Top Engineering Jobs

Perform FIB lamella preparation and TEM analysis (microstructure and chemical) using electron diffraction, EDS, EELS, and advanced STEM techniques. Optimize lab procedures, support process development and product transfers, and develop AI/automation and data-processing workflows for TEM data acquisition and analysis.

The Staff CAD Engineer role involves developing Physical Verification tools and methodologies for memory designs, collaborating with various teams to enhance product development strategies.

Lead and coordinate semiconductor package qualification and reliability testing for new products; develop test plans and screening methods; drive root-cause analysis and 8D corrective actions; present technical reports; and liaise with internal teams and customers on package quality and release recommendations.

Lead a team of process engineers to develop, optimize, and sustain photolithography/scanner processes. Drive yield, cost, and throughput improvements using AI/ML analytics, automation, DOE/SPC, and cross-functional collaboration while ensuring EHSS compliance, training, documentation, and supplier performance.

Designs and optimizes complex analog power-management IP for advanced DRAM products, including references, regulators, charge pumps, amplifiers, and comparators. Responsibilities include circuit layout, parasitic modeling, simulation, verification, tape-out revisions, manufacturability coordination, and cross-functional collaboration across engineering and manufacturing groups. The role also supports innovation for future memory generations and leverages AI.

Optimize HVM DRAM device process conditions to improve yield, repair density, and device performance. The role analyzes process data, identifies root causes, develops improvement proposals, and drives PCRB decisions using structured data summaries. It requires cross-functional collaboration with process integration, area, quality, design, technology development, and other site teams in a high-volume semiconductor manufacturing environment.

Develops, implements, and optimizes thin film semiconductor processes to improve production quality, efficiency, and operational excellence. Collaborates with cross-functional teams to resolve engineering challenges, integrates new technologies, analyzes process performance, identifies continuous improvement opportunities, and leads engineering projects involving advanced photolithography equipment.

Intern will improve automation and operational efficiency in a semiconductor research and development factory. Responsibilities include gathering project requirements, designing solutions with customers, documenting defects and improvements, supporting integration and user acceptance testing, and preparing technical and deployment documentation. The role involves working with large datasets, databases, programming languages, visualization tools, and AI-enabled automation.

Leads new product introduction and package integration from phase-gate review through end of life. Coordinates cross-functional process, equipment, manufacturing, and planning teams to launch products, achieve qualification, support engineering samples and hot lots, monitor yield and reliability, and transition packages into volume production. Uses statistical and data analysis to make decisions, address product challenges, and develop semiconductor package capabilities.

Leads verification architecture and methodology for next-generation HBM designs. Develops verification plans, coverage strategies, sign-off criteria, UVM-based testbenches, reusable verification components, and formal verification approaches. Partners with design teams to ensure verification completeness, mentors engineers, drives technical direction, and improves workflows through automation and AI-enabled verification. Requires expertise in SystemVerilog, UVM, simulation, coverage, regression management, SoC architecture, and bus protocols.