Sr. Principal Analog/RF/Mixed Signal IC Design & Development

Posted Yesterday
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2 Locations
Remote or Hybrid
Senior level
Software
The Role
Leads the design and development of high-speed analog, RF, and mixed-signal ICs for coherent optical and PAM4 communication systems. Responsibilities include transistor-level architecture, circuit design, layout, silicon bring-up, characterization, RF wafer probing, specification development, design reviews, and collaboration with product engineering and optical systems teams. Provides technical guidance and mentorship while developing solutions using SiGe BiCMOS and CMOS processes.
Summary Generated by Built In

Join Nokia's advanced photonics and semiconductor design team, developing next-generation analog ICs for high-speed optical communication systems. In this role, you will design and lead development of high speed Transmit (TIA) and Receive (MZMD) components for coherent long-haul and metro systems as well as PAM4 data center systems, primarily using SiGe BiCMOS and CMOS processes.

You will play a key role in delivering innovative solutions that enable faster, more efficient data transmission across data centers and telecommunications networks, and emerging AI-driven infrastructure.

Responsibilities
  • Responsible for design and development of Transmit (TIA) and Receive (MZMD) components for optical network systems (Coherent, PAM4, etc.).
  • Innovate and develop new architecture utilizing advanced process nodes, preparing these processes for subsequent product development.
  • In charge of many aspects of IC product development, such as design, layout, silicon bring-up and characterization.
  • Collaborate with product engineering and optical system groups to evaluate, develop, and refine "white box" specifications into detailed electrical specifications for both Tx and Rx components.
  • Provide significant technical contributions to design reviews, verifying design integrity and adherence to standards.
  • Work with ASIC group by applying Nokia documentation standards to optimize development cycles.
  • Offer technical guidance and share best practices in optical network design and development to mentor new hires and junior team members.
Qualifications
  • Master's (M.S.) or Ph.D. degree in Electrical Engineering with a minimum of 10 years of related experience in Analog/RF ASIC design and development
  • Demonstrated experience in high-speed Analog/RF IC designs (TIA, MZMD) with SiGe BiCMOS technology
  • Proven experience in:
    • Low noise / high linear (>80GHz) broadband analog circuits for optical front-end 
    • High-precision analog circuits (e.g., linear regulators, bandgaps, DAC/ADC).
  • Deep understanding of detailed transistor-level design, device physics, and control/feedback loop stability analysis
  • Knowledge of transmission lines and other high-frequency passive structures
  • Strong understanding of package and board-level design optimization
  • Experience with RF wafer probing, lab equipment, and evaluation of high-speed analog ICs
  • Demonstrated ability to independently resolve complex organizational and technical challenges
  • Solid expertise with EDA CAD tools, custom analog layout, 3D EM modeling
  • Strong problem-solving and decision-making capabilities
  • Highly- self-motivated, detail-oriented, and results-driven
  • Must be a team player with good verbal and written communication skills

Skills Required

  • Master’s degree or Ph.D. in Electrical Engineering
  • Minimum 10 years of related experience in Analog/RF ASIC design and development
  • Experience designing high-speed Analog/RF ICs, including TIA and MZMD components, using SiGe BiCMOS technology
  • Experience with low-noise, high-linearity broadband analog circuits above 80 GHz for optical front ends
  • Experience with high-precision analog circuits such as linear regulators, bandgaps, DACs, and ADCs
  • Deep understanding of transistor-level design, device physics, and control/feedback loop stability analysis
  • Knowledge of transmission lines and high-frequency passive structures
  • Understanding of package and board-level design optimization
  • Experience with RF wafer probing, laboratory equipment, and high-speed analog IC evaluation
  • Expertise with EDA CAD tools, custom analog layout, and 3D electromagnetic modeling
  • Ability to independently resolve complex technical and organizational challenges
  • Strong problem-solving, decision-making, communication, teamwork, and mentoring skills

Nokia Compensation & Benefits Highlights

The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Nokia and has not been reviewed or approved by Nokia.

  • Equity Value & Accessibility Equity programs include a global employee share purchase plan with company matching and multi‑year share awards. These mechanisms broaden participation and tie rewards to long‑term outcomes.
  • Healthcare Strength Health coverage includes major medical plans with supplementary options such as vision, legal services, and care navigation. The range of offerings indicates comprehensive support for medical needs.
  • Parental & Family Support A global policy grants paid leave for new parents regardless of gender and provides structured return‑to‑work support. Company‑paid life insurance further strengthens family protection across regions.

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The Company
HQ: Espoo
132,624 Employees

What We Do

At Nokia, we create technology that helps the world act together. As a trusted partner for critical networks, we are committed to innovation and technology leadership across mobile, fixed and cloud networks. We create value with intellectual property and long-term research, led by the award-winning Nokia Bell Labs. Adhering to the highest standards of integrity and security, we help build the capabilities needed for a more productive, sustainable and inclusive world.

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