Senior Engineer - SiC Technologist

Posted 4 Days Ago
Be an Early Applicant
Pune, Mahārāshtra, IND
In-Office
Senior level
Hardware
The Role
Lead development, characterization, qualification, and improvement of SiC power devices. Plan and execute electrical and reliability tests, analyze wafer/package/application data, perform root-cause and statistical analysis, drive DOE and technology transfers, build automated data workflows and dashboards, prepare technical reports, and mentor junior engineers to advance SiC device platforms and qualification readiness.
Summary Generated by Built In

Navitas Semiconductor is seeking a highly motivated Senior Engineer – SiC Technologist to join the India Center of Excellence and support the development, characterization, qualification, and continuous improvement of GeneSiC™ silicon carbide power semiconductor technologies. This role will contribute to next-generation SiC device platforms, including MOSFETs, diodes, known-good-die, discretes, and power module technologies for high-voltage, high-efficiency applications across AI data centers, energy and grid infrastructure, industrial electrification, renewable energy, EV charging, and high-performance power conversion markets.

Key Responsibilities
  • Support SiC technology development activities across device design, process integration, characterization, reliability, and product qualification.
  • Develop and execute electrical characterization plans for SiC power devices, including breakdown voltage, leakage, threshold voltage, on-resistance, transfer/output characteristics, capacitance, gate charge, switching losses, avalanche robustness, and short-circuit behavior.
  • Analyze wafer-level, package-level, and application-level data to identify performance trends, process sensitivities, yield limiters, and reliability risks.
  • Collaborate with global device engineering, process integration, product engineering, packaging, test, reliability, quality, and applications teams to drive technology improvements.
  • Support accelerated reliability testing and robustness assessments such as HTRB, HTGB, H3TRB/THB, temperature cycling, power cycling, TDDB, HTOL, dynamic stress testing, avalanche/UIS, and short-circuit ruggedness.
  • Perform root-cause analysis for device performance or reliability issues using electrical data, statistical analysis, failure analysis inputs, and process history.
  • Contribute to design-of-experiments planning, split-lot analysis, process change evaluation, and technology transfer activities.
  • Develop automated data analysis workflows and characterization dashboards using tools such as Python, JMP, Excel, MATLAB, or equivalent platforms.
  • Prepare clear technical reports, qualification summaries, review presentations, and engineering recommendations for internal stakeholders.
  • Mentor junior engineers and help build SiC technology expertise within the India Center of Excellence.
QualificationsRequired Qualifications
  • Bachelor’s or Master’s degree in Electrical Engineering, Electronics Engineering, Materials Science, Physics, Microelectronics, Semiconductor Technology, or a related discipline.
  • 4–8 years of relevant experience in semiconductor device engineering, power device characterization, reliability, test, product engineering, process integration, or technology development.
  • Strong understanding of SiC power device physics, including MOSFETs, JFETs, Schottky diodes, PiN diodes, gate oxide behavior, body diode behavior, and high-voltage device operation.
  • Hands-on experience with semiconductor characterization equipment such as curve tracers, high-voltage SMUs, parametric analyzers, oscilloscopes, double-pulse testers, thermal chambers, probe stations, or reliability stress systems.
  • Experience analyzing device performance over voltage, current, temperature, switching, and stress conditions.
  • Working knowledge of reliability mechanisms in wide-bandgap power devices, including gate oxide degradation, threshold voltage instability, leakage drift, dynamic RDS(on), bipolar degradation, trapping effects, and package-related thermo-mechanical stress.
  • Ability to interpret statistical data, identify trends, communicate technical conclusions, and recommend corrective actions.
  • Strong written and verbal communication skills, with the ability to collaborate across global, cross-functional teams.
Preferred Qualifications
  • Master’s degree or Ph.D. with specialization in power semiconductor devices, SiC technology, semiconductor reliability, or power electronics.
  • Experience with 650 V, 750 V, 1200 V, 1700 V, or higher-voltage SiC MOSFET and diode technologies.
  • Familiarity with automotive, industrial, or renewable-energy qualification standards and customer requirements.
  • Experience with TCAD, SPICE, electrothermal simulation, device modeling, or mission-profile-based reliability assessment.
  • Exposure to wafer fabrication, epitaxy, implantation, oxidation, metallization, passivation, wafer thinning, assembly, or power module integration.
  • Experience working with external foundries, OSATs, failure analysis labs, universities, or global technology partners.
  • Demonstrated ability to publish technical work, file patents, or present in technical reviews, conferences, or customer-facing forums.
Key Skills and Competencies
  • Deep technical curiosity and strong problem-solving discipline.
  • Data-driven decision-making with strong statistical and analytical capability.
  • Ability to connect device physics, process behavior, package effects, and application-level performance.
  • Comfort working in ambiguous technology-development environments with evolving priorities.
  • Strong collaboration across time zones with global engineering and business stakeholders.
  • Clear communication of complex technical information to engineering, program, quality, and leadership audiences.
  • Ownership mindset with the ability to independently drive experiments, analysis, reviews, and closure of technical issues.
Success Measures
  • Timely execution of characterization, reliability, and technology-development deliverables.
  • High-quality technical analysis that enables clear decisions on device performance, robustness, yield, and qualification readiness.
  • Effective collaboration with global teams to resolve technology issues and accelerate project milestones.
  • Measurable contribution to SiC technology capability building within the India Center of Excellence.
  • Improved efficiency through reusable test methods, analysis templates, dashboards, or documented best practices.
Reporting and Collaboration

The role will report into the SiC Technology / Device Engineering leadership team and will work closely with global stakeholders in technology development, product engineering, reliability, quality, applications, packaging, test engineering, and manufacturing operations.

Skills Required

  • Bachelor's or Master's degree in Electrical Engineering, Electronics Engineering, Materials Science, Physics, Microelectronics, Semiconductor Technology, or related discipline.
  • 4-8 years of relevant experience in semiconductor device engineering, power device characterization, reliability, test, product engineering, process integration, or technology development.
  • Strong understanding of SiC power device physics, including MOSFETs, JFETs, Schottky diodes, PiN diodes, gate oxide behavior, body diode behavior, and high-voltage device operation.
  • Hands-on experience with semiconductor characterization equipment such as curve tracers, high-voltage SMUs, parametric analyzers, oscilloscopes, double-pulse testers, thermal chambers, probe stations, or reliability stress systems.
  • Experience analyzing device performance over voltage, current, temperature, switching, and stress conditions.
  • Working knowledge of reliability mechanisms in wide-bandgap power devices (gate oxide degradation, threshold instability, leakage drift, dynamic RDS(on), bipolar degradation, trapping effects, package thermo-mechanical stress).
  • Ability to interpret statistical data, identify trends, communicate technical conclusions, and recommend corrective actions.
  • Strong written and verbal communication skills and ability to collaborate across global, cross-functional teams.
  • Master's degree or Ph.D. with specialization in power semiconductor devices, SiC technology, semiconductor reliability, or power electronics.
  • Experience with 650 V, 750 V, 1200 V, 1700 V, or higher-voltage SiC MOSFET and diode technologies.
  • Familiarity with automotive, industrial, or renewable-energy qualification standards and customer requirements.
  • Experience with TCAD, SPICE, electrothermal simulation, device modeling, or mission-profile-based reliability assessment.
  • Exposure to wafer fabrication (epitaxy, implantation, oxidation, metallization, passivation, wafer thinning), assembly, or power module integration.
  • Experience working with external foundries, OSATs, failure analysis labs, universities, or global technology partners.
  • Demonstrated ability to publish technical work, file patents, or present in technical reviews, conferences, or customer-facing forums.
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