Sr Manager, Product & Test Engineering - Power Modules

About Analog Devices

Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at www.analog.com and on LinkedIn and X.

Location: Taiwan

Reports To: Head of Product & Test Engineering – Data Center & Energy

Function: Product & Test Engineering — Power Modules (Si, SiC, GaN)

Travel: 15–25%, including international travel to manufacturing sites, OSAT partners, and key customers

We are seeking an accomplished Technical Manager, Product & Test Engineering to lead the strategic direction, technical execution, and team development for our advanced power module product lines (Si, SiC, GaN). This role combines deep product engineering ownership — from New Product Introduction (NPI) through high-volume manufacturing (HVM) and sustaining.

The Technical Manager serves as the senior technical authority who bridges R&D, reliability engineering, manufacturing, product marketing, and customer-facing teams. You will manage a team of product & test engineers while remaining hands-on in driving technical decisions, qualification strategies, and critical customer engagements. This is a high-impact leadership role for someone who thrives at the intersection of deep technical expertise and business-driven product strategy.

• Own end-to-end product engineering execution for advanced power modules from NPI through high-volume production and sustaining.
• Lead product bring-up, characterization, and silicon readiness in partnership with Design, Test, and Applications teams.
• Define and maintain product specifications, test limits, and guard-bands based on silicon behavior and manufacturing capability.
• Drive corner lot planning including characterization and qualification testing.
• Drive wafer acceptance test (WAT) to final test specification alignment.
• Own manufacturing release, qualification execution, and product change management (PCNs).
• Drive design for test (DFT) and design for manufacturability (DFM), and quality improvement through PPM reduction.

• Drive adoption of advanced test methodologies including adaptive testing, multi-site test optimization, and data-driven outlier screening to improve quality and reduce cost.
• Manage relationships with test equipment vendors and subcontract test operations at OSAT partners; own test floor readiness and capacity alignment for production ramps.
• Define Design-for-Test (DFT) requirements during the design phase; ensure adequate test access, built-in self-test (BIST) coverage, and production testability for new designs.
• Lead test yield improvement programs through statistical analysis — test limit optimization, guard-banding, GRR studies, Cpk monitoring, and STDF data analytics.
• Establish bench-to-ATE correlation methodology and standards for precision analog measurements: DC parametrics, AC response, gain/offset, noise, PSRR, leakage, timing, and power efficiency.
• Drive test hardware design standards for load boards, probe cards, and device interface boards; ensure signal integrity, power integrity, and measurement accuracy across all test interfaces.
• Oversee test program development and maintenance — automated test software (C/C++, Python), test coverage optimization, and test time reduction initiatives.
• Define and execute the test strategy for power module product lines across Si, SiC, and GaN technologies — spanning wafer sort, module-level final test, and system-level validation.

• Own the manufacturability of advanced power modules, driving robust assembly processes across contract manufacturers (CM).
• Establish and enforce assembly workmanship standards, ensuring compliance with IPC-A-610 (Acceptability of Electronic Assemblies).
• Drive cross-functional alignment across Design, Test, Quality, and Manufacturing to enable scalable, high-yield module production.
• Lead resolution of assembly-related excursions, including die attach, clip attach, solder integrity, and module-level defects.
• Work with assembly team to drive the packaging roadmap for current and next-generation module platforms, including advanced packaging technologies (fan-out, embedded die, flip-chip).
• Coordinate with supply chain team on capacity planning, technology qualification, and supply chain readiness.

• Work with Reliability team to define, execute, and oversee comprehensive qualification and reliability test plans aligned with IPC-9592 / IPC-9592B for power conversion devices.
• Execute and oversee reliability tests including: HTRB, HTGB, HAST, Temperature Cycling, Power Cycling, Thermal Shock, Vibration, Mechanical Shock, HTS/LTS, Life testing, and Burn-in.
• Conduct HALT (Highly Accelerated Life Testing) and HASS (Highly Accelerated Stress Screening) per IPC-9592A guidelines; establish operational and destruct limits for power modules.
• Apply Design for Reliability practices including MTBF analysis, derating, FMEA, corrosion analysis, and moisture sensitivity assessment.
• Ensure compliance with automotive standards and AEC-Q qualifications where applicable.
• Validate that all products meet customer, regulatory, and internal reliability requirements prior to production release.

• Serve as the senior technical interface for strategic customers on product, quality, manufacturing, and roadmap topics.
• Own successful execution of assigned customer programs — align internal timelines with customer expectations and proactively identify and mitigate risks.
• Lead technical escalations for production issues, customer returns, and corrective actions.
• Conduct regular program reviews with internal and customer stakeholders; provide data-driven status updates on schedule, quality, and risks.
• Establish execution dashboards and performance metrics for customer-facing program management.
• Support design-in activities, product qualification at customer sites, and on-site technical consultations.

• Build, manage, and develop a team of product engineers — including hiring, onboarding, mentoring, and performance management.
• Establish product & test engineering standards for product readiness, manufacturability, and quality across the team.
• Drive workforce planning to scale the product engineering function in alignment with business growth.
• Foster a culture of technical excellence, data-driven decision-making, and continuous improvement.
• Mentor and grow next-generation technical leaders within the organization.

• Lead yield analysis, parametric trend monitoring, and root-cause investigations across the module portfolio.
• Drive cost, yield, and cycle-time improvement through data-driven analysis and systematic problem-solving.
• Leverage hands-on experience with FA laboratories, Design of Experiments (DOE), and material/process characterization.
• Establish and maintain KPIs and dashboards for product engineering performance, quality, and delivery.
• Champion continuous improvement initiatives across the product engineering function.

• Bachelor's degree required in Electrical Engineering, Computer Engineering, Electronics Engineering, Materials Science, Microelectronics, or a related field.
• Master's degree strongly preferred in a relevant engineering discipline.
• Mechanical Engineering background is a plus, particularly for roles involving module packaging, thermomechanical analysis, and assembly optimization.

• 10+ years of progressive experience in semiconductor product engineering, manufacturing engineering or test engineering — with demonstrated end-to-end ownership from NPI through high-volume production.
• 5+ years in a leadership role managing engineers or cross-functional technical teams.
• Strong technical depth in semiconductor power products (IGBT, MOSFET, SiC, GaN) and advanced power module design, assembly, and manufacturing.
• Demonstrated expertise in module product & test engineering, qualification, reliability testing, failure analysis, and assembly/packaging development.
• Proven track record of defining and executing product roadmaps, driving new product introductions, and managing product lifecycle.
• In-depth knowledge of IPC-9592 / IPC-9592B qualification, reliability, and manufacturing conformance requirements.
• Experience with automotive standards and AEC-Q qualification processes.
• Hands-on experience interfacing with CM partners and managing manufacturing transfers across global sites.

• Deep understanding of thermal, electro-thermal, and mechanical fatigue failure mechanisms in power modules.
• Working knowledge of advanced packaging technologies (fan-out, embedded die, flip-chip) and module assembly methods.
• Proficiency in both front-end and back-end semiconductor manufacturing processes.
• Advanced proficiency in data analysis tools including JMP, Minitab, Python, and Excel.
• Proficiency in reliability statistical methods (Weibull analysis, DOE, FMEA).
• Understanding of DC/DC converter architectures and power delivery systems.
• Working knowledge of ATE platforms (Teradyne Eagle/ETS, Advantest V93000) and test program architecture — sufficient to provide technical direction and review test engineering output.
• Familiarity with test hardware design: load board schematics, probe card specifications, and high-frequency measurement interface requirements.
• Understanding of semiconductor test economics: test time optimization, multi-site efficiency, test coverage vs. cost trade-offs, and test floor capacity modeling.
• Experience with production test data infrastructure — STDF format, yield analytics platforms (Spotfire, Tableau, or equivalent), and statistical process control for test operations.

• Proven leadership in building, managing, and developing high-performing engineering teams.
• Exceptional project ownership, organizational abilities, and stakeholder management skills — comfortable operating at both executive and hands-on technical levels.
• Excellent communication and presentation capabilities — skilled at articulating complex technical concepts to customers, senior leadership, and cross-functional partners.
• Ability to lead without direct authority across multi-disciplinary, global teams.
• Strong analytical and troubleshooting capability with confident, systematic decision-making.

• Experience in AI / data center power delivery, hyperscaler programs, or high-performance computing power solutions.
• Experience with customer-facing program management for Tier-1 OEMs or hyperscale customers.
• Six Sigma or equivalent quality methodology certification.
• Hands-on background in ATE test program development or test engineering earlier in career, with progression into leadership.
• Experience building and scaling test engineering teams in Asia-Pacific (Taiwan, Thailand, or Southeast Asia).
• Exposure to AI/ML techniques applied to test data analysis, adaptive testing, or predictive yield modeling.

For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export  licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls.  As such, applicants for this position – except US Citizens, US Permanent Residents, and protected individuals as defined by 8 U.S.C. 1324b(a)(3) – may have to go through an export licensing review process.

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