Quality Management
Design, monitor and maintain the overall quality standards for semiconductor assembly and test processes.
Develop and maintain quality documentation, including Control Plans, PFMEA, Process Flow Charts, incoming & outgoing Quality requirements and Work Instructions.
Ensure compliance with customer, industry, internal quality requirements, as well relevant ISO (such as ISO9001).
Problem Solving & Failure Analysis
Lead root cause analysis (RCA) using 8D, 3x5 Why, Fishbone, and other quality tools.
Drive corrective and preventive actions (CAPA) for quality excursions and customer complaints.
Support failure analysis activities and coordinate with engineering teams for resolution.
Process Control & Improvement
Monitor process capability using SPC methodologies.
Analyse yield, defect trends, and reliability data.
Lead continuous improvement projects to reduce defects and improve yield performance.
Supplier & Customer Quality
Support supplier audits and qualification activities.
Interface with OSAT partners, customers, and internal stakeholders regarding quality issues at OSAT.
Manage the change control request review and approval, related to materials, processes, and equipment.
Audits & Compliance
Conduct internal and external quality audits.
Support customer audits and certification activities.
Ensure compliance with QMS, ISO 9001, (16949), JEDEC, and customer-specific requirements where applicable.
Bachelor's Degree in Electrical Engineering, Electronics Engineering, Materials Science, Mechanical Engineering, Physics, Chemistry, or related field.
5+ years of semiconductor assembly and test Quality experience, preferably in OSAT, or IDMs.
Knowledge of semiconductor packaging technologies such as Flip Chip, BGA, QFN, WLCSP – bumping, fan-out, back-grind, wafer saw, 2.5D/interposer assembly. Wafer & Final Test quality experience is an added advantage.
Technical Skills:
Statistical Process Control (SPC)
Failure Analysis (FA)
FMEA / PFMEA
CAPA
8D Problem Solving
DOE (Design of Experiments)
Yield Analysis & Defect Reduction
Reliability Engineering
QMS - ISO 9001, IATF 16949
Minitab, JMP, Excel, SQL (preferred)
Strong analytical and troubleshooting skills.
Excellent communication and presentation abilities.
Experience working with OSAT subcontractors and cross-functional teams.
Ability to manage multiple projects and drive quality improvements independently.
Skills Required
- Bachelor's degree in Electrical, Electronics, Materials Science, Mechanical Engineering, Physics, Chemistry, or related field
- 5+ years semiconductor assembly and test quality experience, preferably in OSAT or IDM
- Knowledge of packaging technologies: Flip Chip, BGA, QFN, WLCSP, bumping, fan-out, back-grind, wafer saw, 2.5D/interposer assembly
- Wafer and final test quality experience
- Statistical Process Control (SPC)
- Failure Analysis (FA) and support for FA activities
- FMEA / PFMEA
- CAPA management
- 8D problem solving methodology
- Design of Experiments (DOE)
- Yield analysis and defect reduction
- Reliability engineering
- QMS certification knowledge: ISO 9001, IATF 16949
- Minitab, JMP, Excel
- SQL
- Strong analytical, communication, presentation, and project management skills
What We Do
Lumilens addresses the red hot market for AI data center infrastructure by designing, manufacturing and selling photonic interconnect solutions. We design and use custom robotics + AI in our factories to more efficiently build our products. Lumilens is backed by top-tier venture capital investors including Mayfield and Spark Capital.
