product releases. Perform root-cause analysis, drive CAPAs, monitor quality metrics and global dashboards, and collaborate with process, RDA, and manufacturing teams. Hire, coach, and develop an NPI/WLR team.

Design and optimize next-generation memory products. Responsibilities include circuit design, layout management, verification, and cross-functional collaboration for manufacturability.