Senior Staff Engineer (Design)

Posted 14 Days Ago
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Bayan Lepas, Barat Daya, Pulau Pinang, MYS
In-Office
Senior level
3D Printing
The Role
Lead cross-functional teams to execute NPI projects, drive cost reduction, manage schedules, coordinate operations, and ensure program alignment and readiness.
Summary Generated by Built In
Job Description

Job Description

  • Lead cross-functional teams across Design, Systems, Validation, Product/Test Engineering, Firmware, Supply Chain, Procurement, and Quality to ensure seamless program execution in NPI projects.
  • Lead COGS reduction programs from impact assessment through qualification, PCN, safelaunch, and production ramp – quantifying savings, evaluating ROI, and assessing the business impact of schedule slips and risk scenarios.
  • Drive capacity expansion initiatives across global manufacturing sites, aligning engineering, operations, and supply chain to support production scalability.
  • Build and manage detailed schedules for NPI, COGS and capacity programs; track progress, remove roadblocks, and implement data‑driven mitigation plans.
  • Manage Engineering Build Request prioritization, conducting bi‑weekly reviews with PMO and Business Operations leadership to ensure alignment with organizational priorities.
  • Act as a liaison between the product group, operations/supply chain teams, and key OSAT interface teams to ensure alignment, clarity, and seamless execution across all stages of the program.
  • Drive sample readiness and ramp readiness, ensuring cross‑functional teams maintain schedules that support committed customer delivery timelines.
  • Coordinate and conduct Project Gate reviews, ensuring cross‑functional readiness, milestone alignment, and clear communication of risks and dependencies.
  • Oversee wafer fab, assembly, and test operations to ensure timeline adherence, cost efficiency, and quality standards across programs.
  • Provide structured leadership updates on program status, risks, and mitigation plans, maintaining accurate schedules and qualification documentation.

Qualifications

  • Bachelor’s or Master’s degree in Electrical Engineering, with 8+ years of experience in semiconductor packaging technology and product lifecycle management.
  • Strong understanding of semiconductor packaging manufacturing flows – including development and production processes, package architectures, and various package types with prior work experience at an assembly site as a process or integration engineer considered a strong plus.
  • Proven ability to lead complex, cross‑functional programs in ambiguous environments, supported by foundational Program/Project Management knowledge (coursework, certification, or equivalent).
  • Strong stakeholder management, communication, collaboration, and cross‑functional partnership skills across engineering, operations, supply chain, and OSAT teams.
  • Highly analytical with strong organizational, problem‑solving, time‑management, and multitasking capabilities.
  • Quick learner with the ability to adopt new tools, systems, and processes efficiently; proficient in Microsoft Office and project management tools.
  • Self‑motivated, inquisitive, and committed to continuous personal and professional development.

Additional Information

Renesas is an embedded semiconductor solution provider driven by its Purpose ‘To Make Our Lives Easier.’ As the industry’s leading expert in embedded processing with unmatched quality and system-level know-how, we have evolved to provide scalable and comprehensive semiconductor solutions for automotive, industrial, infrastructure, and IoT industries based on the broadest product portfolio, including High Performance Computing, Embedded Processing, Analog & Connectivity, and Power.
 
With a diverse team of over 21,000 professionals in more than 30 countries, we continue to expand our boundaries to offer enhanced user experiences through digitalization and usher into a new era of innovation. We design and develop sustainable, power-efficient solutions today that help people and communities thrive tomorrow, ‘To Make Our Lives Easier.’     
 
At Renesas, you can: 

  • Launch and advance your career in technical and business roles across four Product Groups and various corporate functions. You will have the opportunities to explore our hardware and software capabilities and try new things.  
  • Make a real impact by developing innovative products and solutions to meet our global customers' evolving needs and help make people’s lives easier, safe and secure. 
  • Maximize your performance and wellbeing in our flexible and inclusive work environment. Our people-first culture and global support system, including the remote work option and Employee Resource Groups, will help you excel from the first day.    

Are you ready to own your success and make your mark?  

Join Renesas. Let’s Shape the Future together.  

Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.

Skills Required

  • Bachelor's or Master's degree in Electrical Engineering
  • 8+ years of experience in semiconductor packaging technology and product lifecycle management
  • Strong understanding of semiconductor packaging manufacturing flows
  • Proven ability to lead complex cross-functional programs
  • Strong stakeholder management and communication skills
  • Proficient in Microsoft Office and project management tools

Renesas Electronics Compensation & Benefits Highlights

The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Renesas Electronics and has not been reviewed or approved by Renesas Electronics.

  • Fair & Transparent Compensation Feedback suggests pay is generally fair-to-good across many roles, with base pay aligned to prevailing market levels in multiple U.S. locations. Engineering and leadership tracks can be competitive on total compensation, reinforcing a sense that pay can meet market expectations in key job families.
  • Healthcare Strength Feedback suggests core medical, dental, and vision coverage is solid and well-regarded by employees. Day-one eligibility in U.S. roles is described, supporting confidence in access and continuity of care.
  • Leave & Time Off Breadth Feedback suggests PTO, paid holidays, sick time, and parental leave provide a comprehensive time-off framework. Company initiatives like Renesas Day and meeting-light Focus Fridays further support time away and balance.

Renesas Electronics Insights

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The Company
HQ: Toyosu, Tokyo
10,040 Employees

What We Do

We're the world's leading semiconductor manufacturer. Our mission is to make our lives easier and a world that's safer, healthier, greener, and smarter.

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