Rambus, a premier chip and silicon IP provider, is seeking to hire an exceptional Senior Principal Engineer with signal integrity and package design experience to join our Memory Interface Chips BU’s engineering team in Bangalore, India. In this highly visible role, you will work within our SI/PI team to work on modeling, analysis, and simulations of signal integrity (SI) and power integrity (PI) in the very challenging DDR field.
Rambus offers a flexible work environment, embracing a hybrid approach for most office-based roles. Employees are encouraged to spend an average of at least three days per week onsite, allowing for two days of remote work.
Responsibilities- Create SI/PI methodologies and work with the design & chip layout teams to do SI/PI study and package design for the latest DDR product portfolio
- Work with package and validation team to define specifications and system design requirements such as packaging and PCB routings, IC-PKG-BRD decoupling requirements, channel simulations and jitter sensitivity analysis.
- Provide guidelines based on SI/PI study and simulation and silicon correlation so that our products will have superior SI performance.
- Work with our customers to do collaboration to find the optimum SI/PI solution.
- Help the team during debug and bring up in lab if needed.
- Solid background in SI/PI and package design.
- BE or MS or MTech in Electrical Engineering with 12+ years of industry experience.
- Prior experience in simulating high speed memory (DDR4, DDR5) and/or SERDES interfaces is required.
- Solid theoretical background and understanding in EM and transmission line theory is a must
- Strong background and solid understanding of equalization techniques such as FIR/FFE/DFE/CTLE are required
- Must understand package and PCB design, be able to use APD/Allegro layout files.
- On-Die PDN design exposure is big plus.
- Experience in correlating simulation results with lab measurements using scopes, TDRs, VNAs etc.
- Strong understanding of the server system, from CPUs to DRAMs on DIMM modules, is highly desirable
- Proficient with simulations using Spice and ADS.
- Experience with commercial EDA tools such as HFSS, Q3D or equivalent tools is must.
- Familiarity with RedHawk/Totem or XcitePI is a strong plus.
- Must be an innovative, self-motivated individual, be able to manage and drive his projects, and must be a team player
About Rambus
Rambus is a global company that makes industry-leading memory interface chips and Silicon IP to advance data center connectivity and solve the bottleneck between memory and processing. With over 30 years of semiconductor experience, we are a leading provider of high-performance products and innovations that maximize the bandwidth, capacity and security for AI and other data-intensive workloads. Our world-class team is the foundation of our company, and our innovative spirit drives us to develop the cutting-edge products and technologies essential for tomorrow’s systems.
Rambus offers a competitive compensation package, including base salary, bonus, equity and employee benefits.
Rambus is committed to cultivating a culture where we actively seek to understand, respect, and celebrate the complex and rich identities of ourselves and others. Our Diversity, Equity, and Inclusion initiatives are geared towards valuing the differences in backgrounds, experiences, and thoughts at Rambus to help enhance collaboration, teamwork, engagement, and innovation. At Rambus, we believe that we can be our best when every member of our organization feels respected, included, and heard.
Rambus is proud to be an Equal Employment Opportunity and Affirmative Action employer. We do not discriminate based upon race, religion, color, national origin, sex (including pregnancy, childbirth, or related medical conditions), sexual orientation, gender identity, gender expression, age, status as a protected veteran, status as an individual with a disability, genetic information, or other applicable legally protected characteristics.
Rambus is committed to providing reasonable accommodations for qualified individuals with disabilities and disabled veterans during our job application procedures. If you require assistance or an accommodation due to a disability, please feel free to inform us in your application.
Rambus does not accept unsolicited resumes from headhunters, recruitment agencies or fee-based recruitment services.
For more information about Rambus, visit rambus.com. For additional information on life at Rambus and our current openings, check out rambus.com/careers/.
Skills Required
- Bachelor’s, master’s, or MTech degree in Electrical Engineering
- 12 or more years of industry experience
- Strong background in signal integrity, power integrity, and package design
- Experience simulating DDR4, DDR5, and/or SerDes interfaces
- Strong theoretical understanding of electromagnetic and transmission-line theory
- Understanding of FIR, FFE, DFE, and CTLE equalization techniques
- Understanding of package and PCB design, including APD or Allegro layout files
- Experience correlating simulations with laboratory measurements using oscilloscopes, TDRs, or VNAs
- Proficiency with SPICE and ADS simulations
- Experience with commercial EDA tools such as HFSS and Q3D
- Understanding of server systems from CPUs to DRAMs on DIMM modules
- On-die PDN design experience
- Familiarity with RedHawk, Totem, or XcitePI
- Ability to manage and drive projects independently while working effectively on a team
What We Do
Dedicated to making data faster and safer, Rambus creates innovative hardware, software and services that drive technology advancements from the data center to the mobile edge. Our architecture licenses, IP cores, chips, software, and services span memory and interfaces, security, and emerging technologies to positively impact the modern world. We collaborate with the industry, partnering with leading chip and system designers, foundries, and service providers. Integrated into tens of billions of devices and systems, our products and technologies power and secure diverse applications, including Big Data, Internet of Things (IoT) security and much more!
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