Senior Manager, Product Engineering

Posted 5 Hours Ago
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Austin, TX, USA
Hybrid
Senior level
3D Printing
The Role
Leads the module product engineering organization for advanced semiconductor power modules from new product introduction through high-volume production and sustaining. Responsibilities include team staffing and development, product readiness standards, manufacturability, qualification, yield and cost improvement, production governance, cross-functional execution, manufacturing-site alignment, executive escalations, customer issues, and strategic planning. Requires deep semiconductor power-module expertise, technical leadership, data-driven decision-making, and strong executive communication.
Summary Generated by Built In
Company Description

Renesas Electronics, a leading global semiconductor company, is rapidly scaling its AI-focused power delivery business. Products include high-performance digital power VRMs, multiphase controllers, Smart Power Stages (SPS), Vertical Power Stages (SPS with integrated capacitors and multiple silicon die), Power Towers (power modules integrating multiple SPS-equivalents with capacitors and inductors), and power MOSFETs. 

 

Job Description

Responsibilities

  • Lead the Module Product Engineering function for advanced power modules from NPI through high-volume production and sustaining
  • Manage, develop, and provision qualified Product Engineers and Embedded PE Leads to product delivery teams based on program needs, technical complexity, and schedule risk
  • Own workforce planning, hiring, onboarding, skill development, succession planning, and performance management for the module PE team
  • Define and maintain module PE standards for product readiness, manufacturability, characterization, qualification execution, yield analysis, product change management, and sustaining ownership
  • Establish governance for module-level decisions that affect quality, cost, yield, capacity, customer commitments, qualification strategy, and production release readiness
  • Drive cross-functional alignment across Design, Test, Quality, Manufacturing, Operations, Supply Chain, Applications, and Product Management to enable scalable module execution
  • Ensure robust module manufacturability across OSAT and internal manufacturing sites, including assembly workmanship standards, IPC-A-610 expectations, die attach, clip attach, solder integrity, and module-level defect prevention
  • Lead executive-level escalation and decision-making for major module yield excursions, qualification issues, production holds, customer returns, and corrective actions
  • Translate product delivery team needs into staffing, capability, tooling, data, and process requirements for the broader platform and functional organizations
  • Drive data-driven improvements in cost, yield, cycle time, traceability, qualification readiness, and high-volume production robustness
  • Represent module PE in senior leadership reviews, customer escalations, NPI gate reviews, capacity discussions, and strategic planning forums

Qualifications

Experience & Skills: 

  • 10+ years of experience in semiconductor product engineering, manufacturing engineering, test engineering, quality, or related technical leadership roles, including 5+ years of experience managing engineers or technical teams
  • Demonstrated ability to lead experienced professionals and subordinate technical leaders across multiple related product engineering workstreams
  • Strong technical depth in semiconductor power products, advanced power modules, module assembly, qualification, high-volume manufacturing, yield, and sustaining execution
  • Proven ability to establish operating objectives, policies, procedures, work plans, execution metrics, and governance mechanisms for a technical organization
  • Strong data analysis and decision-making skills with the ability to interpret statistical results, product risk, manufacturing capability, and customer impact
  • Experience driving cross-functional execution across Design, Test, Quality, Manufacturing, Operations, Supply Chain, Applications, Product Management, and customer-facing teams
  • Ability to influence lower and senior management on matters involving several functional areas, sensitive tradeoffs, and high-impact customer or production decisions
  • Excellent written, verbal, and executive communication skills with the ability to present clear status, risks, decisions needed, and recommended actions
  • Education: 
  • Bachelor's degree required in Electrical Engineering, Mechanical Engineering, Materials Engineering, Computer Engineering, or a related technical field; Master’s degree in a relevant engineering discipline or business discipline preferred.

Additional Information

Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.

At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.

We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.

Are you ready to join our team and shape the future with us?

Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.

Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.

Skills Required

  • 10+ years of experience in semiconductor product engineering, manufacturing engineering, test engineering, quality, or related technical leadership roles
  • 5+ years of experience managing engineers or technical teams
  • Experience leading experienced professionals and subordinate technical leaders across multiple product engineering workstreams
  • Strong technical depth in semiconductor power products, advanced power modules, module assembly, qualification, high-volume manufacturing, yield, and sustaining execution
  • Experience establishing operating objectives, policies, procedures, work plans, execution metrics, and governance mechanisms for a technical organization
  • Strong data analysis and decision-making skills involving statistical results, product risk, manufacturing capability, and customer impact
  • Experience driving cross-functional execution across Design, Test, Quality, Manufacturing, Operations, Supply Chain, Applications, Product Management, and customer-facing teams
  • Ability to influence lower and senior management on sensitive tradeoffs and high-impact customer or production decisions
  • Excellent written, verbal, and executive communication skills
  • Bachelor's degree in Electrical Engineering, Mechanical Engineering, Materials Engineering, Computer Engineering, or a related technical field
  • Master's degree in a relevant engineering or business discipline

Renesas Electronics Compensation & Benefits Highlights

The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Renesas Electronics and has not been reviewed or approved by Renesas Electronics.

  • Fair & Transparent Compensation Feedback suggests pay is generally fair-to-good across many roles, with base pay aligned to prevailing market levels in multiple U.S. locations. Engineering and leadership tracks can be competitive on total compensation, reinforcing a sense that pay can meet market expectations in key job families.
  • Healthcare Strength Feedback suggests core medical, dental, and vision coverage is solid and well-regarded by employees. Day-one eligibility in U.S. roles is described, supporting confidence in access and continuity of care.
  • Leave & Time Off Breadth Feedback suggests PTO, paid holidays, sick time, and parental leave provide a comprehensive time-off framework. Company initiatives like Renesas Day and meeting-light Focus Fridays further support time away and balance.

Renesas Electronics Insights

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The Company
HQ: Tokyo
10,040 Employees

What We Do

We're the world's leading semiconductor manufacturer. Our mission is to make our lives easier and a world that's safer, healthier, greener, and smarter.

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