SENIOR ENGINEER FRONT END(FE) CENTRAL PROCESS INTEGRATION ENGINEERING (CPIE) PI

Reposted Yesterday
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Singapore, SGP
In-Office
Senior level
Artificial Intelligence • Hardware • Information Technology • Machine Learning
Your talent powers our future.
The Role
Leads global semiconductor packaging product yield, quality improvement, process integration, and new product introduction initiatives. Drives PI Loop taskforces, process-flow optimization, business-process standardization, benchmarking, and cross-functional project execution across fabs and engineering teams. Applies semiconductor expertise, AI-enabled engineering tools, advanced analytics, and digital transformation to accelerate problem solving, improve decision-making, and increase productivity. Requires regular collaboration, presentations, and travel to Micron fab locations.
Summary Generated by Built In
Our vision is to transform how the world uses information to enrich life for all.
Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.
As FE CPIE CPI PI Senior Engineer at Micron Technology, Inc., you will be responsible for working with global Micron network to drive each silicon node's Packaging Product yield, quality improvement, new product introduction (NPI) through technical expertise, business process management and project execution.
In addition, you will be responsible in integrating solutions by connecting cross-functional expertise, standardizing the business process and regularly benchmarking internal and external intelligence to achieve the highest value bits and productivity.
In addition, you will leverage AI-enabled engineering approaches, advanced analytics, and digital tools to accelerate problem solving, improve productivity, enhance decision quality, and drive continuous innovation across product yield, quality, and business processes.
Responsibilities and Tasks
  • Promote worldwide synergy for improved benchmark performance and efficiency gains through global project management and execution, network BKM leveraging and enhancement, and business process creation and re-engineering.
  • Define strategies to ensure that Packaging Technology and interaction with Front End manufacturing process are fully developed and qualified well ahead of any qualification of the product itself.
  • Lead the PI Loop taskforce and/or team in network to address yield and quality challenges, optimize process flow in a timely manner to achieve BIC yield performance.
  • Maintain and enhance domain knowledge and technical expertise, explore innovation opportunities with strategic thinking and systematic approach.
  • Maintain a strong and open relationship with peer group and managers in other functional areas within central team and outside in areas such as Fab, TD, Product Engineering, GQ. Communicate and respond to issues in a timely manner. Help drive to fix the issue where necessary.
  • Demonstrate ability to give effective presentations to both small and large groups on project updates and new initiative proposals.
  • Periodically follow up with manager to ensure all type of goals are met and get assistance to remove obstacles.
  • Travel to Micron Fab locations as necessary for face-to-face work.
  • Drive AI and digital transformation initiatives by leveraging AI-powered tools, data analytics, automation solutions, and intelligent workflows to improve engineering efficiency, accelerate root cause analysis, enhance decision-making, and increase organizational productivity.

Requirements
  • Bachelor's or Master's degree in Electrical Engineering, Microelectronics, Physics, Chemistry, Material Science Engineering or related field .
  • 5 years relevant experience in Semiconductor Device Physics, DRAM operations, wafer fabrication process flows, parametric/electrical test and probe yield.
  • 3 years relevant experience on DRAM High Performance Memory(HPM), BEOL integration, advanced packaging and layout.
  • Good data analysis, troubleshoot, problem solving, reporting and presentation skills with a strong attention to detail in Semiconductor Industry.
  • Good multi-tasking, verbal, and written communication skills.
  • Strong interpersonal skills and customer/co-worker relationships. Successfully demonstrated teamwork skills with a strong focus on developing good team dynamics.
  • Good organizational capabilities and ability to work effectively with minimal supervision.
  • Intermediate to advanced proficiency in Microsoft Office, AI-enabled productivity tools (e.g., Microsoft Copilot), and digital collaboration platforms.
  • Ability to be flexible with job responsibilities and take the initiative to assume added responsibilities.
  • Travel Required: Yes. Willing to travel as needed to support department goals
  • Travel Frequency: 20-50%.
  • Experience or strong aptitude in utilizing AI, data analytics, and digital technologies to enhance engineering decision-making, operational efficiency, and cross-functional collaboration.

About Micron Technology, Inc.
We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities - from the data center to the intelligent edge and across the client and mobile user experience.
To learn more, please visit micron.com/careers
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.
To request assistance with the application process and/or for reasonable accommodations, please contact [email protected]
Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.
Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.

Skills Required

  • Bachelor's or Master's degree in Electrical Engineering, Microelectronics, Physics, Chemistry, Materials Science Engineering, or a related field
  • At least 5 years of relevant experience in semiconductor device physics, DRAM operations, wafer fabrication process flows, parametric or electrical testing, and probe yield
  • At least 3 years of relevant experience with DRAM High Performance Memory, BEOL integration, advanced packaging, and layout
  • Data analysis, troubleshooting, problem-solving, reporting, and presentation skills in the semiconductor industry
  • Strong verbal and written communication skills and attention to detail
  • Strong interpersonal, teamwork, and relationship-building skills
  • Ability to work effectively with minimal supervision and manage multiple tasks
  • Intermediate to advanced proficiency with Microsoft Office, AI-enabled productivity tools, and digital collaboration platforms
  • Ability to be flexible, take initiative, and assume additional responsibilities
  • Willingness to travel as needed, with travel frequency of 20% to 50%
  • Experience or strong aptitude using AI, data analytics, and digital technologies for engineering decision-making and collaboration
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The Company
HQ: Boise, ID
45,000 Employees
Year Founded: 1978

What We Do

We are a world leader in innovative memory solutions that transform how the world uses information to enrich life for all. For over 45 years, our company has been instrumental to the world’s most significant technology advancements, delivering optimal memory and storage systems for a broad range of applications.

Why Work With Us

Global opportunities, team member development, and career advancement—Micron invests in you and celebrates your skills, a growth mindset, and the tenacity to strive. At Micron, everyone innovates.

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Micron Technology Offices

Hybrid Workspace

Employees engage in a combination of remote and on-site work.

Micron recognizes the importance of maintaining a healthy work-life balance to foster a culture of collaboration, innovation and meet the needs of the business. In alignment with these values, we offer four flexible work arrangement options

Typical time on-site: Flexible
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