Senior Failure Analysis Engineer

Posted 7 Days Ago
Be an Early Applicant
Santa Clara, CA, USA
In-Office
144K-230K Annually
Senior level
Artificial Intelligence • Computer Vision • Hardware • Robotics • Metaverse
The Role
Lead and execute physical failure analysis on advanced ICs and packaging. Develop novel FA methodologies, perform precision sample prep (cross-sections, de-layering, FIB), apply SEM/TEM/optical microscopy, drive root-cause investigations, and deliver characterization data to support design, process, and reliability improvements.
Summary Generated by Built In

NVIDIA is the pioneer of GPU-accelerated computing and the engine powering the global AI revolution. We build the full-stack AI infrastructure, advanced microelectronics, and hardware ecosystems that drive everything from massive data center AI factories to autonomous vehicles, robotics, and advanced scientific simulation. Physical Failure Analysis team is relentlessly committed to quality, pushing the boundaries of semiconductor innovation and hardware reliability.

We are seeking a highly skilled and motivated Failure Analysis Engineer to join our world-class Failure Analysis Lab. In this role, you won’t just solve problems—you will work at the dynamic intersection of physics, process technology, physical design, and circuit design to investigate complex product failures and drive critical engineering solutions. The Mission: Perform Physical Failure Analysis (PFA) on some of the world’s most advanced integrated circuits, deep learning processors, and system architectures, uncovering root causes that directly shape the future of computing. We are looking for an adaptable technical expert capable of translating open-ended challenges into actionable insights. If you excel in fast-paced environments and want to help build the infrastructure defining the modern era, we encourage you to apply.

What You’ll Be Doing:

Develop Advanced FA Techniques & Methodologies

  • Pioneer Novel Methods: Design and implement cutting-edge methodologies to drive successful root-cause investigations on leading-edge silicon, advanced heterogeneous packaging technologies, and complex integrated systems.

  • Precision De-processing: Perform mechanical cross-sectioning, parallel de-layering, and advanced chemical/plasma de-processing of integrated circuit (IC) devices across die, package, component, and board levels.

  • Nanoscale Analysis: Apply advanced Focused Ion Beam (FIB) sample preparation and analysis techniques to enable high-resolution electrical and physical diagnostics of IC chips.

  • Innovate Characterization Platforms: Develop novel characterization techniques and specialized analysis platforms tailored for emerging chip structures with advanced silicon architectures and complex packaging schemes.

  • Optimize Workflows: Design and implement robust failure analysis (FA) workflows to improve laboratory efficiency and guarantee accurate, reproducible root-cause determination.

Conduct In-Depth FA Investigations

  • Lead Root-Cause Investigations: Head high-impact failure analysis investigations to isolate the root causes of critical failures affecting product yield, performance, and long-term reliability.

  • Support multi-functional Engineering: Deliver precise physical characterization data to support engineering teams with Design of Experiments (DOE) evaluations, design optimization, process node improvements, and critical customer FA requests.

What We Need to See:

  • Domain Expertise: Deep understanding of semiconductor IC fabrication, advanced packaging/assembly processes, and advanced failure analysis methodologies.

  • Sample Preparation: Proven proficiency in precision IC device sample preparation for targeted defect localization and physical root-cause analysis.

  • Microscopy & Inspection: Hands-on expertise with advanced Optical and Electron microscopy (SEM/TEM), alongside related analytical inspection techniques.

  • System-Level Analysis: Strong working knowledge of physical and electrical failure analysis across die, package, component, and board levels.

  • Education & Experience: A B.S., M.S., or Ph.D. in Electrical Engineering, Materials Science, Physics, or closely related field (or equivalent experience),
    paired with 8+ years of relevant, hands-on industry experience.

With competitive salaries and a generous benefits package, NVIDIA is widely considered to be one of the technology world’s most desirable employers. We have some of the most hard-working and dedicated people in the world working for us and, due to unprecedented growth, our best-in-class engineering teams are rapidly growing. If you're a creative and autonomous engineer with a real passion for technology, we want to hear from you.

Your base salary will be determined based on your location, experience, and the pay of employees in similar positions. The base salary range is 144,000 USD - 230,000 USD.

You will also be eligible for equity and benefits.

Applications for this job will be accepted at least until July 24, 2026.

This posting is for an existing vacancy. 

NVIDIA uses AI tools in its recruiting processes.

NVIDIA is committed to fostering an inclusive work environment and proud to be an equal opportunity employer. As we highly value diversity in our current and future employees, we do not discriminate (including in our hiring and promotion practices) on the basis of race, religion, color, national origin, gender, gender expression, sexual orientation, age, marital status, veteran status, disability status or any other characteristic protected by law.

Skills Required

  • B.S., M.S., or Ph.D. in Electrical Engineering, Materials Science, Physics, or related field (or equivalent experience) with 8+ years industry experience.
  • Deep understanding of semiconductor IC fabrication and advanced packaging/assembly processes.
  • Proven proficiency in precision IC sample preparation including mechanical cross-sectioning and de-layering.
  • Hands-on expertise with Focused Ion Beam (FIB) sample preparation and analysis.
  • Experience with advanced microscopy and inspection techniques (SEM, TEM, optical microscopy).
  • Experience conducting physical and electrical failure analysis across die, package, component, and board levels.
  • Ability to design and support Design of Experiments (DOE) and provide actionable engineering characterization data.

NVIDIA Compensation & Benefits Highlights

The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about NVIDIA and has not been reviewed or approved by NVIDIA.

  • Equity Value & Accessibility Equity awards and a discounted ESPP are highlighted as core parts of total compensation, enabling employees to share in the company’s success. Stock-based compensation and the two-year lookback ESPP are consistently described as especially valuable.
  • Healthcare Strength Health coverage is portrayed as robust, with comprehensive medical, dental, and vision options alongside mental health support and on-site care resources. Employer HSA contributions and wellness perks reinforce the depth of the offering.
  • Retirement Support Retirement programs are depicted as strong, featuring a meaningful 401(k) match with Roth options and support for Mega Backdoor Roth contributions. These elements position long-term savings as a notable advantage of the total rewards package.

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The Company
HQ: Santa Clara, CA
21,960 Employees
Year Founded: 1993

What We Do

NVIDIA’s invention of the GPU in 1999 sparked the growth of the PC gaming market, redefined modern computer graphics, and revolutionized parallel computing. More recently, GPU deep learning ignited modern AI — the next era of computing — with the GPU acting as the brain of computers, robots, and self-driving cars that can perceive and understand the world. Today, NVIDIA is increasingly known as “the AI computing company.”

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