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Job Description:Who We Are — Physical Design Team in APD
Broadcom’s ASIC Products Division (APD) is the global leader in custom high-performance silicon solutions. We partner with the world’s most innovative technology companies—spanning hyper-scale cloud providers, AI pioneers, and tier-1 networking infrastructure leaders—to co-design and manufacture complex, custom ASICs that power the modern digital backbone.
The Physical Design team within APD is the world-class execution engine behind the industry's most advanced custom silicon. We push the limits of silicon technology by combining deep architectural expertise, advanced IP, cutting edge physical design methodologies in 3nm/2nm nodes, and advanced 2.5D/3D chiplet integration to solve the most demanding compute and bandwidth challenges.We transform ultra-complex architectures into fully realized, high-yielding, first-pass silicon success.
Broadcom is searching for an Senior Physical Design Engineer to join the ASIC Products Division. This position involves working with the latest technology to continue driving next generation Artificial Intelligence and PCIe Switch Products. More specifically, this position will require in-depth knowledge and expertise in all Physical Design aspects of taking RTL to silicon tape-out.
Key Responsibilities
Full-Flow Implementation: Lead block-level and top-level implementation from floorplanning to GDSII stream-out using Cadence Innovus
Advanced Node Execution: Drive floorplanning, placement, CTS, routing, and timing/power optimization on advanced technology nodes (5nm, 3nm, 2nm) using multi-patterning and complex metal stacks.
Timing & Power Closure: Perform multi-corner multi-mode (MCMM) static timing analysis (STA), signal integrity (SI) optimization, and power grid optimization (static/dynamic IR-drop, EM) for signoff using PrimeTime, Voltus, or RedHawk.
Qualifications & Requirements
Education: B.S. or M.S. degree in Electrical Engineering, Computer Engineering, or a related technical field.
Experience: 8+ years of hands-on physical design experience successfully taping out complex high-frequency, ultra-large-scale networking or AI ASICs.
Deep Sub-Micron Expertise: Direct experience executing tapeouts in TSMC advanced nodes (N7, N5, N3) or equivalent foundry processes.
EDA Tool Mastery: High proficiency in major physical design tool flows:
P&R: Cadence Innovus
Timing/STA: Synopsys PrimeTime or Cadence Tempus
Extraction & IR/EM: StarRC / QRC, RedHawk
DRC/LVS: Siemens Calibre
Automation Skills: Advanced TCL, Python, and Unix shell scripting for flow automation and database manipulation.
Communication: Excellent technical leadership, problem-solving, and cross-functional communication skills.
Preferred Qualifications
Strong background in high-speed clock network implementation (H-tree, mesh, low-power CTS).
Experience with power-aware implementation flows (UPF/CPF, multi-voltage domains, clock/power gating).
Compensation and Benefits
The annual base salary range for this position is USD 121,900.00 To USD 195,000.00
As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.
Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.
Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.
If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.
Skills Required
- B.S. or M.S. degree in Electrical Engineering, Computer Engineering, or a related technical field
- 8+ years of hands-on physical design experience
- Successful tapeouts of complex high-frequency, ultra-large-scale networking or AI ASICs
- Direct tapeout experience in TSMC advanced nodes N7, N5, N3, or equivalent foundry processes
- High proficiency with Cadence Innovus for place and route
- High proficiency with Synopsys PrimeTime or Cadence Tempus for timing and static timing analysis
- Experience with StarRC or QRC for extraction and RedHawk for IR/EM analysis
- Experience with Siemens Calibre for DRC/LVS
- Advanced TCL, Python, and Unix shell scripting skills
- Excellent technical leadership, problem-solving, and cross-functional communication skills
- Strong background in high-speed clock network implementation, including H-tree, mesh, or low-power CTS
- Experience with power-aware implementation flows, including UPF/CPF, multi-voltage domains, and clock/power gating
Broadcom Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Broadcom and has not been reviewed or approved by Broadcom.
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Equity Value & Accessibility — Equity grants, including RSUs, stock refreshers, and an ESPP, are often described as top-tier and a primary driver of strong total compensation, especially for technical and senior roles. Once stock begins vesting, overall pay is commonly viewed as hard for other employers to match.
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Retirement Support — A 401(k) match of 100% up to 6% with immediate vesting is frequently highlighted as a standout benefit. This structure provides strong long-term savings support.
Broadcom Insights
What We Do
Broadcom Inc. (NASDAQ: AVGO) is a global technology leader that designs, develops and supplies semiconductor and infrastructure software solutions.
