Technical Advisor/Principal Architect, Office of the CTO

Posted 2 Days Ago
Be an Early Applicant
Saint-Sulpice, QC, CAN
Hybrid
Entry level
Artificial Intelligence • Hardware • Semiconductor
The Role
Partners with the CTO to develop next-generation communication and interconnect architectures. Builds models, simulations, and prototypes; explores signaling, coding, equalization, and system-level techniques; evaluates performance, power, latency, area, and manufacturability; and translates theoretical concepts into silicon-ready architectures and intellectual property. Provides technical leadership across research, architecture, and product teams.
Summary Generated by Built In

Kandou AI is redefining the economics of AI infrastructure. Our proprietary MIMO‑over‑copper technology powers a high‑performance, chiplet‑based AI memory fabric that delivers high bandwidth and ultra‑low latency at dramatically lower power. Our architecture represents a foundational shift in how next‑generation AI hardware is built.

We are seeking a Technical Advisor / Principal Architect to work directly with the CTO on the conception, modeling, and development of breakthrough communication and interconnect technologies.

This is a rare opportunity for an engineer who thrives at the intersection of theory, architecture, and silicon implementation — someone who wants to help shape the future of chip‑to‑chip, die‑to‑die, memory, and networking interconnects.

Role Overview

You will partner closely with the CTO to explore, evaluate, and prototype next‑generation communication system architectures. This role spans research, modeling, algorithm development, system architecture, and early‑stage silicon feasibility. You will help translate theoretical concepts into implementable designs that can scale into real products.

What You Will Do

  • Partner with the CTO to develop next-generation communication and interconnect architectures.

  • Explore novel signaling, coding, equalization, and system-level techniques.

  • Build models, simulations, and prototypes to validate architectural concepts.

  • Evaluate performance, power, latency, area, and manufacturability tradeoffs.

  • Translate research into silicon-ready architectures and intellectual property.

  • Identify emerging technologies and opportunities for competitive differentiation.

  • Provide technical leadership and guidance across research, architecture, and product teams

Required Qualifications

  • Advanced degree in Electrical Engineering, Computer Engineering, Applied Mathematics, Physics, or related field.

  • Strong background in digital communications and communication system fundamentals.

  • Deep understanding of information theory, coding, modulation, and signal processing.

  • Experience building mathematical models, simulations, or prototypes.

  • Proficiency in Python, MATLAB, C++, or similar environments.

  • Ability to work across abstraction levels — from theory to architecture to implementation.

  • Strong analytical and problem‑solving skills; comfortable exploring unfamiliar domains.

Highly Desirable Experience (streamlined)

  • SerDes architecture, equalization, or wireline communications.

  • Coding theory, FEC, or advanced modulation schemes.

  • System‑level modeling (SystemC or equivalent).

  • Machine learning applied to communications.

  • Experience taking concepts from theory to silicon.

What Makes Someone Successful in This Role

The ideal candidate:

  • Moves fluidly between mathematics, algorithms, architecture, and hardware.

  • Is willing and able to be hands-on when needed, diving into analysis, modeling, coding, simulation, debugging, or lab work to help move critical projects forward.

  • Is intellectually curious and thrives on open‑ended technical challenges.

  • Challenges assumptions and proposes unconventional approaches when needed.

  • Understands that elegant theory must ultimately translate into manufacturable silicon.

Skills Required

  • Advanced degree in Electrical Engineering, Computer Engineering, Applied Mathematics, Physics, or a related field
  • Strong background in digital communications and communication system fundamentals
  • Deep understanding of information theory, coding, modulation, and signal processing
  • Experience building mathematical models, simulations, or prototypes
  • Proficiency in Python, MATLAB, C++, or similar environments
  • Ability to work across theory, architecture, and implementation
  • Strong analytical and problem-solving skills
  • Experience with SerDes architecture, equalization, or wireline communications
  • Experience with coding theory, FEC, or advanced modulation schemes
  • Experience with system-level modeling using SystemC or an equivalent
  • Experience applying machine learning to communications
  • Experience taking concepts from theory to silicon
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The Company
222 Employees

What We Do

Kandou AI is a fabless semiconductor company developing high-speed connectivity for AI infrastructure. Its patented Copper MIMO, also known as Chord Signaling, sends correlated signals at data-processing speeds of 448 Gbps and beyond, providing an alternative to optical interconnects. The company’s technology targets AI data-movement bottlenecks and memory-wall constraints, while its platforms emphasize improved efficiency, lower power and cost, and scalability.

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