Staff Applications Engineer

Posted Yesterday
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Wilmington, MA, USA
In-Office
130K-194K Annually
Senior level
Semiconductor • Manufacturing
Onto Innovation stands alone in process control with our unique perspective across the semiconductor value chain.
The Role
Develops and optimizes lithography applications for advanced packaging, substrates, and electronics manufacturing. Responsibilities include designing experiments, characterizing materials and capabilities, troubleshooting processes, supporting customer evaluations, validating products, creating application documentation, and contributing to new product introduction. The role provides technical leadership, customer guidance, cross-functional collaboration, training, and mentorship while supporting commercialization of next-generation lithography solutions.
Summary Generated by Built In

Onto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that include: 3D metrology spanning the chip from nanometer-scale transistors to micron-level die-interconnects; macro defect inspection of wafers and packages; metal interconnect composition; factory analytics; and lithography for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our customers solve their most difficult yield, device performance, quality, and reliability issues. Onto Innovation strives to optimize customers’ critical path of progress by making them smarter, faster and more efficient.

Job Summary & Responsibilities

Onto Innovation is seeking a Staff Applications Engineer to support its lithography product portfolio. This role is ideal for an experienced lithography process engineer who has developed and optimized production lithography processes in a semiconductor, advanced packaging, substrate, or electronics manufacturing environment.

The successful candidate will work closely with engineering teams to develop lithography applications, characterize new capabilities, validate system performance, and support deployment of lithography solutions for advanced packaging and substrate manufacturing. While this role is primarily focused on application development and technology characterization, the candidate must be capable of engaging in technical discussions with customers and providing expert guidance on lithography processes, materials, and applications.

This position combines hands-on process development, experimentation, product validation, and technical leadership in support of next-generation packaging and substrate manufacturing technologies.


Key Responsibilities

Application Development

  • Develop and optimize lithography applications for advanced packaging, IC substrates, glass core substrates, HDI, and panel-level manufacturing processes.
  • Design and execute experiments to evaluate imaging performance, process capability, and throughput.
  • Develop Best Known Methods (BKMs), application guidelines, and deployment workflows.
  • Characterize new lithography capabilities, materials, and process configurations.
  • Troubleshoot complex lithography process challenges and provide technical recommendations to internal teams and customers.

Customer Evaluations & Technical Support

  • Support customer demonstrations, evaluations, benchmark studies, and proof-of-concept programs.
  • Develop customer-specific application workflows and evaluation methodologies.
  • Analyze experimental results and provide technical recommendations.
  • Participate in technical discussions with customers to understand process requirements and address application challenges.
  • Support customer acceptance testing and process qualification activities.

Product Validation & New Product Introduction

  • Support characterization and validation of new products, features, and process capabilities.
  • Develop application test plans and performance benchmarks.
  • Provide application feedback to Product Development and Systems Engineering teams.
  • Support product launch activities, customer qualifications, and technology commercialization efforts.
  • Participate in roadmap evaluations and next-generation product development.

Technical Leadership

  • Serve as a subject matter expert for lithography processes and materials.
  • Support technical escalations and complex application issues.
  • Lead or contribute to cross-functional projects involving Engineering, Manufacturing, Product Management, and Field organizations.
  • Mentor junior engineers and contribute to application development best practices.

Documentation & Training

  • Develop application reports, process guidelines, technical documentation, and training materials.
  • Deliver application and product training to internal teams and customers.
  • Support knowledge transfer activities for new products and applications.

Qualifications

  • Bachelor's degree in engineering, Physics, Materials Science, Chemistry, or a related technical field with 8+ years of relevant experience.

OR

  • Master's degree with 5+ years of relevant experience.

OR

  • PhD with 3+ years of experience.

Experience

  • Hands-on experience as a Lithography Process Engineer, Process Development Engineer, Module Engineer, or Applications Engineer in a semiconductor, advanced packaging, substrate, PCB, or electronics manufacturing environment.
  • Extensive experience developing, qualifying, optimizing, and troubleshooting production lithography processes.
  • Strong knowledge of photolithography processes and materials, including photoresists, dry film resists, dielectric materials, glass, organic substrates, and other advanced packaging materials.
  • Demonstrated success applying lithography and materials expertise to solve complex manufacturing and process integration challenges.
  • Proven technical leadership in process development, technology transfers, manufacturing ramps, or major engineering initiatives.
  • Experience leading cross-functional engineering projects and influencing technical decisions across engineering and manufacturing organizations.
  • Strong verbal, written, and presentation skills, with the ability to effectively engage customers in technical discussions related to lithography processes, materials, and applications.
  • Ability to travel domestically and internationally as required.

Preferred Qualifications

  • Experience with advanced packaging, IC substrates, glass core substrates, HDI, panel-level packaging, or PCB manufacturing.
  • Experience supporting process qualifications, technology transfers, manufacturing ramps, or New Product Introduction (NPI) programs.
  • Demonstrated leadership through mentoring engineers or technicians, leading technical projects, or driving cross-functional initiatives.
  • Experience commercializing new technologies or supporting customer adoption of manufacturing processes and products.

Ideal Candidate

An experienced lithography process engineer from a semiconductor fab, OSAT, substrate manufacturer, or PCB facility with deep expertise in lithography processes and materials. The ideal candidate has a track record of solving complex manufacturing challenges, leading technical initiatives, and driving process development or manufacturing improvements. They are a strong hands-on engineer, an effective technical collaborator, and possess the technical credibility to engage customers and cross-functional teams. Prior people-management experience is beneficial, but not required; successful candidates should demonstrate the potential to grow into broader technical and organizational leadership roles.

Why Join Onto Innovation?

At Onto Innovation, we believe your work should matter—and so should your well-being. That’s why we offer competitive salaries and a comprehensive benefits package designed to support you and your family. From health, dental, and vision coverage to life and disability insurance, PTO, and a 401(k) with employer match, we’ve got you covered. You’ll also enjoy access to our Employee Stock Purchase Program (ESPP), wellness initiatives, and cutting-edge tools—all within a collaborative, inclusive culture where your contributions are valued and recognized.

Compensation & Growth

• Base Salary Range:

$129,600.00 - $194,400.00, offered in good faith and based on experience, location, and qualifications.
  • Additional Rewards: Annual bonus opportunities and potential long-term incentives tied to both company and individual success.

Empowering Every Voice to Shape the Future:

Onto Innovation is committed to creating a workplace where every qualified candidate has an equal opportunity to succeed. We evaluate applicants based on skills, experience, and potential - without regard to race, color, religion, gender, sexual orientation, national origin, age, disability, veteran status, or any other characteristic protected by law. We believe diversity of thought and background drives innovation and strengthens our team.

Important Note on Export Compliance

For certain positions requiring access to technical data, U.S. export licensing review may be necessary for applicants who are not U.S. Citizens, Permanent Residents, or other protected persons under 8 U.S.C. 1324b(a)(3).

Skills Required

  • Bachelor's degree in engineering, physics, materials science, chemistry, or a related technical field with 8+ years of relevant experience
  • Master's degree in a relevant technical field with 5+ years of relevant experience
  • PhD in a relevant technical field with 3+ years of relevant experience
  • Hands-on experience as a lithography process engineer, process development engineer, module engineer, or applications engineer
  • Experience in semiconductor, advanced packaging, substrate, PCB, or electronics manufacturing
  • Extensive experience developing, qualifying, optimizing, and troubleshooting production lithography processes
  • Strong knowledge of photolithography processes and materials, including photoresists, dry film resists, dielectric materials, glass, and organic substrates
  • Experience solving complex manufacturing and process integration challenges using lithography and materials expertise
  • Technical leadership experience in process development, technology transfers, manufacturing ramps, or major engineering initiatives
  • Experience leading cross-functional engineering projects and influencing technical decisions across engineering and manufacturing organizations
  • Strong verbal, written, and presentation skills, including the ability to engage customers in technical discussions
  • Ability to travel domestically and internationally as required
  • Experience with advanced packaging, IC substrates, glass core substrates, HDI, panel-level packaging, or PCB manufacturing
  • Experience supporting process qualifications, technology transfers, manufacturing ramps, or NPI programs
  • Experience mentoring engineers or technicians and leading technical projects
  • Experience commercializing new technologies or supporting customer adoption of manufacturing processes and products

Onto Innovation Compensation & Benefits Highlights

The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Onto Innovation and has not been reviewed or approved by Onto Innovation.

  • Equity Value & Accessibility — An employee stock purchase plan and broad equity eligibility provide accessible ownership opportunities as part of total compensation. Company materials reference active equity programs, signaling tangible value beyond base pay.
  • Healthcare Strength — Medical, dental, and vision coverage with HSA/FSA options form a comprehensive health package that is often characterized as good. Wellness resources and employer-verified plan details reinforce perceived healthcare depth.
  • Retirement Support — A 401(k) with company match supports long-term financial security. Company materials and benefits pages highlight these retirement features as core elements of the package.

Onto Innovation Insights

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The Company
HQ: Wilmington, MA
1,146 Employees
Year Founded: 2019

What We Do

Onto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that include: Un-patterned wafer quality; 3D metrology spanning chip features from nanometer scale transistors to large die interconnects; macro defect inspection of wafers and packages; metal interconnect composition; factory analytics; and lithography for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our customers solve their most difficult yield, device performance, quality, and reliability issues. Onto Innovation strives to optimize customers’ critical path of progress by making them smarter, faster and more efficient. Headquartered in Wilmington, Massachusetts, Onto Innovation supports customers with a worldwide sales and service organization. We are traded on the New York Stock Exchange under the symbol ONTO.

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