(Sr. Engineer / Engineer) Process Integration Engineer (Device)

Posted 13 Days Ago
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Hiring Remotely in Yokohama, Kanagawa, JPN
Remote
Senior level
Semiconductor • Manufacturing
The Role
Design and verify semiconductor device test structures, analyze wafer and silicon testing results, organize device characterization data, and support CMOS image sensor development. The role collaborates with process integration, TCAD, and pixel design teams to meet product requirements and schedules. It requires hands-on layout design, statistical data analysis, semiconductor device knowledge, project coordination, business-level Japanese, and beginner-level English communication.
Summary Generated by Built In
Responsibilities: 
Process Integration Engineer (Device) requires experience in the layout design and the analysis of wafer testing for CMOS device, working in close collaboration with CIS process integration engineers and pixel designers.
• Comprehend device test structure requirement and perform hands-on layout design and verification
• Analyze silicon testing results by using data analysis software and prepare a summary.
• Organize device characteristics and wafer testing results to support CMOS image sensor development.
• Collaborate with process integration, TCAD, and pixel design teams based on product requirements and schedules.
 
Requirements: 
•1+ years of experience in test structure design using layout design tool.
•1+ years of experience in analysis of wafer testing result using statistical data analysis software.
•Basic knowledge of semiconductors, MOS transistor structures, device performance.
•Support daily operations and coordination for smooth project handling.
•Understanding of CIS pixel structure and operation is a plus.
•Associate's Degree or higher in Electrical Engineering, Physics, a related field, or equivalent work experience.
•Need English communication skill (beginner level, not need very fluent) and Japanese communication skill (Business level)
•Result oriented and embraced change behaviors.
 

Skills Required

  • 1+ years of experience in test structure design using a layout design tool
  • 1+ years of experience analyzing wafer testing results using statistical data analysis software
  • Basic knowledge of semiconductors, MOS transistor structures, and device performance
  • Associate's Degree or higher in Electrical Engineering, Physics, a related field, or equivalent work experience
  • Beginner-level English communication skills
  • Business-level Japanese communication skills
  • Understanding of CIS pixel structure and operation
  • Result-oriented and change-embracing behavior
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The Company
HQ: Santa Clara, California
1,448 Employees
Year Founded: 1985

What We Do

Founded in 1995, OMNIVISION has been at the leading-edge of technology, developing and delivering advanced digital imaging, analog, and touch & display solutions for multiple applications across several industries. With more than 3,000 employees worldwide and over 13 billion products shipped, OMNIVISION is a well-known global fabless semiconductor company. Our products can be found everywhere in people’s lives including mobile phones, security & surveillance, automotive, computing, medical, and emerging applications. Across these segments, OMNIVISION’S award-winning technology enables a smoother human/machine interface in many of today’s commercial devices. In this way, OMNIVISION delivers solutions that put its customers at the leading edge of technology. Whether it be developing the first mobile handset camera accessory in 2002, introducing the world’s smallest NTS camera in 2006 or launching PureCel CMOS image sensors in 2013, our dedication to providing reliable, innovative imaging and sensing solutions continue to be the primary aim. The company has recorded numerous industry firsts in its relentless quest for technology breakthroughs that deliver #InfiniteIngenuity: • Guinness World Record for the World's Smallest Commercially Available Image Sensor (OV6948) in 2019. In 2021, it beat its own record with the new OH0TA OVMed® • First to commercialize backside illumination technology in 2007 (OmniBSI™) • Industry's 1st to deploy the most mature LED Flicker Mitigation (LFM) solution in mass production for multiple automotive applications • Automotive industry leader with HALE, our HDR & LFM Engine combination algorithm • Developer of Nyxel® near-infrared technology with by far the best quantum efficiency in CMOS near-infrared imagine • Creator of CameraCubeChip™, the industry’s 1st wafer-level camera modules • First and only global shutter image sensors with cybersecurity, for ADAS and autonomous vehicles • First to introduce RBG-Ir technology to medical

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