Key Responsibilities
- Lead and coordinate major equipment restoration, repair, and recovery activities for Die Bond, Wire Bond, and Buffer process equipment.
- Drive equipment reliability and uptime improvement initiatives to support manufacturing output and quality objectives.
- Perform root cause analysis (RCA) on chronic equipment issues and implement sustainable corrective and preventive actions.
- Develop and optimize preventive and predictive maintenance programs for production equipment.
- Plan and manage major equipment overhauls, refurbishment, upgrades, and spare parts strategies.
- Provide advanced troubleshooting support for equipment-related issues in Die Bond, Wire Bond, and Buffer operations.
- Drive continuous improvement projects focused on equipment performance, productivity, quality, and cost reduction.
- Collaborate with Production, Process Engineering, Manufacturing, Quality, and Maintenance teams to achieve operational excellence.
- Lead technician skill enhancement programs through structured training, coaching, troubleshooting guidance, and knowledge-sharing initiatives.
- Establish technical competency development plans for floor technicians to strengthen troubleshooting and maintenance capabilities.
- Work closely with equipment vendors and suppliers on technical support, modifications, upgrades, and improvement projects.
- Ensure compliance with safety, quality, and operational standards during all maintenance and engineering activities.
- Monitor and analyze equipment performance indicators and recommend improvement actions.
RequirementsEducation
- Bachelor's Degree in Electrical Engineering, Electronics Engineering, Mechanical Engineering, Mechatronics Engineering, Manufacturing Engineering, or a related field.
- Minimum 5-8 years of experience in semiconductor manufacturing, equipment engineering, or maintenance engineering.
- Hands-on experience supporting Die Bond, Wire Bond, and Buffer processes is highly preferred.
- Proven experience in equipment restoration, major breakdown recovery, equipment troubleshooting, and maintenance management.
- Experience in leading technicians and driving cross-functional improvement initiatives.
- Strong knowledge of semiconductor assembly equipment and manufacturing processes.
- Expertise in equipment restoration, troubleshooting, and failure analysis.
- Strong understanding of Die Bond, Wire Bond, and Buffer equipment operations.
- Knowledge of TPM, preventive maintenance, predictive maintenance, and reliability engineering principles.
- Familiarity with RCA, FMEA, SPC, DOE, and continuous improvement methodologies.
- Strong project management and technical leadership capabilities.
Key Focus Areas
- Equipment restoration and major down repair management.
- Die Bond, Wire Bond, and Buffer equipment support.
- Equipment reliability and uptime improvement.
- Technician competency development and skill enhancement.
- Manufacturing productivity and operational excellence.
- Continuous improvement and cost optimization.
Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright © material and the word Nexperia® is a registered trademark.
D&I Statement
As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.
In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.
Skills Required
- Bachelor's degree in Electrical Engineering, Electronics Engineering, Mechanical Engineering, Mechatronics Engineering, Manufacturing Engineering, or a related field.
- 5-8 years of experience in semiconductor manufacturing, equipment engineering, or maintenance engineering.
- Hands-on experience supporting Die Bond, Wire Bond, and Buffer processes.
- Experience in equipment restoration, major breakdown recovery, equipment troubleshooting, and maintenance management.
- Experience leading technicians and driving cross-functional improvement initiatives.
- Strong knowledge of semiconductor assembly equipment and manufacturing processes.
- Expertise in equipment restoration, troubleshooting, and failure analysis.
- Strong understanding of Die Bond, Wire Bond, and Buffer equipment operations.
- Knowledge of TPM, preventive maintenance, predictive maintenance, and reliability engineering principles.
- Familiarity with RCA, FMEA, SPC, DOE, and continuous improvement methodologies.
- Strong project management and technical leadership capabilities.
What We Do
Headquartered in the Netherlands, Nexperia is a global semiconductor company with a rich European history and over 15,000 employees across Europe, Asia, and the United States. As a leading expert in the development and production of essential semiconductors, Nexperia’s components enable the basic functionality of virtually every electronic design in the world – from automotive and industrial to mobile and consumer applications. The company serves a global customer base, shipping more than 100 billion products annually. These products are recognized as benchmarks in efficiency – in process, size, power and performance. Nexperia's commitment to innovation, efficiency, sustainability, and stringent industry requirements are evident in its extensive IP portfolio, its expanding product range and its certification to IATF 16949, ISO 9001, ISO 14001 and ISO 45001 standards. For questions or more information about our career opportunities: [email protected] Connect with us today and become a part of TeamNexperia! Nexperia - Efficiency Wins.
