Top Engineering Jobs

Execute system settings per SOP, support senior engineers resolving technical issues, develop solutions and automation to improve labor efficiency and reduce risk during process conversions, and contribute to continuous engineering process improvements in manufacturing environments.

Build and scale cell characterization infrastructure for standard and custom cells across process nodes. Develop automated MCMM flows, Liberty model generation and validation, integrate flows with design/verification/CAD teams, root-cause SPICE/STA/silicon mismatches, and enable characterization for HBM, DRAM, TSV, and high-speed interfaces.

Develops DRAM product test programs, algorithms, automation, and validation processes using Python and C/C++. Responsibilities include electrical and semiconductor testing, debugging, statistical analysis, yield and quality evaluation, equipment qualification, new product introduction, manufacturing release, and cross-functional improvement initiatives focused on reducing test costs.

The Principal HBM Design Architect will design, simulate, and optimize DRAM circuits for high-bandwidth memory products, collaborating across teams to ensure functionality and performance.

Develops and optimizes HBM semiconductor manufacturing processes, maintains quality and safety standards, analyzes production performance, leads troubleshooting, reduces costs and downtime, and implements continuous improvements with cross-functional teams. The role requires shift flexibility, engineering education, manufacturing experience, HBM process knowledge, strong problem-solving, communication, and collaboration skills.

Lead introduction and transfer of advanced semiconductor assembly technologies (flip chip, TCB, hybrid bonding). Plan and execute DOE, build samples, analyze data, troubleshoot yield/process issues, coordinate with materials, bumping, NPI, quality and manufacturing teams, and prepare documentation for transfer to high-volume production. Apply AI, data analytics, and automation to accelerate development and failure analysis.

Design and implement cross-platform APIs and test automation for Enterprise SSD validation. Integrate test equipment, define and execute automation strategies, collaborate with cross-functional teams, troubleshoot SSD/software integration, improve validation coverage, and maintain documentation of methodologies and results.

Lead development and optimization of advanced wafer-level packaging and stacking equipment. Drive equipment capability, process improvements, cost reduction, and roadmap planning for post-probe wafer/die processing. Collaborate across process, test, product engineering, and quality teams to transition designs from R&D to high-volume production and apply data analysis, SPC/DOE, and automation to improve hardware maturity.

Supports the design, simulation, analysis, and verification of High Bandwidth Memory circuits and logic. Assists with RTL development, circuit implementation, timing and power analysis, functional verification, scripting, automation, debugging, and AI-assisted design workflows. Collaborates with design, verification, physical design, product engineering, and CAD teams while documenting technical work and experimental results.

Creates and verifies analog, digital, array, core, pitch, and periphery layouts for memory products. Responsibilities include floor planning, placement, routing, matching, parasitic mitigation, LVS/DRC debugging, ECO/LCO/DFM tasks, and delivering mid-size blocks. Coordinates with design, technology development, CAD, and layout teams to meet quality and schedule requirements while applying automation and AI tools.