We are actively driving advanced package technology and developing power package with focusing on next generation technologies for AI data center and automotive. To achieve the rapidly growing demand and expedite release to market of power packages, we are developing such as Power QFN, HSON, HSOT and TOLL. This role offers the opportunity to work on, higher density, lower resistance, higher reliability, and high thermal dissipation package design and develop technologies.
Key Responsibilities
- Design and develop power package and interconnect for Renesas’s packaging needs in the areas of power QFN, HSON, HSOT and TOLL for AI data center and Automotive.
- Work with OSAT/Internal manufacturing especially collaboration with Malaysia and Japan PKG team to develop, run DOE to optimize processes and establish process specification.
- Work with Product groups and QA team to define target of package structure/design, develop new package and processes, and qualify packages within required period.
- Ensure smooth transition into production by establishing robust design and process through the DOE results, verification, and resolving issuesduring development period.
- Develop and maintain technical expertise on advances and innovations in advanced power package design, process, and interconnect that linked and execute pkg roadmap.
- Doctoral / Master’s / Bachelor’s degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering.
- 5-12 years of relevant experience in package development emphasizing Power package design and assembly process development.
- Understanding of semiconductor power device package assembly processes, materials, and technology. Knowledge of die bond, clip bond, wire-bonding, flip chip. Knowledge of SPC and statistical analysis, AutoCAD, PowerPoint, Excel, Word.
- Strong interpersonal and communication skills.
- Strong analytical and presentation skills.
- Strong proactive attitude towards tackling challenges with enthusiasm.
- Willingness to take ownership and lead in any challenge without giving up achieving goal
Renesas is an embedded semiconductor solution provider driven by its Purpose ‘To Make Our Lives Easier.’ As the industry’s leading expert in embedded processing with unmatched quality and system-level know-how, we have evolved to provide scalable and comprehensive semiconductor solutions for automotive, industrial, infrastructure, and IoT industries based on the broadest product portfolio, including High Performance Computing, Embedded Processing, Analog & Connectivity, and Power.
With a diverse team of over 21,000 professionals in more than 30 countries, we continue to expand our boundaries to offer enhanced user experiences through digitalization and usher into a new era of innovation. We design and develop sustainable, power-efficient solutions today that help people and communities thrive tomorrow, ‘To Make Our Lives Easier.’
At Renesas, you can:
- Launch and advance your career in technical and business roles across four Product Groups and various corporate functions. You will have the opportunities to explore our hardware and software capabilities and try new things.
- Make a real impact by developing innovative products and solutions to meet our global customers' evolving needs and help make people’s lives easier, safe and secure.
- Maximize your performance and wellbeing in our flexible and inclusive work environment. Our people-first culture and global support system, including the remote work option and Employee Resource Groups, will help you excel from the first day.
Are you ready to own your success and make your mark?
Join Renesas. Let’s Shape the Future together.
Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.
We have adopted a hybrid model that gives employees the ability to work remotely two days a week while ensuring that we come together as a team in the office the rest of the time. The designated in-office days are Tuesday through Thursday for innovation, collaboration and continuous learning.
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What We Do
We're the world's leading semiconductor manufacturer. Our mission is to make our lives easier and a world that's safer, healthier, greener, and smarter.
