STAFF ENGINEER, PKG SI INT

Posted Yesterday
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Singapore, SGP
In-Office
Senior level
Artificial Intelligence • Hardware • Information Technology • Machine Learning
Your talent powers our future.
The Role
Leads package-silicon integration for next-generation NAND packaging technologies. Responsibilities include chip-package interaction risk assessment, cross-functional technical investigations, root-cause analysis, reliability and manufacturability improvement, test vehicle and qualification planning, design-rule development, AI-enabled engineering analytics, and transition of new technologies into manufacturing. Provides technical leadership, mentoring, and communication of risks and recommendations across engineering teams.
Summary Generated by Built In
Our vision is to transform how the world uses information to enrich life for all.
Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.
Staff Engineer, Package-Silicon Integration
As a Staff Engineer, Package-Silicon Integration in Micron's Package Development Engineering (PDE) organization, you will drive package-silicon integration for next-generation NAND packaging technologies.
You will collaborate across silicon design, wafer fabrication, package design, assembly, reliability, and manufacturing to identify and mitigate chip-package interaction risks. You will independently lead complex technical workstreams, develop integration solutions, and leverage AI-enabled and data-driven methods to accelerate engineering learning and enable robust design and manufacturing solutions.
Key Responsibilities
  • Lead Chip-Package Interaction (CPI) risk assessments for new silicon, package architectures, materials, and processes.
  • Partner with silicon, package, wafer fab, and assembly teams to resolve dicing, singulation, die integrity, and integration challenges.
  • Lead technical investigations using DOE, statistical analysis, physical characterization, failure analysis, reliability data, and AI-enabled analytical approaches where appropriate.
  • Drive root-cause analysis and solutions for yield, quality, reliability, and manufacturability issues.
  • Define and execute test vehicles, characterization strategies, process windows, and qualification plans.
  • Translate technical learning into design rules, specifications, FMEA controls, and Best-Known Methods (BKMs).
  • Leverage AI, automation, and data analytics to improve engineering efficiency, technical insight, knowledge capture, and decision-making.
  • Drive technology readiness and transition of new silicon and package technologies into manufacturing.
  • Identify integration and capability gaps and develop scalable technical solutions.
  • Communicate technical risks, findings, and recommendations across engineering teams and leadership.
  • Provide technical guidance and mentoring while promoting effective AI-enabled ways of working.

Minimum Qualifications
Education & Experience
  • Bachelor's degree or higher in Mechanical, Materials, Electrical/Electronic, Chemical, Semiconductor Engineering, Physics, or a related technical discipline.
  • Min 4 to 5 years of relevant semiconductor experience in either package-silicon integration, advanced packaging, wafer technology, assembly, reliability, materials, or process development.
  • Demonstrated ability to independently lead complex technical investigations.

Technical & Professional Skills
  • Strong understanding of semiconductor fabrication, packaging, assembly, materials, and/or reliability.
  • Experience in areas such as CPI, wafer/die mechanics, dicing, die integrity, package assembly, characterization, failure analysis, or reliability.
  • Experience with DOE, statistical analysis, root-cause analysis, DFMEA/PFMEA, and structured problem solving.
  • Ability to connect physical failure mechanisms to silicon, package, material, and process interactions.
  • Ability to translate technical findings into design requirements, process specifications, and manufacturing controls.
  • Proficiency in using data analytics, automation, and AI-enabled tools to improve engineering analysis, productivity, technical documentation, and problem solving.
  • Ability to critically assess AI-generated outputs and apply engineering judgment and data validation before using them for technical decisions.
  • Strong cross-functional collaboration, technical leadership, and communication skills.

About Micron Technology, Inc.
We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities - from the data center to the intelligent edge and across the client and mobile user experience.
To learn more, please visit micron.com/careers
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.
To request assistance with the application process and/or for reasonable accommodations, please contact [email protected]
Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.
Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.

Skills Required

  • Bachelor's degree or higher in Mechanical, Materials, Electrical/Electronic, Chemical, Semiconductor Engineering, Physics, or a related technical discipline.
  • Four to five years of relevant semiconductor experience in package-silicon integration, advanced packaging, wafer technology, assembly, reliability, materials, or process development.
  • Ability to independently lead complex technical investigations.
  • Strong understanding of semiconductor fabrication, packaging, assembly, materials, and/or reliability.
  • Experience with chip-package interaction, wafer/die mechanics, dicing, die integrity, package assembly, characterization, failure analysis, or reliability.
  • Experience with DOE, statistical analysis, root-cause analysis, DFMEA/PFMEA, and structured problem solving.
  • Ability to connect physical failure mechanisms to silicon, package, material, and process interactions.
  • Ability to translate technical findings into design requirements, process specifications, and manufacturing controls.
  • Proficiency in data analytics, automation, and AI-enabled tools for engineering analysis, productivity, technical documentation, and problem solving.
  • Ability to assess AI-generated outputs and apply engineering judgment and data validation to technical decisions.
  • Strong cross-functional collaboration, technical leadership, and communication skills.

Micron Technology Compensation & Benefits Highlights

  • Healthcare Strength — Health insurance is portrayed as comprehensive, with medical, dental, vision, prescription coverage and access to on-site or near-site health centers at many locations. Feedback suggests employees regard the coverage as very good overall.
  • Retirement Support — The 401(k) program is considered strong, with company materials citing a 5% match and multiple contribution options. Feedback suggests this match is frequently highlighted as a standout benefit.
  • Equity Value & Accessibility — Equity participation is accessible through a 15%‑discount ESPP, with RSUs offered in eligible roles. Feedback suggests these stock programs add meaningful value to total compensation.

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The Company
HQ: Boise, ID
45,000 Employees
Year Founded: 1978

What We Do

We are a world leader in innovative memory solutions that transform how the world uses information to enrich life for all. For over 45 years, our company has been instrumental to the world’s most significant technology advancements, delivering optimal memory and storage systems for a broad range of applications.

Why Work With Us

Global opportunities, team member development, and career advancement—Micron invests in you and celebrates your skills, a growth mindset, and the tenacity to strive. At Micron, everyone innovates.

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Micron Technology Offices

Hybrid Workspace

Employees engage in a combination of remote and on-site work.

Micron recognizes the importance of maintaining a healthy work-life balance to foster a culture of collaboration, innovation and meet the needs of the business. In alignment with these values, we offer four flexible work arrangement options

Typical time on-site: Flexible
HQBoise, ID
Bengaluru, Karnataka
Folsom, CA
Hyderabad, Telangana
Longmont, CO
Madhapur, Telangana
Manassas, VA
Milpitas, CA
Singapore, SG
Singapore, SG
Sydney, AU
Ulsoor, Bengaluru
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