Top Engineering Jobs

The Circuit Design Engineer will design and analyze digital and analog circuits for memory products, collaborate with teams across various functions, and contribute to product development and innovation.

Lead development of system-level DRAM solutions to optimize performance, power, and cost. Collaborate across functions to evaluate and implement DRAM and memory-system architectures, analyze system behavior, drive architectural innovation, mentor team members, and apply AI where applicable.

Lead and manage CMP equipment engineering for Fab16 to ensure high tool availability and performance. Drive continuous improvement, own equipment KPIs, support NPI/tool ramps, lead troubleshooting and RCA, collaborate cross-functionally, and develop engineering team while ensuring safety and quality compliance.

The Central Product Integration Engineer will lead global integration efforts to enhance yield and quality in semiconductor products. The role involves cross-functional collaboration, technical problem-solving, managing projects, and communicating with stakeholders.

Design and enable engineering tools and tester frameworks for NAND characterization, bring-up, debug, and failure analysis. Integrate lab instrumentation with testers, support tester workflows, collaborate with Device PE and Validation teams, and apply AI-enabled methods to accelerate test program development and diagnostics.

Design and optimize analog and mixed-signal circuits and layouts for advanced DRAM products, including power-management IPs (bandgaps, references, regulators, charge pumps, amplifiers, comparators). Perform parasitic modeling, simulation/verification, layout (floor-planning, placement, routing), tape-out support, and cross-functional collaboration to ensure manufacturability and drive innovation across memory generations.

Support development and optimization of dry etch semiconductor processes through experiment design, data/statistical analysis, AI-enabled tools, and cross-functional collaboration; present results to engineering leadership.

Responsible for MRDA advanced packaging process development and yield improvement through process, equipment, and materials optimization. Analyze process flows and defect trends, design experiments (SWRs), implement containment and corrective actions, leverage inline signals and AI/image-classification models for earlier detection, maintain KPI/yield systems, collaborate with suppliers, production, and global fabs, and drive continuous improvement and best-known methods alignment.

Work on semiconductor process development and control to improve capability, yield, and reduce cost. Troubleshoot wafer fabrication problems, perform root cause analysis, evaluate and plan equipment/material changes, and lead process management projects. Integrate AI-assisted tools to improve efficiency and contribute continuous improvement efforts across teams.

The Dry Etch Process Equipment Engineer will improve production processes for advanced DRAM products, manage projects, implement new equipment, and ensure quality in production.