Develop, sustain, and improve process yield for die attach, wirebond, inspection tools and/or process steps in the assembly of monolithically integrated optical circuits in 24x7 manufacturing and development facility. Focus on both process and tool ownership, process, equipment performance (MTBA, MTBF) and NPI.
Responsibilities include
- Become a process owner of many specific COC assembly processes, primarily wirebond and eutectic die attach.
- Peer-lead and develop expertise in specific assembly process modules as well as across the manufacturing process flow.
- Organize, analyze, and improve manufacturing processes to meet key performance indicators including efficiency, cycle time, yield, and reliability.
- Identify and reduce components of variability by conducting controlled experiments, analyzing, summarizing, and presenting results.
- Work in a team environment consisting of engineers, technicians and operators.
- Create written operational procedures and mentor/train operators.
- Responsible for New Tool selection , procurement , installation, and qualifying new tools.
- Work with development and other functional teams to define the assembly requirements for new product introduction.
- Identify, develop, and qualify new assembly processes and technologies to enable and support next generation product needs.
- Represent Assembly Engineering in various multi-functional teams.
- Work in a clean room environment and follow strict clean room requirements.
- Must be available for 24/7 factory on call.
Skills / Experience / Knowledge
- Strong hands-on background in assembly technologies and processes for microelectronics manufacturing
- Hands-on operation and maintenance of assembly process tools and metrology equipment
- Technical expertise and ownership in die attach via solder or epoxy bonding on Micron2/Datacon EVO tool platform.
- Wafer fab or Assembly shop floor control systems
- Process engineering statistics background (SPC, DOE)
- Experience with Failure Analysis
- Material and Tool selection
- Plasma cleaning equipment and process
- Troubleshooting and resolving equipment problems
- Hands-on data analysis with JMP, MATLAB, or similar packages
- Experience in mentorship and training of operators, engineering technicians, and junior engineers
- Ability to work closely and coordinate activities with other functional groups.
- Good communication and project management skills
- Safety and quality-oriented mindset
Knowledge & Experience
Bachelor’s degree in electrical, Mechanical, Materials Engineering, or related field, plus 8 years of related experience, or master’s degree with 5 years of experience in semiconductor packaging & assembly technology in a manufacturing environment.
Nokia is a global leader in connectivity for the AI era. With expertise across fixed, mobile and transport networks, powered by the innovation of Nokia Bell Labs, we’re advancing connectivity to secure a brighter world.
Our recruitment process
We act inclusively and respect the uniqueness of people. Our employment decisions are made regardless of race, color, national or ethnic origin, religion, gender, sexual orientation, gender identity or expression, age, marital status, disability, protected veteran status or other characteristics protected by law. We are committed to a culture of inclusion built upon our core value of respect.
If you’re interested in this role but don’t meet every listed requirement, we still encourage you to apply. Unique backgrounds, perspectives, and experiences enrich our teams, and you may be just the right candidate for this or another opportunity.
The length of the recruitment process may vary depending on the specific role's requirements. We strive to ensure a smooth and inclusive experience for all candidates. Discover more about the recruitment process at Nokia.
- Corporate Retirement Savings Plan
- Health and dental benefits
- Short-term disability, and long-term disability
- Life insurance, and AD&D – Company paid 2x base pay
- Optional or Supplemental life and AD&D insurance (Employee/Spouse/Child)
- Paid time off for holidays and Vacation
- Employee Stock Purchase Plan
- Tuition Assistance Plan
- Adoption assistance
- Employee Assistance Program/Work Life Resource Program
Skills Required
- Bachelor's degree in electrical, mechanical, materials engineering, or a related field, plus 8 years of related experience
- Master's degree with 5 years of experience in semiconductor packaging and assembly technology in a manufacturing environment
- Strong hands-on experience with microelectronics assembly technologies and processes
- Hands-on operation and maintenance of assembly process tools and metrology equipment
- Technical expertise with die attach using solder or epoxy bonding on Micron2 or Datacon EVO platforms
- Experience with wafer fab or assembly shop floor control systems
- Process engineering statistics experience, including SPC and DOE
- Failure analysis experience
- Material and tool selection experience
- Experience with plasma cleaning equipment and processes
- Ability to troubleshoot and resolve equipment problems
- Hands-on data analysis experience with JMP, MATLAB, or similar software
- Experience mentoring and training operators, engineering technicians, and junior engineers
- Ability to coordinate closely with other functional groups
- Good communication and project management skills
- Safety- and quality-oriented mindset
- Availability for 24/7 factory on-call support
Nokia Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Nokia and has not been reviewed or approved by Nokia.
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Equity Value & Accessibility — Equity programs include a global employee share purchase plan with company matching and multi‑year share awards. These mechanisms broaden participation and tie rewards to long‑term outcomes.
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Healthcare Strength — Health coverage includes major medical plans with supplementary options such as vision, legal services, and care navigation. The range of offerings indicates comprehensive support for medical needs.
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Parental & Family Support — A global policy grants paid leave for new parents regardless of gender and provides structured return‑to‑work support. Company‑paid life insurance further strengthens family protection across regions.
Nokia Insights
What We Do
At Nokia, we create technology that helps the world act together. As a trusted partner for critical networks, we are committed to innovation and technology leadership across mobile, fixed and cloud networks. We create value with intellectual property and long-term research, led by the award-winning Nokia Bell Labs. Adhering to the highest standards of integrity and security, we help build the capabilities needed for a more productive, sustainable and inclusive world.
