Test Chip Administrator

The Silicon One team creates innovative hardware platforms central to the AI era, powering Cisco’s core Switching, Routing, and Wireless products for organizations globally. Our innovations in silicon, optics, and hardware platforms are shaping the technology industry. We're a global team of creative experts, bringing our unique backgrounds and bold ideas to push boundaries and help each other grow. Because full product development—from design to qualification to production—is within our team, we’re able to think differently, experiment more, and work quickly. Join us to power the future of the digital world.

Coordinate and oversee the operational execution of pre-silicon hardware prototyping runs to accelerate the development of Cisco’s next-generation architectures. Manage manufacturing reservations, technical order submissions, and documentation workflows through external supplier portals to ensure critical milestones consistently meet operational deadlines. Synchronize multi-component logistics and international supplier schedules to align hardware deliveries and prevent testing or bring-up bottlenecks. Drive real-time project tracking, purchase order management, and cross-functional alignment across distributed engineering teams to ensure flawless operational execution and project transparency.

• 2+ years of professional experience in project coordination, hardware operations, logistics, purchasing, or technical administration within an engineering or technology organization; or no experience with Master's degree in the semiconductor related field.
• Proven experience tracking project schedules, purchase orders, or bill of materials using Microsoft Excel (including formulas, pivot tables, and structured data tables).
• Exceptional attention to detail and structured time-management skills to balance multiple competing project timelines simultaneously.
• Professional working proficiency in English (written and spoken) for international technical collaboration.

• Bachelor's degree or equivalent formal tertiary education in Electrical Engineering, Electronics, Semiconductor Technology, Physics, Materials Science, or a related technical field.
• Direct prior experience working within the semiconductor industry, silicon foundry ecosystem (e.g., TSMC customer support/planning), or microelectronics packaging.
• Familiarity with advanced packaging technologies and multi-chip modules (such as substrates, interposers, 2.5D/3D architectures, or CoWoS).
• Demonstrated proactive communication skills to effectively follow up on technical work with distributed, multi-site engineering teams across global time zones.
• Language proficiency in Mandarin Chinese, Hebrew, or Armenian.

At Cisco, we’re revolutionizing how data and infrastructure connect and protect organizations in the AI era – and beyond. We’ve been innovating fearlessly for 40 years to create solutions that power how humans and technology work together across the physical and digital worlds. These solutions provide customers with unparalleled security, visibility, and insights across the entire digital footprint.

Fueled by the depth and breadth of our technology, we experiment and create meaningful solutions. Add to that our worldwide network of doers and experts, and you’ll see that the opportunities to grow and build are limitless. We work as a team, collaborating with empathy to make really big things happen on a global scale. Because our solutions are everywhere, our impact is everywhere. 

We are Cisco, and our power starts with you.