The Role
The Wire Bond Process Engineer focuses on optimizing wire bonding processes, improving yield quality, managing tooling capabilities, and ensuring compliance with audits in semiconductor manufacturing.
Summary Generated by Built In
I. Basic Purpose of the Job
•The Wire Bond Process Engineer (Thermosonic) own, characterize, and sustain the thermosonic wire bond process to deliver robust interconnect quality, high yields, and package reliability. The role requires wide semiconductor manufacturing experience spanning materials, tooling, and equipment capability across Au/Al/Cu wires and diverse package families in fast past manufacturing set-up.
II. Reporting Relationship
•Reports directly to FOL Process Engineering Team Lead.
III. Major Duties and Responsibilities
ØProcess Ownership & Control
•Define, sustain and optimize key wirebonding parameters and tooling effectiveness.
•Establish and maintain the recipe management system, process/set-up controls, process capability, process performance (Ppk) and SPC health for wire pull and bond shear
•Generates and maintain PFMEA, Control Plan, Work Instruction (WI), One Point Lesson (OPL), reaction plans (OCAP)
ØYield & Quality Improvement
•Troubleshoot and drive actions on critical wire bond losses: Deformed bond, NSOP, heel crack, cratering, wire sweep/disturbed wires and bond pad damage.
•Lead problem solving using 8 Discipline for internal and external issues such as customer complaints (EFAR). Knowledgeable in DMAIC approach for continuous improvement projects.
•Well verse in using the root cause analysis tools such as 5‑Whys/Ishikawa for issues induced by the die attach process especially for GMRB documentation
•Reduce ppm loss and scrap disposition through targeted DOEs, parameter windows process validation, and direct material/tooling improvements.
ØTooling & Materials Engineering
•Manage capability of bonders (e.g., K&S IConn/ASM Eagle, Shinkawa UTC) including capillary selection, clamp design, and preventive maintenance inputs.
•Qualify wires (Au/Al/Cu), capillaries, pads/finishes, and define tool life and program change standards.
ØCompliance & Audits
•Prepare evidence for customer audits, IATF/ISO, and internal audits
•Ensures compliance to change control management.
ØCross‑Functional Leadership
•Partner with Production, Equipment, Quality, PE, NPI, Planning, SQE to ensure output, OEE, quality and delivery goals. Coach technicians on bond optimization and metrology.
IV. Job Specifications
•Education
oBS Bachelor’s degree in Engineering (Industrial, Manufacturing, Electronics, or related field).
•Experience
oAt least 3 years in semiconductor manufacturing, with ≥2 years focused on wirebond thermosonic wire bonding.
oPractical experience on K&S/ASM/Shinkawa UTC platforms; exposure to fine‑pitch, low‑loop, multi‑tier bonding.
oExperience with Cu wire or advanced interconnects is a plus.
•Skills and Knowledge Requirement
•Strong grasp of bond metallurgy, IMC formation, pad design and bondability, EFO tuning, and loop engineering.
•Proficient in SPC, DOE, MSA/GR&R, PFMEA, gage techniques, and statistical troubleshooting.
•Familiar with reliability failure mechanisms (cratering, heel crack, bond lift) and FA tools (CSAM, X‑ray, SEM).
•Clear written/oral communication; capable of leading escalations and customer‑facing reports.
ResponsibilitiesI. Basic Purpose of the Job
•The Wire Bond Process Engineer (Thermosonic) own, characterize, and sustain the thermosonic wire bond process to deliver robust interconnect quality, high yields, and package reliability. The role requires wide semiconductor manufacturing experience spanning materials, tooling, and equipment capability across Au/Al/Cu wires and diverse package families in fast past manufacturing set-up.
II. Reporting Relationship
•Reports directly to FOL Process Engineering Team Lead.
III. Major Duties and Responsibilities
ØProcess Ownership & Control
•Define, sustain and optimize key wirebonding parameters and tooling effectiveness.
•Establish and maintain the recipe management system, process/set-up controls, process capability, process performance (Ppk) and SPC health for wire pull and bond shear
•Generates and maintain PFMEA, Control Plan, Work Instruction (WI), One Point Lesson (OPL), reaction plans (OCAP)
ØYield & Quality Improvement
•Troubleshoot and drive actions on critical wire bond losses: Deformed bond, NSOP, heel crack, cratering, wire sweep/disturbed wires and bond pad damage.
•Lead problem solving using 8 Discipline for internal and external issues such as customer complaints (EFAR). Knowledgeable in DMAIC approach for continuous improvement projects.
•Well verse in using the root cause analysis tools such as 5‑Whys/Ishikawa for issues induced by the die attach process especially for GMRB documentation
•Reduce ppm loss and scrap disposition through targeted DOEs, parameter windows process validation, and direct material/tooling improvements.
ØTooling & Materials Engineering
•Manage capability of bonders (e.g., K&S IConn/ASM Eagle, Shinkawa UTC) including capillary selection, clamp design, and preventive maintenance inputs.
•Qualify wires (Au/Al/Cu), capillaries, pads/finishes, and define tool life and program change standards.
ØCompliance & Audits
•Prepare evidence for customer audits, IATF/ISO, and internal audits
•Ensures compliance to change control management.
ØCross‑Functional Leadership
•Partner with Production, Equipment, Quality, PE, NPI, Planning, SQE to ensure output, OEE, quality and delivery goals. Coach technicians on bond optimization and metrology.
IV. Job Specifications
•Education
oBS Bachelor’s degree in Engineering (Industrial, Manufacturing, Electronics, or related field).
•Experience
oAt least 3 years in semiconductor manufacturing, with ≥2 years focused on wirebond thermosonic wire bonding.
oPractical experience on K&S/ASM/Shinkawa UTC platforms; exposure to fine‑pitch, low‑loop, multi‑tier bonding.
oExperience with Cu wire or advanced interconnects is a plus.
•Skills and Knowledge Requirement
•Strong grasp of bond metallurgy, IMC formation, pad design and bondability, EFO tuning, and loop engineering.
•Proficient in SPC, DOE, MSA/GR&R, PFMEA, gage techniques, and statistical troubleshooting.
•Familiar with reliability failure mechanisms (cratering, heel crack, bond lift) and FA tools (CSAM, X‑ray, SEM).
•Clear written/oral communication; capable of leading escalations and customer‑facing reports.
QualificationsI. Basic Purpose of the Job
•The Wire Bond Process Engineer (Thermosonic) own, characterize, and sustain the thermosonic wire bond process to deliver robust interconnect quality, high yields, and package reliability. The role requires wide semiconductor manufacturing experience spanning materials, tooling, and equipment capability across Au/Al/Cu wires and diverse package families in fast past manufacturing set-up.
II. Reporting Relationship
•Reports directly to FOL Process Engineering Team Lead.
III. Major Duties and Responsibilities
ØProcess Ownership & Control
•Define, sustain and optimize key wirebonding parameters and tooling effectiveness.
•Establish and maintain the recipe management system, process/set-up controls, process capability, process performance (Ppk) and SPC health for wire pull and bond shear
•Generates and maintain PFMEA, Control Plan, Work Instruction (WI), One Point Lesson (OPL), reaction plans (OCAP)
ØYield & Quality Improvement
•Troubleshoot and drive actions on critical wire bond losses: Deformed bond, NSOP, heel crack, cratering, wire sweep/disturbed wires and bond pad damage.
•Lead problem solving using 8 Discipline for internal and external issues such as customer complaints (EFAR). Knowledgeable in DMAIC approach for continuous improvement projects.
•Well verse in using the root cause analysis tools such as 5‑Whys/Ishikawa for issues induced by the die attach process especially for GMRB documentation
•Reduce ppm loss and scrap disposition through targeted DOEs, parameter windows process validation, and direct material/tooling improvements.
ØTooling & Materials Engineering
•Manage capability of bonders (e.g., K&S IConn/ASM Eagle, Shinkawa UTC) including capillary selection, clamp design, and preventive maintenance inputs.
•Qualify wires (Au/Al/Cu), capillaries, pads/finishes, and define tool life and program change standards.
ØCompliance & Audits
•Prepare evidence for customer audits, IATF/ISO, and internal audits
•Ensures compliance to change control management.
ØCross‑Functional Leadership
•Partner with Production, Equipment, Quality, PE, NPI, Planning, SQE to ensure output, OEE, quality and delivery goals. Coach technicians on bond optimization and metrology.
IV. Job Specifications
•Education
oBS Bachelor’s degree in Engineering (Industrial, Manufacturing, Electronics, or related field).
•Experience
oAt least 3 years in semiconductor manufacturing, with ≥2 years focused on wirebond thermosonic wire bonding.
oPractical experience on K&S/ASM/Shinkawa UTC platforms; exposure to fine‑pitch, low‑loop, multi‑tier bonding.
oExperience with Cu wire or advanced interconnects is a plus.
•Skills and Knowledge Requirement
•Strong grasp of bond metallurgy, IMC formation, pad design and bondability, EFO tuning, and loop engineering.
•Proficient in SPC, DOE, MSA/GR&R, PFMEA, gage techniques, and statistical troubleshooting.
•Familiar with reliability failure mechanisms (cratering, heel crack, bond lift) and FA tools (CSAM, X‑ray, SEM).
•Clear written/oral communication; capable of leading escalations and customer‑facing reports.
About Us onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
More details about our company benefits can be found here:
https://www.onsemi.com/careers/career-benefits
We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.
Skills Required
- Bachelor's degree in Engineering (Industrial, Manufacturing, Electronics, or related field)
- At least 3 years in semiconductor manufacturing
- ≥2 years focused on wirebond thermosonic wire bonding
- Practical experience on K&S/ASM/Shinkawa UTC platforms
- Experience with Cu wire or advanced interconnects
onsemi Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about onsemi and has not been reviewed or approved by onsemi.
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Retirement Support — Retirement programs are highlighted by a U.S. 401(k) with a 100% match on the first 4% and immediate vesting. International plans such as Ireland’s defined contribution scheme and Germany’s company-funded pension elements reinforce long-term savings.
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Leave & Time Off Breadth — Time-off policies include ten paid holidays, flexible vacation for exempt employees, and three to five weeks of vacation for non-exempt staff as tenure grows, alongside sick time accrual. Paid leaves span parental, bereavement, jury duty, and military service, with Europe locations offering additional statutory and seniority-based days.
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Parental & Family Support — Family supports include eight weeks of paid parental leave, company-sponsored backup care for children, adults, and pets, and up to $15,000 in adoption assistance. Regional provisions such as Switzerland’s child allowance and accessible EAP counseling show added attention to household needs.
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The Company
What We Do
We are building a better future through intelligent technology. For over 60 years, onsemi and its ancestors have been leading the world’s greatest technology advancements. onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
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